Method of forming field effect transistors (FETs) with abrupt junctions and integrated circuit chips with the FETs

1. A method of forming field effect transistors (FETs) on Integrated Circuit (IC) chips, said method comprising:

forming dummy FETs, each dummy FET including a dummy gate formed on a dummy dielectric layer above an FET channel;

forming dummy sidewalls on said dummy dielectric layer alongside each dummy gate;

removing exposed areas of said dummy dielectric layer, dummy dielectric remaining under every said dummy gate and partially under each dummy sidewall;

forming a source/drain region adjacent to said each dummy sidewall, each said source/drain region extending under an adjacent dummy sidewall to dummy dielectric;

removing said dummy gates, dummy dielectric being exposed between said dummy sidewalls;

replacing a portion of said dummy dielectric under said each dummy sidewall with a source/drain extension between the FET channel and a respective source/drain region; and

forming a metal gate over each said FET channel.

2. A method of forming FETs on IC chips as in claim 1 , wherein forming dummy FETs comprises:

defining said FET channel on the surface of a semiconductor wafer;

depositing said dummy dielectric layer on said semiconductor wafer;

depositing a dummy gate material layer on said dummy dielectric layer; and

patterning said dummy gate material layer.

3. A method of forming FETs on IC chips as in claim 2 , wherein forming dummy sidewalls comprises:

depositing a conformal layer of dummy sidewall material on said semiconductor wafer; and

removing horizontal portions of said conformal layer, removing said horizontal portions exposing a gate mask on the top of each said dummy gate and exposing the dummy dielectric layer areas.

4. A method of forming FETs on IC chips as in claim 1 , wherein removing said dummy gates comprises:

depositing interlayer dielectric (ILD) on said wafer; and

planarizing said ILD, planarizing removing each said gate mask and exposing the upper surface of said dummy gates; and

etching said dummy gates with an etchant selective to the dummy gate material.

5. A method of forming FETs on IC chips as in claim 1 , wherein said dummy dielectric layer is on the surface of a semiconductor wafer, and replacing said portion of dummy dielectric comprises:

removing said dummy dielectric layer; and

depositing a layer of dopant on the exposed said surface;

removing dopant from said semiconductor surface between said dummy sidewalls, dopant remaining under said dummy sidewalls at said source/drain regions; and

diffusing said dopant into said surface, diffused said dopant forming said source/drain extensions.

6. A method of forming FETs on IC chips as in claim 5 , wherein said dummy dielectric layer is a 3 to 6 nanometer (3-6 nm) thick oxide layer, depositing said layer of dopant deposits an atomic layer dopant (ALDo) selective to said dummy spacers, and diffusing said dopant comprises annealing said wafer.

7. A method of forming FETs on IC chips as in claim 6 , wherein said atomic layer dopant is a seven angstrom (7 Å) layer of boron-nitride (BN) for PFETs and Atomic Phosphorous (P) for NFETs.

8. A method of forming FETs on IC chips as in claim 7 , wherein forming a source/drain region epitaxially grows phosphorous or arsenic-doped silicon (Si) for NFET source/drain regions, and boron-doped silicon germanium (SiGe) for PFET source/drain regions.

9. A method of forming FETs on IC chips as in claim 1 , wherein forming metal gates comprises:

removing said dummy sidewalls;

forming gate sidewalls over said source/drain extensions;

depositing a conformal layer of high-k dielectric on said semiconductor wafer, said high-k dielectric lining said gate sidewalls and FET channels between said gate sidewalls;

depositing metal on said semiconductor wafer, deposited said metal filling spaces between lined said high-k sidewalls; and

removing surface metal and high-k dielectric, lined said metal gates remaining in the filled spaces.