IP Library Granted Patent US 10,478,859
Granted Patent B2
US 10,478,859 · App. 15/345,479 · Granted Nov 19, 2019

High frequency ultrasonic transducer and matching layer comprising cyanoacrylate

Inventors: Nicholas Christopher Chaggares (Whitby, CA); James Mehi (Thornhill, CA); Desmond Hirson (Thornhill, CA)
Assignee: FUJIFILM SonoSite, Inc.
B06B3/00B06B1/06B06B1/067B32B7/12G10K9/122G10K11/02G10K11/30H01L41/083A61B8/4209Y10T156/10Y10T428/31855
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Quick Facts
Patent No.
US 10,478,859
App. No.
15/345,479
Granted
Nov 19, 2019
Kind
B2
Abstract

In one aspect, matching layers for an ultrasonic transducer stack having a matching layer comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In another aspect, the matrix material is loaded with a plurality of heavy and light particles. In another aspect, an ultrasound transducer stack comprises a piezoelectric layer and at least one matching layer. In one aspect, the matching layer comprises a composite material comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In a further aspect, the composite material can also comprise a matrix material loaded with a plurality of heavy and light particles. In a further aspect, a matching layer can also comprise cyanoacrylate.

Claims (19)

1. An ultrasonic transducer stack, comprising:

a plurality of layers comprising:

a piezoelectric layer;

at least one matching layer that comprises a first matching layer, which comprises cyanoacrylate; and

a lens layer comprising TPX,

wherein each layer of the plurality of layers has a top surface and an opposed bottom surface, wherein the first matching layer is connected to and underlies the bottom surface of the lens layer, and wherein the piezoelectric layer underlies the bottom surface of the matching layer.

2. The ultrasonic transducer stack of claim 1 , wherein the first matching layer is about a ¼ acoustic wavelength matching layer.

3. The ultrasonic transducer stack of claim 2 , wherein the acoustic impedance of the first matching layer is between about 2.0 MegaRayles (MR) to about 3.5 MegaRayles (MR).

4. The ultrasonic transducer stack of claim 2 , wherein the acoustic impedance of the first matching layer is between about 2.5 MegaRayles (MR) to about 2.8 MegaRayles (MR).

5. The ultrasonic transducer stack of claim 2 , wherein the acoustic impedance of the lens layer is about 1.8 MegaRayles (MR).

6. The ultrasonic transducer stack of claim 1 , wherein the acoustic impedance of the lens is substantially the same as the acoustic impedance of water.

7. The ultrasonic transducer stack of claim 1 , wherein the piezoelectric layer can generate ultrasound at a frequency of at least about 20 megahertz (MHz).

8. The ultrasonic transducer stack of claim 7 , wherein the piezoelectric layer can generate ultrasound at a frequency of about 20 MHz, 25 MHz, 30 MHz, 35 MHz, 40 MHz, 45 MHz, 50 MHz, 55 MHz, 60 MHz, or higher for transmission through the first matching layer and then through the lens layer.

9. The ultrasonic transducer stack of claim 1 , further comprising a second matching layer located between the top surface of the piezoelectric layer and the bottom surface of the first matching layer.

10. The ultrasonic transducer stack of claim 9 , wherein the top surface of the second matching layer is bonded to the bottom surface of the first matching layer using a bonding material.

11. The ultrasonic transducer stack of claim 10 , wherein the bonding material forms a bondline layer between the first matching layer and the second matching layer.

12. The ultrasonic transducer stack of claim 11 , wherein the bondline layer has an elevational thickness of less than about 5 microns.

13. The ultrasonic transducer stack of claim 11 , wherein the bondline layer has an elevational thickness of between about 1 micron to about 5 microns.

14. The ultrasonic transducer stack of claim 11 , wherein the bondline layer has an elevational thickness of between about 1 micron to about 3 microns.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2016
From: CHAGGARES, N. CHRIS; MEHI, JAMES; HIRSON, DESMOND
To: VISUALSONICS INC.
Reel/Frame 041090/0618 →
CHANGE OF NAME Recorded Dec 21, 2016
From: VISUALSONICS INC.
To: FUJIFILM VISUALSONICS INC.
Reel/Frame 041099/0332 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2016
From: FUJIFILM VISUALSONICS INC.
To: FUJIFILM SONOSITE, INC.
Reel/Frame 041101/0266 →
Continuity (5)
Continuation 14493242 · Sep 22, 2014
Division 13730337 · Dec 28, 2012
Continuation 12830904 · Jul 6, 2010
Division 11366953 · Mar 2, 2006
Related Publication 20170144195A1 · May 25, 2017