Methods and systems to improve printed electrical components and for integration in circuits
Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing.
1. An integrated circuit, comprising:
a circuit die;
a lid covering a top surface of the circuit die;
a ceramic matrix packaging, and
wherein the ceramic matrix packaging comprises at least one of an embedded resistor, capacitor, inductor, and multi-property device disposed within the ceramic matrix packaging,
wherein formation of the integrated circuit is specified by successive additions of a plurality of voxels of material through a deposit of droplets, and
wherein the at least one of an embedded resistor, capacitor, inductor, and multi-property device is oriented at an angle to minimize a parasitic effect.
2. The integrated circuit of claim 1 , further comprising:
wherein the at least one of an embedded resistor, capacitor, inductor, and multi-property device is oriented at an angle to optimize space usage of the ceramic matrix.
3. The integrated circuit of claim 1 , further comprising:
wherein the multi-property device comprises at least one helical coil encased in a cylindrical housing, and
wherein the cylindrical housing comprises barium titanate.
4. The integrated circuit of claim 3 , further comprising:
wherein the multi-property device comprises four electrodes, and
wherein inductance-capacitance properties is based on electrode pairs.
5. The integrated circuit of claim 1 , further comprising:
wherein capacitance, resistance, and inductance of the multi-property device are adjustable based on at least one of an intermediate shape and an intermediate ink.
6. The integrated circuit of claim 1 , further comprising:
wherein the resistor comprises a Z-shape, a U-shape, a S-shape, a smooth S-shape, or a crescent-shape.
7. The integrated circuit of claim 1 , further comprising:
wherein a core of the inductor comprises ferromagnetic material.
8. The integrated circuit of claim 1 , further comprising:
wherein the inductor comprises a helical coil, and
wherein the inductor does not comprise a core.
9. The integrated circuit of claim 1 , further comprising:
wherein the ceramic matrix packaging comprises at least one air gap disposed between a pair of the at least one of an embedded resistor, capacitor, inductor, and multi-property device.
10. An integrated circuit, comprising:
a circuit die;
a ceramic matrix packaging,
wherein the ceramic matrix packaging comprises at least one of an embedded resistor, capacitor, inductor, and multi-property device disposed within the ceramic matrix packaging; and
a conductive cage encapsulating the at least one of an embedded resistor, capacitor, inductor, and multi-property device
wherein the conductive cage comprises a general shape of the at least one of an embedded resistor, capacitor, inductor, and multi-property device to which it encapsulates,
wherein the conductive cage is larger in size than the at least one of an embedded resistor, capacitor, inductor, and multi-property device to which it encapsulates,
wherein the conductive cage is one voxel thick, and
wherein a distance between a pair of the at least one of an embedded resistor, capacitor, inductor, and multi-property device is less than 10 microns.
11. The integrated circuit of claim 10 , further comprising:
wherein the conductive cage comprises two openings, and
wherein the openings are larger in diameter than electrodes of the at least one of an embedded resistor, capacitor, inductor, and multi-property device.
12. The integrated circuit of claim 10 , further comprising:
wherein the conductive cage is grounded to the lid or a circuit board.
13. An integrated circuit, comprising:
a circuit die;
a lid covering a top surface of the circuit die;
a ceramic matrix packaging,
wherein the ceramic matrix packaging comprises at least one of an embedded resistor, a capacitor, an inductor, and a multi-property device disposed within the ceramic matrix packaging;
a conductive plane disposed between the at least one of an embedded resistor, capacitor, inductor, and multi-property device to shield magnetic flux; and
a circuit board, and
wherein the conductive plane is one voxel thick.
14. The integrated circuit of claim 13 , further comprising:
wherein the conductive plane is grounded to the lid or the circuit board.
15. An integrated circuit, comprising:
a circuit die;
a lid covering a top surface of the circuit die;
a ceramic matrix packaging, and
wherein the ceramic matrix packaging comprises at least one of an embedded resistor, capacitor, inductor, and multi-property device disposed within the ceramic matrix packaging, and
wherein the integrated circuit is formed as a single structure,
wherein the at least one embedded resistor capacitor, inductor, and multi-property device is sintered to the ceramic matrix packaging.