Addition curable resin composition and semiconductor package

1. An addition curable resin composition comprising a component (A) which is a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule, represented by the general formula (1):

(R 1 3 SiO 0.5 ) a (R 1 2 SiO) b (R 1 SiO 1.5 ) c (SiO 2 ) d Z e   (1)

wherein R 1 is independently a C 1 -C 12 monovalent hydrocarbon group free of aliphatic unsaturation or C 2 -C 6 alkenyl group, at least two of R 1 groups per molecule being alkenyl, Z is independently a group having the formula (2):

wherein R 2 is independently a C 1 -C 12 monovalent hydrocarbon group, and n is an integer of 1 to 3, and a is an integer of 0 to 100, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and 2≤a+b+c≤5,000, wherein said component (A) comprises (A-i) a silphenylene oligomer skeleton-bearing branched organosilicon compound having at least two alkenyl groups per molecule, represented by formula (1) wherein b is an integer of 0 to 1,000, and 1≤c+d≤1,000.

2. An addition curable resin composition comprising (A) a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule, represented by the general formula (1):

(R 1 3 SiO 0.5 ) a (R 1 2 SiO) b (R 1 SiO 1.5 ) c (SiO 2 ) d Z e   (1)

wherein R 1 is independently a C 1 -C 12 monovalent hydrocarbon group free of aliphatic unsaturation or C 2 -C 6 alkenyl group, at least two of R 1 groups per molecule being alkenyl, Z is independently a group having the formula (2):

wherein R 2 is independently a C 1 -C 12 monovalent hydrocarbon group, and n is an integer of 1 to 3, and a is an integer of 0 to 100, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and 2≤a+b+c≤5,000, wherein said component (A) comprises (A-ii) a silphenylene oligomer skeleton-bearing linear organosilicon compound having at least two alkenyl groups per molecule, represented by the general formula (3):

(R 1 3 SiO 0.5 ) 2 (R 1 2 SiO) b′ Z e′   (3)

wherein R 1 and Z are as defined above, at least two of R 1 groups per molecule being alkenyl, b′ is an integer of 0 to 5,000, e′ is an integer of 1 to 500, and 1≤b′+e′≤5,001.

3. An addition curable resin composition comprising

(A) a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule, represented by the general formula (1):

(R 1 3 SiO 0.5 ) a (R 1 2 SiO) b (R 1 SiO 1.5 ) c (SiO 2 ) d Z e   (1)

wherein R 1 is independently a C 1 -C 12 monovalent hydrocarbon group free of aliphatic unsaturation or C 2 -C 6 alkenyl group, at least two of R 1 groups per molecule being alkenyl, Z is independently a group having the formula (2):

wherein R 2 is independently a C 1 -C 12 monovalent hydrocarbon group, and n is an integer of 1 to 3, and a is an integer of 0 to 100, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and 2≤a+b+c≤5,000, and

(B) an organopolysiloxane having at least two alkenyl groups per molecule, represented by the general formula (4):

(R 1 3 SiO 0.5 ) f (R 1 2 SiO) g (R 1 SiO 1.5 ) h (SiO 2 ) k   (4)

wherein R 1 is as defined above, at least two of R 1 groups per molecule being alkenyl, f is an integer of 0 to 100, g is an integer of 0 to 5,000, his an integer of 0 to 500, k is an integer of 0 to 500, and 2≤f+g+h≤5,000,

in an amount of 5 to 500 parts by weight per 100 parts by weight of the total weight of component (A) in the composition.

4. The composition of claim 3 wherein component (B) comprises (B-i) a branched organopolysiloxane having at least two alkenyl groups per molecule, represented by formula (4)

wherein

1≤h+k≤1,000, in an amount of 50 to 500 parts by weight per 100 parts by weight of the total weight of component (A) in the composition.

