Testing fuse configurations in semiconductor devices
Methods, systems, and apparatus for testing semiconductor devices.
1. A system comprising:
a first integrated circuit configured to operate in at least a normal mode and a test node, wherein the first integrated circuit comprises a memory device;
a second integrated circuit comprising a buffer, wherein the second integrated circuit comprises a memory controller, both the first integrated circuit and the second integrated circuit being disposed within the same semiconductor device package; and
a first dedicated terminal external to the semiconductor device package, wherein the first dedicated terminal is electronically coupled to the first integrated circuit via a trace formed on the second integrated circuit.
2. The system of claim 1 , wherein the trace formed on the second integrated circuit does not couple the buffer of the second integrated circuit to first dedicated terminal.
3. The system of claim 1 , wherein the first dedicated terminal to receive a test signal, the test signal to cause the first integrated circuit to operate in the test mode.
4. The system of claim 1 , further comprising:
a second terminal external to the semiconductor device package, wherein the second terminal is electronically coupled to the first integrated circuit and to the buffer in the second integrated circuit.
5. The system of claim 1 , wherein the buffer comprises at least one of a normal mode buffer or a test mode buffer.
6. The system of claim 5 , further comprising:
a third terminal to receive a signal to activate one of the normal mode buffer or the test mode buffer, wherein only one of the normal mode buffer and the test mode buffer is activated at one time.
7. The system of claim 1 , wherein the memory device comprises a latch and a fuse, the latch to receive fuse configuration data and to output a soft-blow signal based on the fuse configuration data, and the soft-blow signal to configure the fuse.
8. A method comprising:
receiving a first signal at a first dedicated terminal external to a semiconductor package, the semiconductor package comprising a first integrated circuit configured to operate in at least a normal mode and a test mode and a second integrated circuit comprising a buffer, wherein the first integrated circuit comprises a memory device and wherein the second integrated circuit comprises a memory controller; and
conveying the signal from the first dedicated terminal to or from the first integrated circuit via a trace formed on the second integrated circuit.
9. The method of claim 8 , wherein the trace formed on the second integrated circuit does not couple the buffer of the second integrated circuit to first dedicated terminal.
10. The method of claim 8 , further comprising:
receiving, at the first dedicated terminal, a test signal to cause the first integrated circuit to operate in the test mode.
11. The method of claim 8 , further comprising:
receiving a second signal at a second terminal external to the semiconductor package, wherein the second terminal is electronically coupled to the first integrated circuit and to the buffer in the second integrated circuit.
12. The method of claim 8 , wherein the buffer comprises at least one of a normal mode buffer or a test mode buffer.
13. The method of claim 12 , further comprising:
receiving a third signal, the signal to activate one of the normal mode buffer or the test mode buffer, wherein only one of the normal mode buffer and the test mode buffer is activated at one time.
14. The method of claim 8 , wherein the memory device comprises a latch and a fuse, the latch to receive fuse configuration data and to output a soft-blow signal based on the fuse configuration data, and the soft-blow signal to configure the fuse.
15. A system comprising:
a logic device configured to operate in at least a normal mode and a test mode, wherein the logic device comprises a memory device;
an integrated circuit comprising a buffer, wherein the integrated circuit comprises a memory controller, both the logic device and the integrated circuit being disposed within the same semiconductor device package; and
a first dedicated terminal external to the semiconductor device package, wherein the first dedicated terminal is electronically coupled to the logic device via a trace formed on the integrated circuit.
16. The system of claim 15 , wherein the trace formed on the integrated circuit does not couple the buffer of the integrated circuit to first dedicated terminal.
17. The system of claim 15 , wherein the first dedicated terminal to receive a test signal, the test signal to cause the logic device to operate in the test mode.
18. The system of claim 15 , further comprising:
a second terminal external to the semiconductor device package, wherein the second terminal is electronically coupled to the logic device and to the buffer in the integrated circuit.
19. The system of claim 15 , wherein the buffer comprises one of a normal mode buffer or a test mode buffer, the system further comprising:
a third terminal to receive a signal to activate one of the normal mode buffer and the test mode buffer, wherein only one of the normal mode buffer and the test mode buffer is activated at one time.
20. The system of claim 15 , wherein the memory device comprises a latch array and a fuse array, the latch array to receive fuse configuration data and to output a soft-blow signal based on the fuse configuration data, and the soft-blow signal to configure the fuse array.