Metal gate formation through etch back process
A method includes forming a dummy gate stack over a semiconductor region, forming a dielectric layer at a same level as the dummy gate stack, removing the dummy gate stack to form an opening in the dielectric layer, filling a metal layer extending into the opening, and etching back the metal layer, with remaining portions of the metal layer having edges lower than a top surface of the dielectric layer. The opening is filled with a conductive material, and the conductive material is over the metal layer. The metal layer and the conductive material in combination form a replacement gate. A source region and a drain region are formed on opposite sides of the replacement gate.
1. A method comprising:
forming a dummy gate stack over a semiconductor region;
forming a dielectric layer at a same level as the dummy gate stack;
removing the dummy gate stack to form an opening in the dielectric layer;
forming a plurality of metal layers extending into the opening, wherein the plurality of metal layers are formed of different materials, and the plurality of metal layers comprise a bottom layer, a middle layer over the bottom layer, and a top layer over the middle layer;
forming a sacrificial layer over the plurality of metal layers, wherein the sacrificial layer is filled into the opening; and
etching back the plurality of metal layers, wherein remaining portions of the plurality of metal layers have edges lower than a top surface of the dielectric layer, wherein after the etching back, the plurality of metal layers have slanted top surfaces, and a top edge of the middle layer has a topmost point higher than top edges of the bottom layer and the top layer;
filling the opening with a conductive material, wherein the conductive material is over the plurality of metal layers, wherein the metal layer and the conductive material in combination form a replacement gate; and
forming a source region and a drain region, wherein the source region and the drain region are on opposite sides of the replacement gate.
2. The method of claim 1 , wherein the filling the sacrificial layer comprises applying a photo resist.
3. The method of claim 1 , wherein the plurality of metal layers comprise a work-function layer.
4. The method of claim 1 , wherein the plurality of metal layers are etched to have a remaining height smaller than about 80 percent of a depth of the opening.
5. The method of claim 1 further comprising forming gate spacers on opposite sides of the dummy gate stack.
6. A method comprising:
forming a dummy gate stack on a semiconductor region;
forming gate spacers on sidewalls of the dummy gate stack;
forming source and drain regions on opposite sides of the dummy gate stack;
forming an inter-layer dielectric to cover the source and drain regions;
removing the dummy gate stack to form an opening;
forming a gate dielectric layer extending into the opening;
forming a plurality of metal-containing layers over the gate dielectric layer, wherein the plurality of metal-containing layers comprises a first portion in the opening, and a second portion outside of the opening;
forming a sacrificial layer over the metal-containing layer, wherein the sacrificial layer is filled into the opening;
removing the second portion and etching back the first portion of the plurality of metal-containing layers, wherein the sacrificial layer is etched simultaneously when the plurality of metal-containing layers are etched back, and after the etching back, at least one of the plurality of metal-containing layers has a top surface, and the top surface has inner portions being increasingly lower than respective outer portions, and the inner portions are closer to a center line of the opening than the outer portions; and
filling remaining opening with a conductive material.
7. The method of claim 6 , wherein the forming the plurality of metal-containing layers comprises depositing a plurality of metal layers comprising a work-function layer.
8. The method of claim 6 , wherein the forming the plurality of metal-containing layers is performed using atomic layer deposition.
9. The method of claim 6 , wherein the removing the second portion is performed by etching.
10. The method of claim 6 further comprising, after etching the plurality of metal-containing layers, removing remaining portions of the sacrificial layer.
11. A device comprising:
gate spacers;
an opening between the gate spacers;
a gate dielectric lining the opening;
a metal-containing layer over a bottom portion of the gate dielectric, wherein the metal-containing layer comprises a bottom portion at a bottom of the opening, and sidewall portions connected to ends of the bottom portion, wherein top edges of the sidewall portions are lower than top edges of the gate spacers, wherein the metal-containing layer comprises:
a plurality of metal layers formed of different materials, wherein the plurality of metal layers comprise three layers, with a top edge of a middle layer in the plurality of metal layers having a topmost point higher than top edges of a lower layer under the middle layer and an upper layer over the middle layer, the top edges of the plurality of metal layers are slanted; and
a conductive material over the metal-containing layer, wherein the conductive material is in the opening, and has a top surface higher than the top edges of the sidewall portions of the metal-containing layer.
12. The device of claim 11 , wherein the metal-containing layer is a substantially conformal layer, and wherein the bottom portion and the sidewall portions of the metal-containing layer have substantially a same thickness.
13. The device of claim 11 , wherein the conductive material comprises a work-function metal, with the conductive material determining a work function of a respective transistor.
14. The device of claim 13 , wherein the work-function metal has a top edge substantially coplanar with top edges of the gate spacers.
15. The method of claim 6 , wherein the plurality of metal layers comprise a bottom layer, a middle layer over the bottom layer, and a top layer over the middle layer, and wherein a top edge of the bottom layer has a top edge lower than top edges of the middle layer and the top layer.
16. The method of claim 6 , wherein plurality of metal layers comprise three layers, with a top edge of a middle layer in the plurality of metal layers having a top edge higher than top edges of a lower layer under the middle layer and an upper layer over the middle layer.
17. The method of claim 1 , wherein top edges of the top layer, the middle layer, and the bottom layer continuously drop from the topmost point to locations farther away from the topmost point.
18. The device of claim 11 , wherein top edges of the upper layer, the middle layer, and the lower layer continuously drop from the topmost point to locations farther away from the topmost point.
19. The method of claim 1 , wherein the conductive material is in contact with each of the top layer, the middle layer, and the bottom layer.
20. The device of claim 11 , wherein the conductive material is in contact with each of the upper layer, the middle layer, and the lower layer.