Integrated circuit device, electronic device, electronic apparatus, and base station
An integrated circuit device includes a substrate, a joining part provided on the substrate and joined to a vibrator, and a plurality of bonding pads provided on the substrate. The joining part includes an insulating protective film that covers a part of a surface of the substrate, and no insulating protective film is provided between the adjacent bonding pads.
1. An integrated circuit device comprising:
a substrate including a plurality of electrodes;
a joining part provided on the substrate and joined to a vibrator; and
a plurality of bonding pads provided on the substrate, each of the plurality of bonding pads being directly connected to a respective electrode of the plurality of electrodes,
wherein the joining part comprises an insulating protective film that covers a part of a surface of the substrate, and
no insulating protective film is provided between the adjacent bonding pads, such that a first gap is formed between each adjacent bonding pad where no insulating film provided, a second gap is formed between each adjacent electrode, and the first gap at least partially coincides with the second gap.
2. The integrated circuit device according to claim 1 , further comprising:
a heat generator that generates heat; and
a temperature detector that detects an ambient temperature.
3. An electronic device comprising:
a vibrator;
a substrate including a plurality of electrodes;
a joining part provided on the substrate and joined to the vibrator; and
a plurality of bonding pads provided on the substrate, each of the plurality of bonding pads being directly connected to a respective electrode of the plurality of electrodes,
wherein the joining part comprises an insulating protective film that covers a part of a surface of the substrate, and
no insulating protective film is provided between the adjacent bonding pads, such that a first gap is formed between each adjacent bonding pad where no insulating film provided, a second gap is formed between each adjacent electrode, and the first gap at least partially coincides with the second gap.
4. The electronic device according to claim 3 , wherein the joining part comprises:
a plurality of bump members; and
a conductive joining material at least partially surrounded by the plurality of bump members and joins the vibrator and the substrate.
5. The electronic device according to claim 4 , wherein the plurality of bump members are provided separately from each other.
6. The electronic device according to claim 4 , wherein the plurality of bump members are arranged in an arc form.
7. The electronic device according to claim 3 , wherein the joining part includes a conducting pattern electrically connected to the vibrator, and the conducting pattern includes: a joining electrode having an oval shape and joined to the vibrator; and a lead electrode electrically connected to at least part of the plurality of bonding pads.
8. The electronic device according to claim 3 , further comprising an oscillation circuit that controls vibration of the vibrator.
9. An electronic apparatus comprising the integrated circuit device according to claim 1 .
10. A base station comprising the integrated circuit device according to claim 1 .