5. The composition of claim 3 wherein component (B) comprises (B-ii) a linear organopolysiloxane having at least two alkenyl groups per molecule, represented by the general formula (5):

(R 1 3 SiO 0.5 ) 2 (R 1 2 SiO) g′   (5)

wherein

R 1 is as defined above, at least two of R 1 groups per molecule being alkenyl,

g′ is an integer of 0 to 5,000,

in an amount of 5 to 200 parts by weight per 100 parts by weight of the total weight of component (A) in the composition.

6. An addition curable resin composition comprising

(A) a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule, represented by the general formula (1):

(R 1 3 SiO 0.5 ) a (R 1 2 SiO) b (R 1 SiO 1.5 ) c (SiO 2 ) d Z e   (1)

wherein R 1 is independently a C 1 -C 12 monovalent hydrocarbon group free of aliphatic unsaturation or C 2 -C 6 alkenyl group, at least two of R 1 groups per molecule being alkenyl, Z is independently a group having the formula (2):

wherein R 2 is independently a C 1 -C 12 monovalent hydrocarbon group, and n is an integer of 1 to 3, and a is an integer of 0 to 100, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and 2≤a+b+c≤5,000,

optionally, (B) an organopolysiloxane having at least two alkenyl groups per molecule, represented by the general formula (4):

(R 1 3 SiO 0.5 ) f (R 1 2 SiO) g (R 1 SiO 1.5 ) h (SiO 2 ) k   (4)

wherein R 1 is as defined above, at least two of R 1 groups per molecule being alkenyl, f is an integer of 0 to 100, g is an integer of 0 to 5,000, h is an integer of 0 to 500, k is an integer of 0 to 500, and 2≤f+g+h≤5,000,

(C) an organopolysiloxane having at least two hydrosilyl groups per molecule, represented by the general formula (6):

(R 3 3 SiO 0.5 ) p (R 3 2 SiO) q (R 3 SiO 1.5 ) r (SiO 2 ) s   (6)

wherein R 3 is independently hydrogen or a C 1 -C 12 monovalent hydrocarbon group, at least two of R 3 groups per molecule being hydrogen, and p is an integer of 0 to 100, q is an integer of 0 to 500, r is an integer of 0 to 300, s is an integer of 0 to 300, and 2≤p+q+r≤500, and/or

(D) a hydrosilyl-containing silphenylene compound represented by the general formula (7):

wherein R 3 is as defined above and m is an integer of 0 to 3,

in such amounts that a ratio of the total number of hydrosilyl groups in components (C) and (D) to the total number of alkenyl groups in component (A) and in component (B) if present ranges from 0.6/1 to 3/1.

7. An addition curable resin composition comprising

(A) a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule, represented by the general formula (1):

(R 1 3 SiO 0.5 ) a (R 1 2 SiO) b (R 1 SiO 1.5 ) c (SiO 2 ) d Z e   (1)

wherein R 1 is independently a C 1 -C 12 monovalent hydrocarbon group free of aliphatic unsaturation or C 2 -C 6 alkenyl group, at least two of R 1 groups per molecule being alkenyl, Z is independently a group having the formula (2):

wherein R 2 is independently a C 1 -C 12 monovalent hydrocarbon group, and n is an integer of 1 to 3, and a is an integer of 0 to 100, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and 2≤a+b+c≤5,000, and

(E) a hydrosilylation catalyst.

8. A semiconductor package encapsulated with a cured product of an addition curable resin composition comprising a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule, represented by the general formula (1):

(R 1 3 SiO 0.5 ) a (R 1 2 SiO) b (R 1 SiO 1.5 ) c (SiO 2 ) d Z e   (1)

wherein R 1 is independently a C 1 -C 12 monovalent hydrocarbon group free of aliphatic unsaturation or C 2 -C 6 alkenyl group, at least two of R 1 groups per molecule being alkenyl, Z is independently a group having the formula (2):

wherein R 2 is independently a C 1 -C 12 monovalent hydrocarbon group, and n is an integer of 1 to 3, and a is an integer of 0 to 100, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and 2≤a+b+c≤5,000.