Method of making a superconductor device

1. A method of forming a superconductor device structure, the method comprising:

forming a first dielectric layer overlying a substrate;

forming a base electrode in the first dielectric layer, the base electrode having a top surface aligned with the top surface of the first dielectric layer;

forming a junction material stack over the base electrode;

forming a hardmask over the junction material stack where a Junction defining portion resides;

etching away a portion of the junction material stack that does not include where the Junction defining portion resides to form a Josephson junction (JJ) over the base electrode;

depositing a second dielectric layer over the hardmask, the JJ, the base electrode and the first dielectric layer; and

forming a first contact through the second dielectric layer to the base electrode to electrically couple the first contact to a first end of the JJ; and

forming a second contact through the second dielectric layer and the hardmask to electrically coupled the second contact to a second end of the JJ.

2. The method of claim 1 , wherein the JJ is formed from an Aluminum/Aluminum oxide layer disposed between the base electrode and a niobium layer.

3. The method of claim 2 , wherein the base electrode is formed from niobium.

4. The method of claim 1 , wherein the second contact has a diameter that is smaller than the diameter of the JJ.

5. The method of claim 1 , wherein the dielectric material employed in the first dielectric layer and the second dielectric layer is a material that can form the dielectric first and second material layers at a temperature of about 160° Celsius.

6. The method of claim 1 , further comprising forming a first conductive line overlying the first contact and second conductive line overlying the second contact, wherein the first and second conductive lines have a top surface that is aligned with a top surface of the second dielectric layer.

7. The method of claim 6 , wherein the first and second contacts and the first and second conductive lines are formed by a dual damascene process.

8. The method of claim 1 , wherein the base electrode is formed by a single damascene process.

9. The method of claim 1 , wherein forming a junction material stack over the base electrode comprises:

depositing an aluminum layer over the base electrode and the first dielectric layer;

oxidizing the aluminum layer to form an aluminum oxide layer on the top surface of the aluminum layer;

forming a niobium layer over the aluminum oxide layer; and

forming a diffusion barrier layer over the niobium layer,

wherein forming a hardmask over the junction material stack where a Junction defining portion resides comprises:

forming a dielectric hardmask layer over the diffusion barrier layer;

depositing and patterning a photoresist material layer over the dielectric hardmask layer to define dimensions of the Josephson junction;

partially etching the dielectric hardmask layer;

removing the photoresist material layer; and

completely etching the dielectric hardmask layer to remove the dielectric hardmask layer everywhere except over the dimensions defined by the Josephson junction to form the hardmask, and

wherein etching away a portion of the junction material stack that does not include where the Junction defining portion resides to form a Josephson junction (JJ) over the base electrode comprises:

etching the niobium layer, the aluminum oxide layer and the aluminum layer to remove portions of the niobium layer, the aluminum oxide layer and the aluminum layer to form a JJ.

10. The method of claim 9 , further comprising forming a passivation layer over the JJ and the base electrode prior to depositing a second dielectric layer.

11. A method of forming a superconductor device structure, the method comprising:

forming a first dielectric layer overlying a substrate;

forming a niobium base electrode in the first dielectric layer, the niobium base electrode having a top surface aligned with the top surface of the first dielectric layer;

depositing an aluminum layer over the base electrode and the first dielectric layer;

oxidizing the aluminum layer to form an aluminum oxide layer on the top surface of the aluminum layer;

forming a niobium layer over the aluminum oxide layer;

forming a dielectric hardmask layer over the niobium layer;

etching the dielectric hardmask layer to remove the dielectric hardmask layer everywhere except over dimensions that define a Josephson junction to form a hardmask;

depositing a second dielectric layer over the JJ, the base electrode and the hardmask;

forming a passivation layer over the JJ, the base electrode and the hardmask to protect sides of the JJ and the base electrode from oxidation;

forming a first contact through the second dielectric layer to the base electrode to electrically couple the first contact to a first end of the JJ, and forming a second contact through the second dielectric layer and the hardmask to electrically coupled the second contact to a second end of the JJ; and

forming a first conductive line overlying the first contact and second conductive line overlying the second contact, wherein the first and second conductive lines have a top surface that is aligned with a top surface of the second dielectric layer.

12. The method of claim 11 , wherein the second contact has a diameter that is smaller than the diameter of the JJ.

13. The method of claim 11 , wherein the dielectric material employed in the first dielectric layer and the second dielectric layer is a material that can form the dielectric first and second material layers at a temperature of about 160° Celsius.

14. The method of claim 11 , wherein the first and second contacts and the first and second conductive lines are formed by a dual damascene process, and the base electrode is formed from a single damascene process.

15. The method of claim 11 , further comprising:

depositing and patterning a photoresist material layer over the dielectric hardmask layer to define dimensions of the Josephson junction;

partially etching the dielectric hardmask layer;

removing the photoresist material layer; and

wherein the etching the dielectric mask layer comprises completely etching the dielectric layer to remove the dielectric mask layer everywhere except over the dimensions defined by the Josephson junction to form the hardmask.

16. The method of claim 11 , further comprising forming a diffusion barrier layer over the niobium layer prior to forming a dielectric hardmask layer.

17. A method of forming a superconductor device interconnect structure, the method comprising:

forming a first dielectric layer overlying a substrate;

forming a niobium base electrode in the first dielectric layer, the niobium base electrode having a top surface aligned with the top surface of the first dielectric layer;

depositing an aluminum layer over the base electrode and the first dielectric layer;

oxidizing the aluminum layer to form an aluminum oxide layer on the top surface of the aluminum layer;

forming a niobium layer over the aluminum oxide layer;

forming a diffusion barrier layer over the niobium layer;

forming a dielectric hardmask layer over the diffusion barrier layer;

depositing and patterning a photoresist material layer over the dielectric hardmask layer to define dimensions of a Josephson junction;

partially etching the dielectric hardmask layer;

removing the photoresist material layer;

completely etching the dielectric hardmask layer to remove the dielectric hardmask layer everywhere except over the dimensions defined by the Josephson junction to form the hardmask;

forming a passivation layer over the JJ, the base electrode and the hardmask to protect sides of the JJ and the base electrode from oxidation;

depositing a second dielectric layer over the passivation layer;

forming a first contact through the second dielectric layer to the base electrode to electrically couple the first contact to a first end of the JJ, and forming a second contact through the second dielectric layer and the hardmask to a second end of the JJ; and

forming a first conductive line overlying the first contact and second conductive line overlying the second contact, wherein the first and second conductive lines have a top surface that is aligned with a top surface of the second dielectric layer.

18. The method of claim 17 , wherein the second contact has a diameter that is smaller than the diameter of the JJ.

19. The method of claim 17 , wherein the dielectric material employed in the first dielectric layer and the second dielectric layer is a material that can form the dielectric first and second material layers at a temperature of about 160° Celsius.

20. The method of claim 17 , wherein the first and second contacts and the first and second conductive lines are formed by a dual damascene process, and the base electrode is formed from a single damascene process.