IP Library Granted Patent US 10,483,454
Granted Patent B2
US 10,483,454 · App. 15/361,436 · Granted Nov 19, 2019

Piezoelectric component and method for producing a piezoelectric component

Inventors: Alexander Glazunov (Deutschlandsberg, AT); Adalbert Feltz (Deutschlandsberg, AT)
Assignee: TDK ELECTRONICS AG
H01L41/273C04B35/491C04B35/493C04B35/6261C04B35/6262C04B35/62222C04B35/62645C04B35/62685C04B35/6303C04B35/638C04B35/64C04B41/009C04B41/5111C04B41/88H01L41/0471H01L41/0477H01L41/187H01L41/1876C04B2235/3213C04B2235/3215C04B2235/3224C04B2235/3225C04B2235/3236C04B2235/3239C04B2235/3249C04B2235/3258C04B2235/3281C04B2235/3296C04B2235/5445C04B2235/656C04B2235/658C04B2235/6582C04B2235/6584C04B2235/6588C04B2235/768C04B2235/77C04B2235/786C04B2235/96Y10T29/42
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Quick Facts
Patent No.
US 10,483,454
App. No.
15/361,436
Granted
Nov 19, 2019
Kind
B2
Abstract

A method for producing a piezoelectric component is disclosed. In an embodiment, the method includes producing a ceramic precursor material of the general formula Pb 1-x-y-(2a-b)/2 V (2a-b)/2 ″Ba x Sr y [(Ti z Zr 1-z ) 1-a-b W a RE b ]O 3 , where RE is a rare earth metal and V″ is a Pb vacancy, mixing the ceramic precursor material with a sintering aid, forming a stack which includes alternating layers including the ceramic precursor material and a layer including Cu and debindering and sintering the stack thereby forming the piezoelectric component having Cu electrodes and at least one piezoelectric ceramic layer including Pb 1-x-y-[(2a-b)/2]-p/2 V [(2a-b)/2-p/2] ″Cu p Ba x Sr y [(Ti z Zr 1-z ) 1-a-b W a RE b ]O 3 , where 0≤x≤0.035, 0≤y≤0.025, 0.42≤z≤0.5, 0.0045≤a≤0.009, 0.009≤b≤0.011, and 2a>b, p≤2a−b.

Claims (34)

1. A method for producing a piezoelectric component, the method comprising:

producing a ceramic precursor material of the general formula Pb 1-x-y-(2a-b)/2 V (2a-b)/2 ″Ba x Sr y [(Ti z Zr 1-z ) 1-a-b W a RE b ]O 3 , where RE is a rare earth metal and V″ is a Pb vacancy;

mixing the ceramic precursor material with a sintering aid;

forming a stack which includes alternating layers comprising the ceramic precursor material and a layer comprising Cu; and

debindering and sintering the stack thereby forming the piezoelectric component having Cu electrodes and at least one piezoelectric ceramic layer comprising Pb 1-x-y-[(2a-b)/2]-p/2 V [(2a-b)/2-p/2] ″Cu p Ba x Sr y [(Ti z Zr 1-z ) 1-a-b W a RE b ]O 3 , where 0≤x≤0.035, 0≤y≤0.025, 0.42≤z≤0.5, 0.0045≤a≤0.009, 0.009≤b≤0.011, and 2a>b, p≤2a-b.

2. The method according to claim 1 , wherein producing the ceramic precursor material comprises:

providing a mixture of starting materials, the mixture of starting materials are selected from the group consisting of Pb 3 O 4 , TiO 2 , ZrO 2 , WO 3 , RE 2 O 3 , BaCO 3 and SrCO 3 ;

calcining the mixture at a first temperature and milling the mixture to a first average diameter; and

calcining the mixture at a second temperature that is higher than the first temperature.

3. The method according to claim 2 , wherein the mixture obtained by mixing the ceramic precursor material with the sintering aid is milled to a second average diameter that is smaller than the first average diameter.

4. The method according to claim 3 , wherein the mixture obtained by mixing the ceramic precursor material with the sintering aid further comprises adding Cu 2 O with a fraction of 0.05 to 0.1 mol %.

