Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
A method of manufacturing a semiconductor device includes forming a film on a substrate by performing a cycle a predetermined number of times. The cycle includes non-simultaneously performing: forming a first layer by supplying a precursor gas including a chemical bond of a first element and carbon and a first catalyst gas to the substrate; exhausting the precursor gas and the first catalyst gas through an exhaust system; forming a second layer by supplying a reaction gas including a second element and a second catalyst gas to the substrate to modify the first layer; and exhausting the reaction gas and the second catalyst gas through the exhaust system. At least in a specific cycle, the respective gases are supplied and confined in the process chamber while closing the exhaust system in at least one of the act of forming the first layer and the act of forming the second layer.
1. A method of manufacturing a semiconductor device, comprising forming a film including a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:
forming a first layer by supplying a precursor gas including a chemical bond of the first element and carbon and a first catalyst gas to the substrate in a process chamber;
exhausting the precursor gas and the first catalyst gas in the process chamber through an exhaust system;
forming a second layer by supplying a reaction gas including the second element and a second catalyst gas to the substrate in the process chamber to modify the first layer; and
exhausting the reaction gas and the second catalyst gas in the process chamber through the exhaust system,
wherein the precursor gas and the first catalyst gas supplied to the substrate are confined in the process chamber while closing the exhaust system in the act of forming the first layer, and
wherein a concentration of carbon in the film is finely adjusted by adjusting a time during which the precursor gas and the first catalyst gas are confined in the process chamber.
2. The method of claim 1 , wherein the precursor gas further includes a halogen element, and the reaction gas further includes hydrogen.
3. The method of claim 1 , wherein the first element includes a semiconductor element or a metal element, and the second element includes oxygen.
4. The method of claim 1 , wherein the first catalyst gas has the same molecular structure as the second catalyst gas.
5. A method of manufacturing a semiconductor device, comprising forming a film including a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:
forming a first layer by supplying a precursor gas including a chemical bond of the first element and carbon and a first catalyst gas to the substrate in a process chamber;
exhausting the precursor gas and the first catalyst gas in the process chamber through an exhaust system;
forming a second layer by supplying a reaction gas including the second element and a second catalyst gas to the substrate in the process chamber to modify the first layer; and
exhausting the reaction gas and the second catalyst gas in the process chamber through the exhaust system,
wherein the reaction gas and the second catalyst gas supplied to the substrate are confined in the process chamber while closing the exhaust system in the act of forming the second layer.
6. The method of claim 5 , wherein a concentration of carbon in the film is finely adjusted by adjusting a time during which the reaction gas and the second catalyst gas are confined in the process chamber.
7. The method of claim 5 , wherein the precursor gas and the first catalyst gas supplied to the substrate are not confined in the process chamber in the act of forming the first layer.
8. A method of manufacturing a semiconductor device, comprising forming a film including a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:
forming a first layer by supplying a precursor gas including a chemical bond of the first element and carbon and a first catalyst gas to the substrate in a process chamber;
exhausting the precursor gas and the first catalyst gas in the process chamber through an exhaust system;
forming a second layer by supplying a reaction gas including the second element and a second catalyst gas to the substrate in the process chamber to modify the first layer; and
exhausting the reaction gas and the second catalyst gas in the process chamber through the exhaust system,
wherein the precursor gas and the first catalyst gas supplied to the substrate are confined in the process chamber while closing the exhaust system in the act of forming the first layer, and
wherein the reaction gas and the second catalyst gas supplied to the substrate are confined in the process chamber while closing the exhaust system in the act of forming the second layer.
9. The method of claim 8 , wherein a time during which the precursor gas and the first catalyst gas are confined in the process chamber is set to become longer than a time during which the reaction gas and the second catalyst gas are confined in the process chamber.
10. The method of claim 8 , wherein a time during which the precursor gas and the first catalyst gas are confined in the process chamber is set to become shorter than a time during which the reaction gas and the second catalyst gas are confined in the process chamber.
11. A method of manufacturing a semiconductor device, comprising forming a film including a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:
forming a first layer by supplying a precursor gas including a chemical bond of the first element and carbon and a first catalyst gas to the substrate in a process chamber;
exhausting the precursor gas and the first catalyst gas in the process chamber through an exhaust system;
forming a second layer by supplying a reaction gas including the second element and a second catalyst gas to the substrate in the process chamber to modify the first layer; and
exhausting the reaction gas and the second catalyst gas in the process chamber through the exhaust system,
wherein the precursor gas and the first catalyst gas supplied to the substrate are confined in the process chamber while closing the exhaust system in the act of forming the first layer, and
wherein the reaction gas and the second catalyst gas supplied to the substrate are not confined in the process chamber in the act of forming the second layer.
12. A non-transitory computer-readable recording medium storing a program that causes a computer to perform a process of forming a film including a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:
forming a first layer by supplying a precursor gas including a chemical bond of the first element and carbon and a first catalyst gas to the substrate in a process chamber;
exhausting the precursor gas and the first catalyst gas in the process chamber through an exhaust system;
forming a second layer by supplying a reaction gas including the second element and a second catalyst gas to the substrate in the process chamber to modify the first layer; and
exhausting the reaction gas and the second catalyst gas in the process chamber through the exhaust system,
wherein the precursor gas and the first catalyst gas supplied to the substrate are confined in the process chamber while closing the exhaust system in the act of forming the first layer, and
wherein a concentration of carbon in the film is finely adjusted by adjusting a time during which the precursor gas and the first catalyst gas are confined in the process chamber.