Component incorporating substrate and method for manufacturing component incorporating substrate

1. A component incorporating substrate comprising:

a laminated body including a plurality of thermoplastic insulating base members each including conductors on only one surface thereof and laminated in a lamination direction, the plurality of insulating base layers including a first insulating base member including a first conductor only on one surface thereof and a second insulating base member including a second conductor only on one surface thereof;

a first electronic component and a second electronic component each disposed inside the laminated body and including a mounting terminal on one surface thereof; and

a common conductor pattern connected to the first electronic component and the second electronic component; wherein

the common conductor pattern is disposed between the first electronic component and the second electronic component in the lamination direction;

in the first insulating base member, a first conductor-less surface which is opposite to the main surface including the first conductor abuts the first electronic component, and an interlayer connection conductor is located at a position overlapping with the first conductor to connect the mounting terminal of the first electronic component to the first conductor;

in the second insulating base member, a second conductor-less surface which is opposite to the main surface including the second conductor abuts the second electronic component, and an interlayer connection conductor is located at a position overlapping with the second conductor to connect the mounting terminal of the second electronic component to the second conductor;

the first insulating base member is disposed with the main surface including the first conductor abutting on the second insulating base member in the lamination direction;

the second insulating base member is disposed with the main surface including the second conductor abutting on the first insulating base member in the lamination direction; and

the first insulating base member and the second insulating base member are heat-pressure-bonded.

2. The component incorporating substrate according to claim 1 , wherein an abutment portion between the first conductor and the second conductor is located in a region between the first electronic component and the second electronic component in the lamination direction, and an alloy layer is located between the first conductor and the second conductor.

3. The component incorporating substrate according to claim 1 , wherein the first conductor is the common conductor pattern.

4. The component incorporating substrate according to claim 1 , wherein each of the plurality of thermoplastic insulating base members is made of liquid crystalline polymer and includes copper provided only on the one surface thereof to define the conductor.

5. The component incorporating substrate according to claim 1 , wherein thermoplastic insulating base members of a first group of the plurality of thermoplastic insulating base members have an equal or substantially equal size, and thermoplastic insulating base members of a second group of the plurality of thermoplastic insulating base members have an equal or substantially equal size smaller than that of the thermoplastic insulating base members of the first group of the plurality of thermoplastic insulating base members.

6. The component incorporating substrate according to claim 1 , wherein the laminated body includes a first portion that has flexibility, and a second portion has substantially no flexibility and defines a rigid portion.

7. The component incorporating substrate according to claim 6 , wherein the first and second electronic components are located in the rigid portion.

8. The component incorporating substrate according to claim 1 , wherein the first electronic component overlaps with the second electronic component.

9. The component incorporating substrate according to claim 1 , wherein the mounting terminal of the first electronic component overlaps with the mounting terminal of the second electronic component.

10. The component incorporating substrate according to claim 1 , wherein the common conductor pattern is connected to the mounting terminal of the first electronic component through the interlayer connection conductor.

11. The component incorporating substrate according to claim 1 , wherein the first and second electronic components are connected to the common conductor pattern only though one of the insulating base members.

12. The component incorporating substrate according to claim 1 , wherein at least two of the plurality of insulating base members do not include any conductor on surfaces thereof, and the at least two of the plurality of insulating base members are located on opposite ends of the laminated body.

13. The component incorporating substrate according to claim 1 , wherein the laminated body includes at least two first portions each with flexibility, and at least one second portion has substantially no flexibility and defines a rigid portion, and the at least two first portions are located on both sides of the rigid portion.

14. The component incorporating substrate according to claim 13 , wherein the first and second electronic components are located in the rigid portion.

15. The component incorporating substrate according to claim 1 , wherein the first and second electronic components only partially overlap with each other when seen in a planar view.

16. A method for manufacturing a component incorporating substrate, the method comprising the steps of:

preparing a plurality of thermosetting insulating base members each including a conductor on only one surface thereof, the plurality of insulating base members including a first insulating base member including a first conductor only on one surface thereof and a second insulating base member including a second conductor only on one surface thereof;

forming a through hole at a position overlapping with the first conductor, in the first insulating base member, and filling the through hole with electrically-conductive paste;

forming a through hole at a position overlapping with the second conductor, in the second insulating base member, and filling the through hole with electrically-conductive paste;

laminating the plurality of insulating base members in a lamination direction such that a first conductor-less surface which is opposite to the main surface including the first conductor of the first insulating base member abuts a mounting terminal-exposed surface of a first electronic component, a second conductor-less surface which is opposite to the main surface including the second conductor of the second insulating base member abuts a mounting terminal-exposed surface of a second electronic component, the main surface including the first conductor of the first insulating base member abuts the second insulating base member, and the main surface including the second conductor of the second insulating base member abuts the first insulating base member; and

heating the laminated plurality of insulating base members under pressure applied in the lamination direction.

17. The method according to claim 16 , wherein each of the plurality of thermoplastic insulating base members is made of liquid crystalline polymer and includes copper provided only on the one surface thereof to define the conductor.

18. The method according to claim 16 , wherein thermoplastic insulating base members of a first group of the plurality of thermoplastic insulating base members have an equal or substantially equal size, and thermoplastic insulating base members of a second group of the plurality of thermoplastic insulating base members have an equal or substantially equal size smaller than that of the thermoplastic insulating base members of the first group of the plurality of thermoplastic insulating base members.

19. The method according to claim 16 , wherein the laminated body includes a first portion that has flexibility, and a second portion has substantially no flexibility and defines a rigid portion.

20. The method according to claim 19 , wherein the first and second electronic components are located in the rigid portion.