ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

1 . An organic light-emitting display device comprising:

a substrate;

a first electrode provided on the substrate;

a metal pattern provided along an edge of the first electrode; and

a pixel definer provided on the metal pattern,

wherein the pixel definer covers an end portion of the first electrode and an end portion of the metal pattern, and

wherein the pixel definer includes an opening exposing the first electrode.

2 . The organic light-emitting display device of claim 1 , wherein the metal pattern has a thickness substantially equal to or greater than about 100 Å and substantially equal to or less than about 10,000 Å.

3 . The organic light-emitting display device of claim 1 , wherein the metal pattern has an etching selection ratio that is different from an etching selection ratio of the first electrode.

4 . The organic light-emitting display device of claim 3 , wherein the metal pattern includes copper (Cu) or a copper (Cu) alloy.

5 . The organic light-emitting display device of claim 4 , wherein the copper (Cu) alloy includes titanium copper (TiCu) or molybdenum copper (MoCu).

6 . The organic light-emitting display device of claim 3 , wherein the metal pattern includes a stacked configuration of a plurality of layers.

7 . The organic light-emitting display device of claim 6 , wherein the stacked configuration is a configuration of a titanium (Ti) layer/aluminum (Al) layer or a titanium (Ti) layer/aluminum (Al) layer/titanium (Ti) layer.

8 . The organic light-emitting display device of claim 1 , wherein an upper surface of the pixel definer has a curved shape.

9 . The organic light-emitting display device of claim 1 , wherein

the organic light-emitting display device includes a display area including a plurality of pixels and a peripheral area surrounding the display area;

the first electrode, the metal pattern, and the pixel definer are provided in the display area; and

the organic light-emitting display device further includes a dam portion provided in the peripheral area and provided along an edge of the substrate.

10 . The organic light-emitting display device of claim 9 , wherein

the dam portion includes:

a first layer including a same material as the first electrode;

a second layer including a same material as the metal pattern; and

a third layer including a same material as the pixel definer.

11 . The organic light-emitting display device of claim 10 , wherein the organic light-emitting display device is a flexible display device.

12 . A method of manufacturing an organic light-emitting display device, the method comprising:

disposing a first electrode material layer, a metal layer, and a pixel definer material layer on a substrate;

disposing a first electrode by patterning the first electrode material layer;

removing the pixel definer material layer remaining on the first electrode to expose the metal layer;

removing the metal layer exposed by the pixel definer material layer to generate a metal pattern provided along an edge of the first electrode; and

disposing a pixel definer by heat treating the pixel definer material layer remaining on the first electrode and the metal pattern.

13 . The method of claim 12 , wherein

the removing of the pixel definer material layer includes dry etching the pixel definer material layer, and

wherein the removing of the metal layer includes wet etching the metal layer.

14 . The method of claim 13 , wherein

the disposing of the first electrode includes:

patterning the first electrode material layer using a halftone mask, the halftone mask including a first region, a second region, and a third region;

retaining the pixel definer material layer corresponding to the first region, removing a part of the pixel definer material layer corresponding to the second region in a thickness direction, and removing substantially the entire pixel definer material layer corresponding to the third region; and

removing the metal layer and the first electrode material layer corresponding to the third region.

15 . The method of claim 14 , wherein the metal layer has an etching selection ratio that is different from an etching selection ratio of the first electrode material layer.

16 . The method of claim 15 , wherein the removing of the metal layer and the first electrode material layer corresponding to the third region includes removing the first electrode material layer prior to removing the metal layer.

17 . The method of claim 12 , wherein

a part of the pixel definer material layer is melted by the heat treatment to generate a pixel definer, and

wherein the pixel definer covers an end portion of the metal pattern and an end portion of the first electrode.

18 . The method of claim 17 , wherein the heat treatment is performed at a temperature that is substantially equal to or greater than about 200° C. and less than about 400° C.

19 . The method of claim 13 , wherein the disposing of the first electrode further includes disposing a dam portion along an edge of the substrate.

20 . The method of claim 19 , wherein

the halftone mask includes a fourth region having substantially the same transmittance as the first region, and

wherein the dam portion corresponds to the fourth region.