Dielectric loaded metallic resonator
An apparatus, e.g. a cavity resonator, includes a floor and a cover. A conductive post is located between the floor and the cover and has a void oriented along a longitudinal axis of the post. A dielectric spacer is located between the cover and the post and a dielectric rod is located within the void. A resilient dielectric is located within the void between the dielectric spacer and the floor.
1. An apparatus, comprising:
a cavity having a floor and a cover;
a conductive cylindrical post having a void oriented along a longitudinal axis;
a dielectric spacer located between said cover and said post;
a dielectric rod located within said void; and
a resilient dielectric located within said void between said dielectric spacer and said floor; and
wherein said resilient dielectric is an “O” ring comprising an elastomeric material.
2. The apparatus of claim 1 , wherein said dielectric rod comprises polytetrafluoroethylene.
3. The apparatus of claim 1 , wherein said resilient dielectric is located between said floor and said dielectric rod.
4. The apparatus of claim 1 , wherein said cover and floor hold said resilient dielectric in compression.
5. The apparatus of claim 4 , wherein said dielectric spacer and said post are immobilized between said cover and said floor by said compression.
6. The apparatus of claim 1 , further comprising an air gap between said dielectric rod and said floor.
7. The apparatus of claim 1 , wherein said resilient dielectric comprises a porous foam.
8. The apparatus of claim 1 , wherein said dielectric spacer comprises a ceramic material.
9. An apparatus, comprising:
a cavity having a floor and a cover;
a conductive cylindrical post having a void oriented along a longitudinal axis;
a dielectric spacer located between said cover and said post;
a dielectric rod located within said void; and
a resilient dielectric located within said void between said dielectric spacer and said floor; and
wherein said resilient dielectric comprises a porous foam.
10. A method, comprising:
providing a cavity having a floor and walls, and a conductive cylindrical post on said floor having a void oriented along a longitudinal axis of said post, said post including a dielectric rod and a resilient dielectric within said void; and
compressing said resilient dielectric by attaching a cover of the cavity to the walls, thereby applying a force on said dielectric rod; and
wherein said resilient dielectric comprises a porous foam.
11. A method, comprising:
providing a cavity having a floor and walls, and a conductive cylindrical post on said floor having a void oriented along a longitudinal axis of said post, said post including a dielectric rod and a resilient dielectric within said void; and
compressing said resilient dielectric by attaching a cover of the cavity to the walls, thereby applying a force on said dielectric rod; and
wherein said resilient dielectric is an “O” ring comprising an elastomeric material.
12. The method of claim 11 , wherein said force is applied to said dielectric rod through a dielectric spacer between said dielectric rod and a top of said cavity.
13. The method of claim 11 , wherein said resilient dielectric is located between said floor and said dielectric rod.
14. The method of claim 11 , wherein said dielectric rod comprises a low-k dielectric material.
15. The method of claim 14 , wherein a dielectric spacer is located between said cover and said post, and said dielectric spacer is immobilized between said cover and said floor by said force.
16. The method of claim 11 , wherein said compressing comprises deforming said resilient dielectric into an air gap between said dielectric rod and said floor.
17. The method of claim 11 , wherein said resilient dielectric comprises a porous foam.
18. The method of claim 11 , wherein said dielectric spacer comprises a ceramic material.
19. An apparatus, comprising:
a cavity having a floor and a cover;
a conductive cylindrical post having a void oriented along a longitudinal axis;
a dielectric spacer located between said cover and said post;
a dielectric rod located within said void; and
a resilient dielectric located within said void between said dielectric spacer and said floor;
wherein said resilient dielectric is compressed between said floor and a bottom surface of said dielectric rod, thereby applying a force to said dielectric rod; and
wherein said dielectric spacer is immobilized between said cover and a top surface of said dielectric rod by said force.
20. The apparatus of claim 19 , wherein the top surface of said dielectric rod is in contact with said dielectric spacer.