5. The method according to claim 1 , wherein mixing the ceramic precursor material comprises adding PbO or Pb 3 O 4 as the sintering aid, a fraction selected for the sintering aid being between 0.5 and 3 mol %, based on 1 mol of ceramic precursor material.

6. The method according to claim 1 , wherein forming the stack comprises applying Cu to the layer comprising the ceramic precursor material by sputter-coating with Cu or printing with a Cu paste.

7. The method according to claim 1 , wherein debindering the stack takes place under steam with exclusion of oxygen.

8. The method according to claim 1 , wherein sintering the stack takes place at an oxygen partial pressure which lies between an equilibrium partial pressure of PbO/Pb and an equilibrium partial pressure of Cu/Cu 2 O.

9. The method according to claim 8 , wherein the oxygen partial pressure is set by a mixture of steam and forming gas.

10. The method according to claim 1 , wherein sintering takes place at a temperature between 1000° C. and 1050° C.

11. The method according to claim 1 , wherein x=0.0295, y=0.0211, z=0.475, a=0.00753, b=0.0095, and RE=Yb are selected, and wherein debindering and sintering the stack comprises producing a piezoelectric ceramic layer comprising Pb 0.945 V 0.00128 ″Cu 0.003 Ba 0.0295 Sr 0.0211 [Ti 0.467 Zr 0.516 W 0.00753 Yb 0.0095 ]O 3 .

12. A method for producing a piezoelectric component, the method comprising:

providing a mixture of starting materials, the mixture of starting materials are selected from the group consisting of Pb 3 O 4 , TiO 2 , ZrO 2 , WO 3 , RE 2 O 3 , BaCO 3 and SrCO 3 ;

calcining the mixture at a first temperature and milling the calcinated mixture to a first average diameter;

calcining the calcinated mixture at a second temperature that is higher than the first temperature and forming a green body;

forming a metal layer on the green body;

forming a stack of green bodies and metal layers;

debindering the stack; and

sintering the stack thereby forming the piezoelectric component with piezoelectric ceramic layers comprising Pb 1-x-y-[(2a-b)/2]-p/2 V [(2a-b)/2-p/2] ″Cu p Ba x Sr y [(Ti z Zr 1-z ) 1-a-b W a RE b ]O 3 , where RE is a rare earth metal and V″ is a Pb vacancy, where 0≤x≤0.035, 0≤y≤0.025, 0.42≤z≤0.5, 0.0045≤a≤0.009, 0.009≤b≤0.011, 2a>b and p≤2a-b.

13. The method according to claim 12 , wherein forming the metal layer comprises sputtering the metal layer.

14. The method according to claim 12 , wherein the metal layer comprises a Cu layer.

15. The method according to claim 12 , further comprising mixing the mixture calcinated at the first temperature with a sintering aid.

16. The method according to claim 15 , wherein mixing the mixture calcinated at the first temperature with the sintering aid comprises adding PbO or Pb 3 O 4 .

17. The method according to claim 15 , further comprising milling a mixture obtained by mixing the mixture calcinated at the first temperature with the sintering aid to a second average diameter that is smaller than the first average diameter.

18. The method according to claim 12 , wherein debindering the stack comprises steaming the stack with exclusion of oxygen.

19. The method according to claim 12 , wherein sintering comprises heating the stack to a temperature between 1000° C. and 1050° C.

20. The method according to claim 12 , wherein debindering and sintering the stack comprises producing the piezoelectric component comprising Pb 0.9451 V 0.00128 ″Cu 0.003 Ba 0.0295 Sr 0.0211 [Ti 0.467 Zr 0.516 W 0.00753 Yb 0.0095 ]O 3 .

Assignments (1)
CHANGE OF NAME Recorded Jun 25, 2019
From: EPCOS AG
To: TDK ELECTRONICS AG
Reel/Frame 049587/0725 →
Priority Claims (1)
DE 10 2011 112 008 · Aug 30, 2011 · national
Continuity (2)
Division 14241400
Related Publication 20170141294A1 · May 18, 2017