Substrate structure with filling material formed in concave portion
Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.
1. A substrate structure comprising:
a substrate body;
a plurality of electrical contact pads disposed on the substrate body, wherein at least one of the plurality of electrical contact pads has at least one concave portion formed inside a periphery of the at least one of the plurality of electrical contact pads;
a filling material formed in the at least one concave portion; and
an insulating protection layer formed on the substrate body, the insulating protection layer including a plurality of openings corresponding to the plurality of electrical contact pads,
wherein a bottom of at least one of the plurality of openings is made from the at least one of the plurality of electrical contact pads,
the insulating protection layer further includes at least one hole in communication with the at least one concave portion and free from being in communication with the plurality of openings, and
the filling material is located outside the plurality of openings and in the at least one hole.
2. The substrate structure of claim 1 , wherein the at least one concave portion penetrates the at least one of the plurality of electrical contact pads.
3. The substrate structure of claim 1 , wherein the at least one concave portion is free from penetrating the at least one of the plurality of electrical contact pads.
4. The substrate structure of claim 1 , wherein the insulating protection layer is composed of a material different from the filling material.
5. The substrate structure of claim 1 , wherein the insulating protection layer is composed of a material the same as the filling material.
6. The substrate structure of claim 1 , wherein the filling material is integrally formed with the insulating protection layer.
7. The substrate structure of claim 1 , wherein the filling material is a metal material or an insulating material.
8. The substrate structure of claim 7 , wherein the insulating material is an underfill, a molding compound, a solder resistant material, polybenzoxazole (PBO), polyimide (PI), or benezocy-clobutene (BCB).
9. The substrate structure of claim 1 , further comprising a plurality of conductive elements disposed on the plurality of electrical contact pads exposed from the openings to bond an electronic element.
10. The substrate structure of claim 9 , wherein the conductive elements contain soldering materials.
11. The substrate structure of claim 1 , wherein the at least one concave portion is formed on the at least one of the plurality of the electrical contacts pads located at a corner of the substrate body.