Interconnects through dielectric vias
A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer away from a raised feature. An interconnect is in contact with the raised feature through the reflow via.
1. An apparatus comprising:
a first metal layer;
a raised feature disposed on the first metal layer;
a dielectric layer disposed on the first metal layer;
a reflow via extending through the dielectric layer to an exposed region on the raised feature of the first metal layer and formed by reflow of the dielectric layer away from the region; and
an interconnect in contact with the first metal layer through the reflow via,
wherein the dielectric layer includes a first region and a second region, wherein the first region is geometrically distinct from and larger in surface area than the second region, and wherein the reflow via is formed in the first region based on an increased rate of etch of the first region compared to the second region.
2. The apparatus of claim 1 , wherein the dielectric layer is reflowable upon reaching a glass transition temperature (Tg).
3. The apparatus of claim 1 , wherein the raised feature is a dome.
4. The apparatus of claim 1 , wherein the dielectric layer is electrodepositable based on an electrophoretic effect to cause the dielectric layer to attach to metal.
5. The apparatus of claim 1 , further comprising a substrate including a containment region to contain reflow of the dielectric layer.
6. The apparatus of claim 1 , further comprising a substrate including a plurality of levels to receive the first metal layer, the dielectric layer, and the interconnect, wherein the interconnect spans across the plurality of levels.
7. The apparatus of claim 6 , wherein the plurality of levels are provided as a three dimensional patterned structure that is formable self-aligned in the substrate.
8. The apparatus of claim 1 , wherein the interconnect is formed by a second metal layer, and the apparatus further comprises a crossover formed by the second metal layer disposed on the dielectric layer to provide an electrical conduction path across the dielectric layer.
9. The apparatus of claim 1 , wherein the raised feature extends above a top surface of the dielectric layer adjacent the raised feature.
10. The apparatus of claim 1 , wherein dielectric layer extends on opposite sides of the raised feature and wherein the raised feature extends above a top surface of portions of the dielectric layer on opposite sides of the raised feature.
11. The apparatus of claim 1 , wherein the dielectric layer continuously surrounds the raised feature and wherein the raised feature extends above portions of the top surface of the dielectric layer continuously surrounding and extending adjacent to the raised feature.
12. An apparatus comprising:
a raised feature;
a first metal layer, wherein the raised feature is disposed on the first metal layer;
a dielectric layer disposed on the raised feature;
a reflow via disposed in the dielectric layer at the raised feature, the reflow via formed by reflow of the dielectric layer away from the raised feature; and
an interconnect in contact with the raised feature through the reflow via.
13. The apparatus of claim 12 , further comprising a second metal layer disposed on the dielectric layer, wherein the interconnect is formed from the second metal layer.
14. The apparatus of claim 12 , wherein the raised feature extends above a top surface of the dielectric layer adjacent the raised feature.
15. The apparatus of claim 12 , wherein dielectric layer extends on opposite sides of the raised feature and wherein the raised feature extends above a top surface of portions of the dielectric layer on opposite sides of the raised feature.
16. The apparatus of claim 12 , wherein the dielectric layer continuously surrounds the raised feature and wherein the raised feature extends above portions of the top surface of the dielectric layer continuously surrounding and extending adjacent to the raised feature.
17. A method, comprising:
forming a dielectric layer on a raised portion of a first metal layer;
reflowing the dielectric layer away from the raised portion to form a reflow via extending to the raised portion of the first metal layer; and
forming an interconnect with the first metal layer at the reflow via,
wherein portions of the dielectric layer flow away from the raised portion with a containment wall rising above the dielectric layer.