Compact light emitting diode chip and light emitting device having a slim structure with secured durability

1. A light emitting diode chip comprising:

a substrate;

a first conductive type semiconductor layer disposed on the substrate;

a mesa disposed on the first conductive type semiconductor layer and comprising an active layer and a second conductive type semiconductor layer;

an insulation layer covering the first conductive type semiconductor layer and the mesa, the insulation layer comprising at least one first opening exposing the first conductive type semiconductor layer and a second opening disposed on the mesa;

a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and

a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening,

wherein the first opening of the insulation layer comprises a first region covered by the first pad electrode and a second region exposed outside the first pad electrode.

2. The light emitting diode chip according to claim 1 , wherein the insulation layer comprises a plurality of first openings and two of the first openings are disposed at opposite side surfaces of the mesa, respectively.

3. The light emitting diode chip according to claim 2 , wherein one of the first openings is disposed at one side surface of the mesa between the opposite side surfaces thereof.

4. The light emitting diode chip according to claim 1 , wherein the mesa comprises a plurality of grooves depressed from side surfaces thereof, and the plurality of first openings partially expose the first conductive type semiconductor layer exposed through the plurality of grooves, respectively.

5. The light emitting diode chip according to claim 4 , wherein the mesa further comprises a through-hole exposing the first conductive type semiconductor layer,

the insulation layer further comprises an opening exposing the first conductive type semiconductor layer in the through-hole, and

the first pad electrode is electrically connected to the first conductive type semiconductor layer through the through-hole.

6. The light emitting diode chip according to claim 5 , wherein the through-hole is disposed between the grooves disposed at the opposite side surfaces of the mesa.

7. The light emitting diode chip according to claim 1 , wherein the second region of the first opening partially exposes a side surface of the first conductive type semiconductor layer.

8. The light emitting diode chip according to claim 1 , further comprising:

a contact electrode disposed between the mesa and the insulation layer to contact the second conductive type semiconductor layer,

wherein the second pad electrode is connected to the contact electrode.

9. The light emitting diode chip according to claim 8 , wherein light generated in the active layer is emitted through the substrate and through a region between the first and second pad electrodes.

10. The light emitting diode chip according to claim 8 , wherein the contact electrode is a transparent electrode through which light generated in the active layer passes.

11. The light emitting diode chip according to claim 1 , wherein the first conductive type semiconductor layer comprises a side surface inclined at an angle of about 40° with respect to a bottom surface of the substrate.

12. The light emitting diode chip according to claim 1 , wherein a region of the first conductive type semiconductor layer exposed by the second region is covered by a bonding material upon flip-chip bonding of the light emitting diode chip.

13. The light emitting diode chip according to claim 12 , wherein the bonding material is selected to form a Schottky contact with the first conductive type semiconductor layer.

14. The light emitting diode chip according to claim 1 , further comprising an extension electrode connecting the first pad electrode to the first conductive type semiconductor layer and forming an ohmic contact with the first conductive type semiconductor layer.

15. A light emitting diode (LED) lamp comprising a plurality of the light emitting diode chip according to claim 1 , the LED lamp comprising:

a bulb base comprising electrical connections;

a central column extending from the bulb base and comprising electrical wiring; and

an LED filament formed as an elongated transparent flexible strap comprising the plurality of light emitting diode chips, wherein the LED filament comprises conductive interconnections coupled to the electrical wiring and is mounted in a spiral shape to the central column.

16. The LED lamp according to claim 15 , wherein:

each light emitting diode chip further comprises a contact electrode disposed between the mesa and the insulation layer to contact the second conductive type semiconductor layer, and

the second pad electrode is connected to the contact electrode.

17. The LED lamp according to claim 16 , wherein light generated in the active layer is emitted through the substrate and through a region between the first and second pad electrodes.

18. The LED lamp according to claim 16 , wherein the contact electrode is a transparent electrode through which light generated in the active layer passes.

19. The LED lamp according to claim 15 , wherein the central column comprises glass.

20. A flexible light element comprising a plurality of the light emitting diode chip according to claim 1 , the flexible light element comprising:

a base comprising flexible film;

conductive interconnections disposed on the base; and

the plurality of light emitting diode chips mounted to the conductive interconnections, wherein the base is formed as a sheet or as an elongated strip.