Method to grow thin epitaxial films at low temperature
Implementations of the present disclosure generally relate to methods for epitaxial growth of a silicon material on an epitaxial film. In one implementation, the method includes forming an epitaxial film over a semiconductor fin, wherein the epitaxial film includes a top surface having a first facet and a second facet, and forming an epitaxial layer on at least the top surface of the epitaxial film by alternatingly exposing the top surface to a first precursor gas comprising one or more silanes and a second precursor gas comprising one or more chlorinated silanes at a temperature of about 375° C. to about 450° C. and a chamber pressure of about 5 Torr to about 20 Torr.
1. A method of processing a substrate in a processing chamber, comprising:
forming an epitaxial film over a semiconductor fin formed on the substrate, wherein the epitaxial film comprises a top surface having a first facet and a second facet, the first facet having an exposed {111} plane and the second facet having an exposed {111} plane; and
forming a conformal passivation layer on at least the top surface of the epitaxial film by alternatingly exposing the top surface to a first precursor gas comprising one or more silanes and a second precursor gas comprising one or more halogenated silanes at a temperature of about 425° C. or less and a chamber pressure of about 5 Torr to about 20 Torr.
2. The method of claim 1 , wherein the first precursor gas comprises silane (SiH 4 ), disilane (Si 2 H 6 ), trisilane (Si 3 H 8 ), tetrasilane (Si 4 H 10 ), or tetraethylorthosilicate (TEOS), or any combination thereof.
3. The method of claim 2 , wherein the second precursor gas comprises monochlorosilane (SiH 3 Cl), dichlorosilane (Si 2 H 2 Cl 2 ), trichlorosilane (SiHCl 3 ), hexachlorodisilane (Si 2 Cl 6 ), octachlorotrisilane (Si 3 Cl 8 ), or silicon tetrachloride (STC), or any combination thereof.
4. The method of claim 3 , wherein the first precursor gas is disilane and the second precursor gas is hexachlorodisilane (Si 2 Cl 6 ).
5. The method of claim 3 , wherein first precursor gas is silane (SiH 4 ) and the second precursor gas is hexachlorodisilane (Si 2 Cl 6 ).
6. The method of claim 1 , wherein the epitaxial film is silicon germanium (SiGe) having Ge concentration of about 30% or above in silicon.
7. The method of claim 1 , further comprising:
introducing a purge gas into the processing chamber between flowing of the first precursor gas and flowing of the second precursor gas.
8. The method of claim 7 , wherein the purge gas comprises helium, argon, nitrogen, hydrogen, or forming gas, or any combination thereof.
9. The method of claim 7 , further comprising:
pulsing flowing of the first precursor gas for about 5 seconds to about 25 seconds prior to flowing of the purge gas.
10. The method of claim 7 , further comprising:
pulsing flowing of the first precursor gas for about 350 seconds to about 550 seconds prior to flowing of the purge gas.
11. The method of claim 1 , wherein one end of the first facet and one end of the second facet are in contact with each other.
12. The method of claim 11 , further comprising:
before forming a conformal passivation layer on at least the top surface of the epitaxial film, removing a portion of the first facet and a portion of the second facet in a lateral dimension.
13. The method of claim 1 , wherein the epitaxial film and the conformal passivation layer are formed in the same processing chamber.
14. The method of claim 1 , further comprising:
after forming a conformal passivation layer on at least the top surface of the epitaxial film, forming a gate electrode over a portion of the conformal passivation layer.
15. The method of claim 1 , wherein the epitaxial film is pure germanium (Ge).
16. The method of claim 1 , wherein the epitaxial film is phosphorus doped silicon carbide (SiC:P).
17. The method of claim 1 , wherein the epitaxial film is phosphorus doped silicon (Si:P).
18. The method of claim 1 , wherein the epitaxial film is boron doped silicon germanium (SiGe:B).
19. A method of processing a substrate in a processing chamber, comprising:
forming an epitaxial film over a semiconductor fin formed on the substrate, wherein the epitaxial film comprises a top surface having a first facet and a second facet, the first facet having exposed {111} plane and the second facet having exposed {111} plane;
exposing the epitaxial film to a first precursor gas comprising silane (SiH 4 ) or disilane (Si 2 H 6 ) at a temperature of about 425° C. or less;
pulsing the first precursor gas for a first period of time;
introducing a purge gas into the processing chamber;
exposing the epitaxial film to a second precursor gas comprising chlorinated silanes at a temperature less than about 425° C. or less;
pulsing the second precursor gas for a second period of time; and
introducing the purge gas into the processing chamber.
20. The method of claim 19 , wherein the first period of time is about 5 seconds to about 25 seconds or about 350 seconds to about 550 seconds, and the second period of time is about 5 seconds to about 25 seconds or about 350 seconds to about 550 seconds.