Semiconductor device including barrier layer and manufacturing method thereof
View Patent ↗A manufacturing method of a semiconductor device includes the following steps. A barrier layer is formed in a first region and a second region of a semiconductor substrate. The barrier layer formed in the first region is thinned before a step of forming a first work function layer on the barrier layer. The first work function layer formed on the first region is then removed. The process of thinning the barrier layer in the first region and the process of removing the first work function layer in the first region are performed separately for ensuring the coverage of the first work function layer in the second region. The electrical performance of the semiconductor device and the uniformity of the electrical performance of the semiconductor device may be improved accordingly.
1. A semiconductor device, comprising:
a first conductivity type transistor comprising:
a first gate structure comprising a first barrier layer; and
a first part of a first conductivity type work function layer; and
a second conductivity type transistor disposed adjacent to the first conductivity type transistor, wherein the second conductivity type transistor comprises:
a second gate structure, wherein the first gate structure is directly connected to the second gate structure, and the second gate structure comprises:
a second barrier layer, wherein the first barrier layer is thinner than the second barrier layer, the first barrier layer and the second barrier layer are directly connected with each other, and a step structure is formed at a juncture of the first barrier layer and the second barrier layer; and
a second conductivity type work function layer disposed on the second barrier layer and a part of the first barrier layer, wherein the second conductivity type work function layer covers the step structure; and
a second part of the first conductivity type work function layer, wherein the first part of the first conductivity type work function layer is directly connected with the second part of the first conductivity type work function layer.
2. The semiconductor device of claim 1 , wherein the first part of the first conductivity type work function layer is disposed on the first barrier layer, and the second part of the first conductivity type work function layer is disposed on the second conductivity type work function layer.
3. The semiconductor device of claim 1 , wherein the first conductivity type transistor comprises an N type transistor, the second conductivity type transistor comprises a P type transistor, and the second conductivity type work function layer comprises a P type work function layer.