Electronic device
An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.
1. An electronic device comprising:
a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode; and
an external terminal electrically connected to the terminal electrode,
wherein the external terminal comprises:
a terminal electrode connection part arranged to face the terminal electrode; and
a mounting connection part connectable to a mounting surface,
the terminal electrode connection part comprises a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal,
a thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body, and
the multilayer structure comprises a planar three-layer multilayer clad metal plate material.
2. An electronic device according to claim comprising:
a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode; and
an external terminal electrically connected to the terminal electrode,
wherein the external terminal comprises:
a terminal electrode connection part arranged to face the terminal electrode; and
a mounting connection part connectable to a mounting surface,
the terminal electrode connection part comprises a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal,
a thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body,
a thermal expansion coefficient of the first metal by itself is larger than that of the ceramic element body,
a thermal expansion coefficient of the second metal by itself is smaller than that of the ceramic element body, and
a thermal expansion coefficient of the third metal by itself is larger than that of the ceramic element body.
3. The electronic device according to claim 2 , wherein
a constitution ratio of the second metal in the external terminal is 40% or more.
4. An electronic device comprising:
a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode; and
an external terminal electrically connected to the terminal electrode,
wherein the external terminal comprises:
a terminal electrode connection part arranged to face the terminal electrode; and
a mounting connection part connectable to a mounting surface,
the terminal electrode connection part comprises a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal,
a thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body,
a thermal expansion coefficient of the first metal by itself is smaller than that of the ceramic element body,
a thermal expansion coefficient of the second metal by itself is larger than that of the ceramic element body, and
a thermal expansion coefficient of the third metal by itself is smaller than that of the ceramic element body.
5. The electronic device according to claim 4 , wherein
a constitution ratio of the second metal in the external terminal is 50% or less.
6. An electronic device comprising:
a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode; and
an external terminal electrically connected to the terminal electrode,
wherein the external terminal comprises:
a terminal electrode connection part arranged to face the terminal electrode; and
a mounting connection part connectable to a mounting surface,
the terminal electrode connection part comprises a multilayer structure of a first metal connected to the terminal electrode and a second metal arranged outside the first metal,
a thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body,
a thickness of the first metal is 10 μm or more,
the thickness of the first metal is smaller than that of the second metal,
a constitution ratio of the second metal in the external terminal is 40% or more,
a thermal expansion coefficient of the first metal by itself is larger than that of the ceramic element body, and
a thermal expansion coefficient of the second metal by itself is smaller than that of the ceramic element body.
7. The electronic device according to claim 1 , wherein
a metal coating film by plating is formed on surfaces of the external terminal.