IP Library Granted Patent US 10,572,416
Granted Patent B1
US 10,572,416 · App. 15/364,030 · Granted Feb 25, 2020

Efficient signaling scheme for high-speed ultra short reach interfaces

Inventor: Ramin Farjadrad (Los Altos, CA)
G06F13/36
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Quick Facts
Patent No.
US 10,572,416
App. No.
15/364,030
Granted
Feb 25, 2020
Kind
B1
Abstract

A master integrated circuit (IC) chip includes transmit circuitry and receiver circuitry. The transmit circuitry includes a timing signal generation circuit to generate a first timing signal, and a driver to transmit first data in response to the first timing signal. A timing signal path routes the first timing signal in a source synchronous manner with the first data. The receiver circuitry includes a receiver to receive second data from a slave IC chip, and sampling circuitry to sample the second data in response to a second timing signal that is derived from the first timing signal.

Claims (63)

1. A master integrated circuit (IC) chip, comprising:

transmit circuitry including

a timing signal generation circuit to generate a first timing signal,

a data pin for coupling to a data path,

a driver to transmit first data via the data pin in response to the first timing signal, and

a timing signal pin separate from the data signal pin, the timing signal pin for coupling to a timing signal path separate from the data path, the timing signal path to route the first timing signal in a source synchronous manner with the first data; and

receiver circuitry including

a receiver to receive second data from a slave IC chip, and

sampling circuitry to sample the second data in response to a second timing signal that is derived from the first timing signal.

2. The master IC chip according to claim 1 , further comprising:

a phase alignment circuit to adjust a phase of the first timing signal to generate the second timing signal.

3. The master IC chip according to claim 2 , wherein:

the phase alignment circuit comprises a clock vernier.

4. The master IC chip according to claim 3 , wherein:

the second data is received at a symbol rate that is greater than 10GBaud.

5. The master IC chip according to claim 1 , wherein:

the second timing signal is derived from the first timing signal and received from the slave IC chip.

6. The master IC chip according to claim 5 , wherein:

the first timing signal and the second timing signal are transmitted between the master IC chip and the slave IC chip via a bidirectional link.

7. The master IC chip according to claim 1 , wherein:

the master IC chip comprises a serializer-deserializer (SerDes) core IC chip, and the slave IC chip comprises a network switch IC chip.

8. The master IC chip according to claim 1 , wherein:

the timing signal generator comprises a clock generator to generate a double-data-rate (DDR) clock.

9. A multi-chip module (MCM), comprising:

a chip substrate;

a master integrated circuit (IC) chip mounted to the chip substrate, the master IC chip comprising

transmit circuitry including

a timing signal generation circuit to generate a first timing signal,

a data pin for coupling to a data path,

a driver to transmit first data via the data pin in response to the first timing signal, and

a timing signal path separate from the data path to route the first timing signal in a source synchronous manner with the first data; and

a slave IC chip mounted to the chip substrate and coupled to the master IC chip via a data link, the slave IC chip including

a receiver to receive the first data from the master IC chip, and to sample the first data in response to the first timing signal, and

a transmitter to transmit second data to the master IC chip; and

wherein the master IC chip further comprises

receiver circuitry to receive the second data from the slave IC chip, and

sampling circuitry to sample the second data in response to a second timing signal that is derived from the first timing signal.

10. The master IC chip according to claim 9 , wherein the master IC chip further comprises:

a phase alignment circuit to adjust a phase of the first timing signal to generate the second timing signal.

11. The master IC chip according to claim 10 , wherein:

the phase alignment circuit comprises a clock vernier.

12. The master IC chip according to claim 11 , wherein:

the second data is received at a symbol rate that is greater than 10GBaud.

13. The master IC chip according to claim 9 , wherein:

the second timing signal is derived from the first timing signal and received from the slave IC chip.

14. The master IC chip according to claim 13 , wherein:

the first timing signal and the second timing signal are transmitted between the master IC chip and the slave IC chip via a bidirectional link.

15. The master IC chip according to claim 9 , wherein:

the master IC chip comprises a serializer-deserializer (SerDes) core IC chip, and the slave IC chip comprises a network switch IC chip.

16. The master IC chip according to claim 9 , wherein:

the timing signal generator comprises a clock generator to generate a double-data-rate (DDR) clock.

17. A method of operation in a master integrated circuit (IC) chip, the method comprising:

generating a first timing signal;

transmitting first data via a data pin in response to the first timing signal, and

transmitting the first timing signal via a timing signal pin in a source synchronous manner with the first data to a slave IC chip, the timing signal pin separate from the data pin;

receiving second data from the slave IC chip; and

sampling the second data in response to a second timing signal that is derived from the first timing signal.

18. The method according to claim 17 , further comprising:

receiving the second timing signal from the slave IC chip.

19. The method according to claim 17 , further comprising:

phase aligning the first timing signal to generate the second timing signal.

20. The method according to claim 19 , wherein:

the phase aligning is carried out in the master IC chip.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053179/0320 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2020
From: AQUANTIA CORPORATION
To: CAVIUM INTERNATIONAL
Reel/Frame 051945/0520 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2017
From: FARJAD, RAMIN
To: AQUANTIA CORPORATION
Reel/Frame 044250/0291 →
Continuity (2)
Provisional Application 62314237 · Mar 28, 2016
Provisional Application 62341871 · May 26, 2016