Piezoelectric element, ultrasonic probe, ultrasonic measurement device, and manufacturing method of piezoelectric element
A piezoelectric element, in which a piezoelectric body, and a vibrating plate having [111]-oriented single crystal silicon as a vibrating material are laminated is provided. In addition, a manufacturing method of a piezoelectric element including: cutting out a vibrating material to be used in the vibrating plate from a [111]-oriented single crystal silicon wafer; and laminating a piezoelectric body and the vibrating plate is provided.
1. A piezoelectric element comprising:
a piezoelectric body;
a vibrating plate having [111]-oriented single crystal silicon as a vibrating material laminated on the piezoelectric body; and
a support substrate bonded to the vibrating plate,
wherein the support substrate includes a hollow portion at a position overlapped with the piezoelectric body in a plan view in a thickness direction of the support substrate, and
wherein the vibrating plate has a two-end fixed supported beam structure forming a bridge and has two openings formed along an edge of the hollow portion.
2. The piezoelectric element according to claim 1 ,
wherein a zirconia oxide layer and a silicon oxide layer are provided between the piezoelectric body and the vibrating plate.
3. An ultrasonic probe comprising:
the piezoelectric element according to claim 1 for transmitting ultrasonic waves.
4. An ultrasonic probe comprising:
the piezoelectric element according to claim 1 for receiving ultrasonic waves.
5. An ultrasonic probe comprising:
the piezoelectric element according to claim 1 for transmitting and receiving ultrasonic waves.
6. An ultrasonic measurement device comprising:
the ultrasonic probe according to claim 3 .
7. A manufacturing method of a piezoelectric element comprising:
cutting out a vibrating material to be used in a vibrating plate from a oriented single crystal silicon wafer;
laminating the vibrating plate on a piezoelectric body;
bonding a support substrate to the vibrating plate,
wherein the support substrate includes a hollow portion at a position overlapped with the piezoelectric body in a plan view in a thickness direction of the support substrate, and
wherein the vibrating plate has a two-end fixed supported beam structure forming a bridge and has two openings formed along an edge of the hollow portion.