IP Library › Granted Patent US 10,631,435
Granted Patent B2
US 10,631,435 · App. 15/336,758 · Granted Apr 21, 2020

Heat dissipation assembly

Inventors: Wei-Fang Wu (Taoyuan, TW); Li-Kuang Tan (Taoyuan, TW)
Assignee: DELTA ELECTRONICS, INC.
H05K7/20336F28D15/025F28D15/0266F28D15/04H05K7/20309H05K7/20318H05K7/20409
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Quick Facts
Patent No.
US 10,631,435
App. No.
15/336,758
Granted
Apr 21, 2020
Kind
B2
Abstract

A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

Claims (21)

1. A heat dissipation assembly, comprising:

a condenser having a condensing chamber, a first oblique surface and a second oblique surface therein, wherein the first oblique surface is between a sidewall of the condensing chamber and the second oblique surface, and a length of the first oblique surface is shorter than a length of the second oblique surface;

an evaporator;

a vapor conduit, wherein a first end of the vapor conduit is connected to the condenser, and a second end of the vapor conduit is connected to the evaporator; and

a liquid conduit, wherein a first end of the liquid conduit is connected to the condenser, and a second end of the liquid conduit is connected to the evaporator,

wherein a geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber, and the second oblique surface is located between the first end of the vapor conduit in the condensing chamber and the first end of the liquid conduit in the condensing chamber, the first end of the liquid conduit in the condensing chamber is on the second oblique surface, and a distance between the sidewall of the condensing chamber and a connection position of the first oblique surface and the second oblique surface is smaller than a distance between the sidewall of the condensing chamber and a center point of the first end of the liquid conduit in the condensing chamber.

2. The heat dissipation assembly of claim 1 , wherein the evaporator has an evaporating chamber, and a geometric center of the liquid conduit in the evaporating chamber is lower than or equal to a geometric center of the evaporating chamber.

3. The heat dissipation assembly of claim 2 , wherein the evaporating chamber has a first portion and a second portion that communicates with the first portion, and the first portion is located at an edge of the second portion.

4. The heat dissipation assembly of claim 2 , wherein the liquid conduit has a water outlet in the evaporating chamber, and the evaporator comprises:

a liquid working fluid, wherein the water outlet of the liquid conduit is lower than a liquid level of the liquid working fluid.

5. The heat dissipation assembly of claim 4 , wherein the water outlet of the liquid conduit rotates along an axis of the liquid conduit.

6. The heat dissipation assembly of claim 5 , wherein the water outlet rotates from a horizontal direction to an upward vertical direction in a rotation direction.

7. The heat dissipation assembly of claim 1 , wherein the first oblique surface and the second oblique surface are located in a bottom portion of the condensing chamber.

8. The heat dissipation assembly of claim 1 , wherein the first end of the liquid conduit in the condensing chamber is adjacent to the connection position of the first oblique surface and the second oblique surface.

9. The heat dissipation assembly of claim 1 , wherein an included angle is included between the first oblique surface and the second oblique surface, and is in a range from 60 degrees to 179 degrees.

10. The heat dissipation assembly of claim 1 , wherein the liquid conduit is obliquely connected to the condenser and the evaporator.

11. The heat dissipation assembly of claim 10 , wherein the first end of the liquid conduit connected to the condenser is higher than or equal to the second end of the liquid conduit connected to the evaporator.

12. The heat dissipation assembly of claim 10 , wherein an included angle is included between the liquid conduit and the evaporator, and is in a range from 0 degree to 60 degrees.

13. The heat dissipation assembly of claim 1 , wherein the condenser further comprises:

a plurality of capillary structures located on a surface of the condenser facing the condensing chamber.

14. The heat dissipation assembly of claim 1 , wherein the condenser or the evaporator has heat dissipation fins.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2016
From: WU, WEI-FANG; TAN, LI-KUANG
To: DELTA ELECTRONICS, INC.
Reel/Frame 040168/0687 →
Priority Claims (1)
CN 2016 1 0714849 · Aug 24, 2016 · national
Continuity (1)
Related Publication 20180063994A1 · Mar 1, 2018