Plasma etch singulated semiconductor packages and related methods
A method of forming a plurality of semiconductor packages includes providing an array of unsingulated semiconductor packages that are at least partially encapsulated in an encapsulant. The array of unsingulated semiconductor packages may be coupled with a lead frame or a substrate. A first plurality of singulation lines are simultaneously etched in the encapsulant through slits in an etch mask using a plasma etching process and a fixture coupled with the array. A second plurality of parallel singulation lines may also be etched. The first and second pluralities of singulation lines may include substantially straight or arcuate lines. The second plurality of parallel singulation lines may be substantially perpendicular to the first plurality of parallel singulation lines and be formed using the plasma etching process, the fixture, and an etch mask. The formation of singulation lines in the array singulates the array into a plurality of singulated semiconductor packages.
1. A method of forming a plurality of semiconductor packages, comprising:
providing an array of unsingulated semiconductor packages coupled with one of a lead frame and a substrate and at least partially encapsulated in an encapsulant;
coating an etch mask on the array, the etch mask having a plurality of slits therein; and
plasma etching a plurality of singulation lines in the array through the plurality of slits, thereby singulating the array to form a plurality of singulated semiconductor packages.
2. The method of claim 1 , wherein the plurality of singulated semiconductor packages comprises leadless semiconductor packages.
3. The method of claim 2 , wherein the leadless semiconductor packages comprise one of a quad flat no leads (QFN) package, a dual flat no leads (DFN) package, and a leadless land grid array (LLGA) package.
4. The method of claim 1 , wherein the plasma etching comprises etching with an Ar/O 2 /CF 4 plasma.
5. The method of claim 1 , wherein the etch mask is coated on the array using one of a spin coating technique and a spray coating technique.
6. The method of claim 1 , wherein each slit is substantially comprised of a substantially straight line.
7. The method of claim 1 , wherein each slit is substantially comprised of a substantially arcuate line.
8. The method of claim 1 , wherein one or more of the singulated semiconductor packages comprises an overall shape of a cylinder.
9. The method of claim 1 , wherein one or more of the singulated semiconductor packages comprises an overall shape of a rectangular right cuboid.
10. The method of claim 1 , wherein one or more of the singulated semiconductor packages comprises an overall shape of a triangular prism.
11. A method of forming a plurality of semiconductor packages, comprising:
providing an array of unsingulated semiconductor packages in an encapsulant;
etching a first plurality of singulation lines in the encapsulant using a plasma etching process and an etch mask and a fixture;
etching a second plurality of singulation lines in the encapsulant using the plasma etching process and an etch mask and the fixture; and
etching a third plurality of singulation lines in the encapsulant using the plasma etching process and an etch mask and the fixture, thereby singulating the array to form a plurality of singulated semiconductor packages.
12. The method of claim 11 , wherein the plurality of singulated semiconductor packages comprises leadless semiconductor packages.
13. The method of claim 12 , wherein the leadless semiconductor packages comprise one of a quad flat no leads (QFN) package, a dual flat no leads (DFN) package, and a leadless land grid array (LGA) package.
14. The method of claim 11 , wherein the plasma etching process comprises etching with an Ar/O 2 /CF 4 plasma.
15. The method of claim 11 , wherein the array of unsingulated semiconductor packages are coupled with one of a lead frame and a substrate.