Photosensitive resin composition, method for forming resist pattern, and method for producing metallic pattern
The present invention provides a photosensitive resin composition including: an alkali-soluble resin (A) having more than 30% by mass and less than 70% by mass of a structural unit represented by the Formula (1) below; a compound (B) having at least one ethylenically unsaturated double bond per molecule; and a photo radical polymerization initiator (C) having an oxime ester structure; wherein a content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the alkali-soluble resin (A) is 3 to 20 parts by mass. In Formula (1), R 1 represents a hydrogen atom or a C 1-4 alkyl group. R 2 represents a single bond or a divalent organic group. R 3 each independently represent a hydrogen atom, a hydroxyl group, or an optionally substituted alkyl group.
1. A photosensitive resin composition comprising:
an alkali-soluble resin (A) having more than 30% by mass and less than 70% by mass of a structural unit represented by Formula (1) below:
wherein, in Formula (1), R 1 represents a hydrogen atom or a C 1-4 alkyl group, R 2 represents a single bond or a divalent organic group, and one of R 3 is a hydroxyl group and the remaining R 3 are hydrogen atoms;
a compound (B) having at least one ethylenically unsaturated double bond per molecule; and
a photo radical polymerization initiator (C) having an oxime ester structure; wherein
a content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the alkali-soluble resin (A) is 3 to 20 parts by mass.
2. The photosensitive resin composition according to claim 1 , wherein R 2 in Formula (1) is a single bond.
3. The photosensitive resin composition according to claim 1 , wherein the oxime ester structure is a structure represented by Formula (2) below:
wherein, in Formula (2), R 4 represents an optionally substituted alkyl group or an optionally substituted aryl group.
4. A method for forming a resist pattern, comprising the steps of:
(1) applying the photosensitive resin composition according to claim 1 to a base material to form a resin coating;
(2) exposing the resin coating; and
(3) developing the exposed resin coating using an alkaline developer to allow pattern formation.
5. A method for producing a metallic pattern by using the resist pattern formed by the method for forming a resist pattern according to claim 4 as a mask.