Inverter switching devices with gate coils to enhance common source inductance
A selectable increase in the common source inductance is obtained by a layout for a power module used for a half-bridge phase leg in an inverter for an electrically-driven vehicle. The power module comprises a pair of transistor dies connected to positive, negative, and AC conductive tracks for carrying bridge currents. The module includes a pair of gate drive pins and a pair of gate drive coils connecting a respective pin and die. The gate drive coils are disposed in a region between the positive and negative tracks containing a flux generated by the currents having a locally greatest rate of change. The coils may preferably be comprised of traces on an auxiliary printed circuit board incorporated in the module. The gate drive pins can be on the gate side or the emitter side of the transistor dies.
1. A half-bridge power module comprising;
a body encapsulating a pair of transistor dies and positive, negative, and AC conductive tracks for carrying bridge currents;
a pair of gate drive pins projecting from the body; and
a pair of gate drive coils connecting a respective gate drive pin and transistor die, wherein each gate drive coil has at least one winding turn, and wherein the gate drive coils are encapsulated in a region disposed between the positive and negative conductive tracks containing a flux generated by the currents having a locally greatest rate of change.
2. The power module of claim 1 further comprising an auxiliary printed circuit board encapsulated in the body, wherein the gate drive coils are comprised of traces on the auxiliary printed circuit board.
3. The power module of claim 2 wherein the gate drive coils are disposed on opposite planar surfaces of the auxiliary printed circuit board.
4. The power module of claim 1 wherein the pair of gate drive pins are comprised of gate pins on a gate side of the transistor dies.
5. The power module of claim 1 wherein the pair of gate drive pins are comprised of Kelvin emitter pins on an emitter side of the transistor dies.
6. The power module of claim 1 further comprising a pair of gate clamping pins, each connected to a respective gate pad bypassing the gate drive coils.
7. The power module of claim 1 wherein the gate drive coils are comprised of conductors contained in a lead frame.
8. The power module of claim 1 wherein the gate drive coils include a plurality of bonding pads at spaced positions along a coil pattern within the region, and wherein the gate drive coils are further comprised of bonded wire segments interconnecting respective ones of the bonding pads.
9. The power module of claim 1 wherein the transistor dies each comprise an insulated gate bipolar transistor (IGBT).
10. A power converter comprising:
a DC link with positive and negative buses configured to receive a DC supply voltage;
a plurality of half-bridge power modules coupled between the buses, each power module comprising:
a body encapsulating a pair of transistor dies and positive, negative, and AC conductive tracks for carrying bridge currents;
a pair of gate drive pins; and
a pair of gate drive coils connecting a respective pin and die, wherein the gate drive coils are disposed in a region between the positive and negative tracks containing a flux generated by the currents having a locally greatest rate of change;
wherein the gate pins are turn-on pins for turning on the transistors, wherein each module further comprises a pair of gate turn-off pins for turning off the respective transistors, wherein each gate drive coil includes a plurality of turns, wherein each gate drive coil has an intermediate tap between two coil ends, wherein one of the turn-on pin or turn-off pin for each transistor is connected to the intermediate tap of the respective gate drive coil to obtain a first common source inductance and the other of the turn-on pin or turn-off pin for each transistor is connected to the coil ends to obtain a second common source inductance higher than the first common source inductance.
11. The power converter of claim 10 wherein each power module further comprises an auxiliary printed circuit board encapsulated in the body, wherein the gate drive coils are comprised of traces on the auxiliary printed circuit board.
12. The power converter of claim 11 wherein the respective gate drive coils are disposed on opposite planar surfaces of the respective auxiliary printed circuit board.
13. The power converter of claim 10 wherein the pair of gate drive pins are comprised of gate pins on a gate side of the transistor dies.
14. The power converter of claim 10 wherein the pair of gate drive pins are comprised of Kelvin emitter pins on an emitter side of the transistor dies.
15. The power converter of claim 10 wherein each power module further comprises a pair of gate clamping pins, each connected to a respective gate pad bypassing the gate drive coils.
16. The power converter of claim 10 wherein the gate drive coils are comprised of conductors contained in a respective lead frame.
17. A half-bridge power module comprising;
a pair of transistor dies connected to positive, negative, and AC conductive tracks for carrying bridge currents;
a pair of gate drive pins; and
a pair of gate drive coils connecting a respective pin and die, wherein the gate drive coils are disposed in a region between the positive and negative tracks containing a flux generated by the currents having a locally greatest rate of change;
wherein the pair of gate drive pins are comprised of gate pins on a gate side of the transistor dies; and
wherein the gate pins are turn-on pins for turning on the transistors, wherein the module further comprises a pair of gate turn-off pins for turning off the transistors, wherein each gate drive coil includes a plurality of turns, wherein each gate drive coil has an intermediate tap between two coil ends, wherein one of the turn-on pin or turn-off pin for each transistor is connected to the intermediate tap of the respective gate drive coil to obtain a first common source inductance and the other of the turn-on pin or turn-off pin for each transistor is connected to the coil ends to obtain a second common source inductance higher than the first common source inductance.
18. The power module of claim 17 further comprising an auxiliary printed circuit board, wherein the gate drive coils are comprised of traces on the auxiliary printed circuit board.
19. The power module of claim 18 wherein the gate drive coils are disposed on opposite planar surfaces of the auxiliary printed circuit board.
20. The power module of claim 18 further comprising an encapsulating body retaining the dies and auxiliary printed circuit board.