IP Library › Granted Patent US 10,135,419
Granted Patent B2
US 10,135,419 · App. 15/375,360 · Granted Nov 20, 2018

Surface acoustic wave device

Inventors: Yasuhiko Hirano (Nagaokakyo, JP); Daisuke Sekiya (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H9/0576H03H9/02897H03H9/059H03H9/1064H03H9/1092
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Quick Facts
Patent No.
US 10,135,419
App. No.
15/375,360
Granted
Nov 20, 2018
Kind
B2
Abstract

A surface acoustic wave device includes a piezoelectric substrate, an IDT electrode, support layers, and a cover layer. A distance from a first end of a first partition-support layer to one of the outer-periphery-frame support layers closest to the first end is smaller than a distance from a second end of the first partition-support layer to one of the outer-periphery-frame support layers closest to the second end, and a distance from a first end of a second partition-support layer to one of the outer-periphery-frame support layers closest to the first end is larger than a distance from a second end of the second partition-support layer to one of the outer-periphery-frame support layers closest to the second end.

Claims (31)

1. A surface acoustic wave device comprising:

a piezoelectric substrate;

an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate and that excites a surface acoustic wave;

support layers each of which is vertically arranged in a region of the main surface of the piezoelectric substrate other than a region in which the interdigital transducer electrode is disposed, and each of the support layers has a height larger than a height of the interdigital transducer electrode; and

a cover layer that is disposed on the support layers and that covers the interdigital transducer electrode with a hollow space interposed between the cover layer and the interdigital transducer electrode; wherein

the support layers include:

a plurality of outer-periphery-frame support layers that are vertically arranged on the main surface of the piezoelectric substrate around a periphery of the region in which the interdigital transducer electrode is disposed; and

a plurality of partition-support layers each of which is vertically arranged in a region of the main surface, the region being surrounded by the outer-periphery-frame support layers, the plurality of partition-support layers extending, when the piezoelectric substrate is viewed in plan, straight or substantially straight in a first direction, which is parallel or substantially parallel to the main surface, and being arranged in a second direction parallel or substantially parallel to the main surface and perpendicular or substantially perpendicular to the first direction; and

the plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other in an arrangement of the plurality of partition-support layers and that have a characteristic described below:

when the piezoelectric substrate is viewed in plan, where an end of the first partition-support layer and an end of the second partition-support layer that are oriented in the first direction are referred to as first ends, and another end of the first partition-support layer and another end of the second partition-support layer that are oriented in a direction opposite to the first direction are referred to as second ends, a distance from the first end of the first partition-support layer to one of the outer-periphery-frame support layers that is closest to the first end of the first partition-support layer is smaller than a distance from the second end of the first partition-support layer to one of the outer-periphery-frame support layers that is closest to the second end of the first partition-support layer, and a distance from the first end of the second partition-support layer to one of the outer-periphery-frame support layers that is closest to the first end of the second partition-support layer is larger than a distance from the second end of the second partition-support layer to one of the outer-periphery-frame support layers that is closest to the second end of the second partition-support layer.

2. The surface acoustic wave device according to claim 1 , wherein a portion of the first partition-support layer and a portion of the second partition-support layer are superposed with each other when viewed from the second direction.

3. The surface acoustic wave device according to claim 2 , wherein a region in which the portion of the first partition-support layer and the portion of the second partition-support layer are superposed with each other has a length of about 30 μm or smaller in the first direction.

4. The surface acoustic wave device according to claim 1 , wherein the first partition-support layer and the second partition-support layer are separated from each other by a predetermined distance in the first direction when viewed from the second direction.

5. The surface acoustic wave device according to claim 4 , wherein the predetermined distance is about 30 μm or smaller.

6. The surface acoustic wave device according to claim 1 , further comprising solder bumps exposed at an outer surface of the cover layer.

7. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode defines a transmission filter.

8. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode defines a reception filter.

9. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode defines a duplexer.

10. The surface acoustic wave device according to claim 1 , wherein the piezoelectric substrate is made of a piezoelectric single crystal.

11. The surface acoustic wave device according to claim 10 , wherein the piezoelectric single crystal is one of lithium tantalate, lithium niobate, and quartz crystal.

12. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode is made of Ti, Al, Cu, Au, Pt, Ag, Pd, or Ni, or an alloy thereof.

13. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode is covered by a protective film made of a dielectric material.

14. The surface acoustic wave device according to claim 1 , wherein the support layers are made of a material including at least one of a polyimide, an epoxy resin, benzocyclobutene, polybenzoxazole, a metal, and silicon oxide.

15. The surface acoustic wave device according to claim 1 , wherein the plurality of partition-support layers do not extend to any of the outer-periphery-frame support layers.

16. The surface acoustic wave device according to claim 1 , wherein the cover layer has a multilayer structure including a lower layer that is made of a material including at least one of an epoxy resin, urethane, phenol, a polyester, benzocyclobutene, and polybenzoxazole and an upper layer that is made of a material including at least one of a polyimide, an epoxy resin, benzocyclobutene, polybenzoxazole, silicon, a silicon oxide, lithium tantalate, and lithium niobate.

17. The surface acoustic wave device according to claim 1 , further comprising:

a reception filter;

a transmission filter;

an intermediate region disposed between the reception filter and the transmission filter; wherein

the reception filter and the transmission filter are defined by the interdigital transducer electrode.

18. The surface acoustic wave device according to claim 17 , wherein the first partition-support layer and the second partition-support layer are disposed in the intermediate region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2016
From: HIRANO, YASUHIKO; SEKIYA, DAISUKE
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 040708/0851 →
Priority Claims (1)
JP 2015-252619 · Dec 24, 2015 · national
Continuity (1)
Related Publication 20170187353A1 · Jun 29, 2017
Cited By (1)
US 12,537,505