Substrate for camera module and camera module having the same

1. A substrate for a camera module, the substrate comprising:

a first substrate;

an image sensor installed on the first substrate so as to be disposed below a lens; and

a memory chip embedded in the first substrate,

wherein the first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion,

at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion,

the hard substrate portion disposed on the upper portion of the soft substrate portion includes a via for a connection with the memory chip, and

the memory chip includes a connection pad exposed to a top surface of the memory chip to be connected to the via.

2. The substrate for a camera module of claim 1 , wherein a mounting groove connecting the hard substrate portion disposed on the lower portion of the soft substrate portion to the hard substrate portion disposed on the upper portion of the soft substrate portion, through the soft substrate portion, is formed in the first substrate.

3. The substrate for a camera module of claim 2 , wherein a resin layer is formed in a space formed by the installation hole and the memory chip.

4. The substrate for a camera module of claim 1 , wherein a reinforcement plate is installed on a bottom surface of the first substrate.

5. A camera module comprising:

a lens barrel in which at least one lens is installed; and

the substrate for a camera module of claim 1 on which the lens barrel is installed and in which an image sensor is disposed below the lens.