Method and apparatus for use in the manufacture of a display element
Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.
1. A method for selective pick up of a subset of electronic devices adhered to a handle layer, the method comprising:
modifying a level of adhesion between the a subset of electronic devices and the handle layer such that the subset electronic devices has a modified level of adhesion to the handle layer, wherein:
the electronic devices adhered to the handle layer comprise light emitting diode (LED) devices each including a first side adhered to the handle layer and a second side opposite the first,
the electronic devices adhered to the handle layer include the subset of electronic devices and a second subset of electronic devices, and
modifying the level of adhesion between the subset of electronic devices and the handle layer comprises applying a liquid stimulus to the subset of electronic devices and/or corresponding portions of the handle layer where the subset of electronic devices are adhered; and
separating, by a pick up tool (PUT), the subset of electronic devices from the handle layer by applying a force to second sides of the subset of electronic devices that is greater than the modified level of adhesion of the subset of electronic devices to the handle layer.
2. The method of claim 1 , wherein modifying the level of adhesion between the subset of electronic devices and the handle layer includes reducing the level of adhesion.
3. The method of claim 1 , wherein the PUT applies the force to the subset of electronic devices by adhesion, the method further comprising contacting the PUT with the subset of electronic devices.
4. The method of claim 1 , wherein the PUT is a non-selective PUT.
5. The method of claim 1 , wherein modifying the level of adhesion between the subset of electronic devices and the handle layer comprises heating the subset of electronic devices and/or corresponding portions of the handle layer where the subset of electronic devices are adhered.
6. The method of claim 1 , wherein modifying the level of adhesion between the subset of electronic devices and the handle layer comprises irradiating with light corresponding portions of the handle layer where the subset of electronic devices are adhered.
7. The method of claim 6 , wherein the light comprises ultraviolet (UV) light.
8. The method of claim 7 , wherein the UV light originates from one or more of:
a UV laser;
a UV LED array; or
a UV light source passed through a photolithography mask.
9. The method of claim 1 , wherein the LED devices are inorganic LED devices.
10. The method of claim 1 , wherein the LED devices are micro-LED (μLED) devices, each μLED device including a μLED emitter comprising:
a substantially parabolic mesa structure;
a light emitting source within the mesa structure to emit light, the light from the light emitting source being reflected at the substantially parabolic mesa structure toward a primary emission surface; and
the primary emission surface on the second side of the μLED device opposed to a top of the mesa structure at the first side.
11. The method of claim 1 , wherein the handle layer comprises one of: a semiconductor wafer; a UV tape; a thermal release tape; a multiple layer tape; or an adhesion adjustable layer.
12. The method of claim 1 , further comprising:
transferring, by the PUT, the subset of electronic devices to a substrate of a display element.
13. The method of claim 1 , wherein modifying the level of adhesion between the subset of electronic devices and the handle layer includes controlling adhesion of the handle layer.
14. The method of claim 1 , wherein:
the second subset of electronic devices is adhered to the handle layer with the level of adhesion that is greater than the force applied by the PUT; and
the force does not separate the second subset of electronic devices from the handle layer when the subset of electronic devices is separated from the handle layer.
15. The method of claim 1 , further comprising, subsequent to separating the subset of electronic devices from the handle layer:
modifying the level of adhesion between the second subset of electronic devices adhered to the handle layer such that the second subset electronic devices has the modified level of adhesion to the handle layer; and
separating, by the PUT, second the subset of electronic devices from the handle layer by applying the force to the second subset of electronic devices that is greater than the modified level of adhesion of the second subset of electronic devices to the handle layer.
16. The method of claim 1 , further comprising transferring, by the PUT, the subset of electronic devices to a substrate at locations where defective electronic devices were removed from the substrate.
17. The method of claim 1 , further comprising:
manufacturing the electronic devices on a wafer;
singulating the electronic devices on the wafer; and
adhering the singulated electronic devices to the handle layer.
18. A non-transitory computer readable media storing computer program comprising instructions, the computer program instructions when executed by at least one processor, configure the at least one processor to:
modify a level of adhesion between a subset of electronic devices and the handle layer such that the subset electronic devices has a modified level of adhesion to the handle layer, wherein:
the electronic devices adhered to the handle layer comprise light emitting diode (LED) devices each including a first side adhered to the handle layer and a second side opposite the first side,
the electronic devices adhered to the handle layer include the subset of electronic devices and a second subset of electronic devices, and
modifying the level of adhesion between the subset of electronic devices and the handle layer comprises applying a liquid stimulus to the subset of electronic devices and/or corresponding portions of the handle layer where the subset of electronic devices are adhered; and
separate, by controlling a pick up tool (PUT), the subset of electronic devices from the handle layer by applying a force to second sides of the subset of electronic devices that is greater than the modified level of adhesion of the subset of electronic devices to the handle layer.
19. A system for selective pick up of electronic devices adhered to a handle layer, comprising:
circuitry configured to:
modify a level of adhesion between a subset of electronic devices and the handle layer such that the subset electronic devices has a modified level of adhesion to the handle layer, wherein:
the electronic devices adhered to the handle layer comprise light emitting diode (LED) devices each including a first side adhered to the handle layer and a second side opposite the first side,
the electronic devices adhered to the handle layer include the subset of electronic devices and a second subset of electronic devices, and
modifying the level of adhesion between the subset of electronic devices and the handle layer comprises applying a liquid stimulus to the subset of electronic devices and/or corresponding portions of the handle layer where the subset of electronic devices are adhered; and
separate, by a pick up tool (PUT), the subset of electronic devices from the handle layer by applying a force to second sides of the subset of electronic devices that is greater than the modified level of adhesion of the subset of electronic devices to the handle layer.