IP Library Granted Patent US 9,903,016
Granted Patent B2
US 9,903,016 · App. 15/389,964 · Granted Feb 27, 2018

Device having preformed triple junctions to maintain electrode conductivity and a method for making and using the device

Inventor: Michael Vella (San Leandro, CA)
Assignee: E/G Electro-Graph, Inc.
C23C14/48C23C14/048H01B5/14H01B7/17H01B13/06
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Quick Facts
Patent No.
US 9,903,016
App. No.
15/389,964
Granted
Feb 27, 2018
Kind
B2
Abstract

In systems where insulating deposits form during normal operation, electrodes are configured with a preformed dielectric thereon, wherein the preformed dielectric is formed with a geometric feature that preforms a triple junction. These triple junctions enhance low level discharge activity to facilitate localized breakdown of the deposits and maintain electrode conductivity.

Claims (26)

1. A method of making an electrode, comprising the steps of:

preforming a dielectric layer on a surface of the electrode, the dielectric layer including at least one geometric feature configured to overshadow a portion of the surface of the electrode to create a triple junction at a resulting electrode/dielectric/vacuum interface; and

shielding, with the geometric feature, the portion of the surface from exposure to deposit forming particles in use to maintain the triple junction.

2. The method of claim 1 , wherein said at least one geometric feature is an array of geometric features configured to shield a plurality of portions of the electrode surface from exposure to the deposit forming particles in use.

3. The method of claim 1 , further comprising the steps of:

determining a directionality of the deposit forming particles in an environment in which the electrode is to be used; and

configuring the geometric feature to shield the portion of the electrode surface from deposit forming particles from the determined direction.

4. The method of claim 1 , further comprising the step of forming in situ triple junctions on the electrode during use.

5. The method of claim 1 , further comprising the step of preforming, before use, a conductive shield over the dielectric layer, the conductive shield overhanging at least a portion of the dielectric layer and the electrode.

6. The method of claim 1 , wherein said geometric feature is an angled end face of the dielectric layer.

7. The method of claim 6 , further comprising the step of preforming a conductive shield over the dielectric layer, the conductive shield overhanging at least a portion of the dielectric layer and at least a portion of the electrode surface.

8. The method of claim 7 , wherein said angled end face has a first angled portion forming a electrode/dielectric/vacuum interface triple junction and a second angled portion not collinear with the first angled portion forming a second triple junction at the conductive shield/dielectric/vacuum interface.

9. An electrode having a surface comprising:

a preformed dielectric layer on a surface of the electrode;

the preformed dielectric layer including at least one geometric feature creating a triple junction at an electrode/dielectric/vacuum interface, the at least one geometric feature configured to overshadow a portion of the electrode surface and shield the portion of the electrode from exposure to deposit forming particles in use.

10. The electrode of claim 9 , wherein said at least one geometric feature is an array of said at least one geometric features.

11. The electrode of claim 9 , wherein the at least one geometric feature is an angled end face of said dielectric layer.

12. The electrode of claim 9 , further comprising a conductive shield disposed over the dielectric layer, the conductive shield overhanging at least a portion of the dielectric layer.

13. The electrode of claim 12 , wherein said at least one geometric feature is an angled end face of said dielectric layer having a first angled portion forming said electrode/dielectric/vacuum interface triple junction and a second angled portion not collinear with the first angled portion forming a second triple junction at a conductive shield/dielectric/vacuum interface.

14. A method of generating a localized breakdowns of deposits formed on a surface of an electrode, comprising the steps of :

providing an electrode according to claim 9 ;

orienting the electrode in a high voltage system with the dielectric layer positioned for exposure to deposit forming particles;

said at least one triple junction generating, when the system is in use, localized discharge activity to breakdown at least a portion of the deposits on said electrode.

15. The method of claim 14 , wherein the at least one geometric feature is an array of the at least one geometric features.

16. The method of claim 14 , wherein the electrode further comprises a conductive shield disposed over the dielectric layer, the conductive shield overhanging at least a portion of the dielectric layer.

17. The method of claim 16 , wherein said at least one geometric feature is an angled end face of said dielectric layer having a first angled portion forming said electrode/dielectric/vacuum interface triple junction and a second angled portion not collinear with the first angled portion forming a second triple junction at a conductive shield/dielectric/vacuum interface.

Assignments (3)
ASSIGNEE ADDRESS CHANGE Recorded Jul 19, 2023
From: PLANSEE USA LLC
To: PLANSEE USA LLC
Reel/Frame 064335/0974 →
MERGER Recorded Mar 16, 2023
From: E/G ELECTRO-GRAPH, INC.
To: PLANSEE USA LLC
Reel/Frame 063002/0638 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2016
From: VELLA, MICHAEL
To: E/G ELECTRO-GRAPH, INC.
Reel/Frame 041189/0584 →
Continuity (3)
Continuation In Part 14921611 · Oct 23, 2015
Provisional Application 62067693 · Oct 23, 2014
Related Publication 20170107608A1 · Apr 20, 2017