Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method

1. A substrate cleaning device that cleans a back surface of a substrate, comprising:

a rotation holder that holds and rotates the substrate; and

a cleaner that cleans the back surface of the substrate held by the rotation holder, wherein

the rotation holder includes

a motor having a rotating rotation shaft,

a rotator provided to be rotatable about a rotation axis by the motor, and

a plurality of holders provided at the rotator to be capable of abutting against a plurality of portions of an outer peripheral end of the substrate and holding the substrate,

a rotation center of the substrate coincides with a rotation center of the rotator, and

the cleaner includes

a cleaning tool provided to be capable of removing foreign matter on the back surface of the substrate by polishing,

a mover that moves the cleaning tool while pressing the cleaning tool against the back surface of the substrate held by the plurality of holders, and

a reaction force generator that applies a force to the substrate in a direction perpendicular to a surface to be processed or the back surface of the substrate to generate a reaction force in the substrate against a load applied to the back surface of the substrate by the cleaning tool.

2. The substrate cleaning device according to claim 1 , wherein

the reaction force generator includes a plurality of abutments provided at the rotator to abut against a plurality of portions of the outer peripheral end of the substrate, and

the plurality of abutments, when a load is applied to the back surface of the substrate by the cleaning tool, generate a reaction force in the outer peripheral end of the substrate against the load.

3. The substrate cleaning device according to claim 2 , wherein

the outer peripheral end of the substrate has a bevel portion close to a surface to be processed, a bevel portion close to a back surface and an end surface, and

each of the plurality of abutments has an abutment surface that abuts against a plurality of portions of the bevel portion close to the surface to be processed of the substrate.

4. The substrate cleaning device according to claim 2 , wherein

the plurality of holders are provided to be switchable between a substrate holding state and a substrate releasing state,

the substrate holding state being a state where the plurality of holders abut against the plurality of portions of the outer peripheral end of the substrate and hold the substrate and the substrate releasing state being a state where the plurality of holders are spaced apart from the plurality of portions of the outer peripheral end of the substrate,

the rotation holder further includes a holder switcher that switches states of the plurality of holders between the substrate holding state and the substrate releasing state,

each of the plurality of holders passes through a first region and a second region extending along the outer peripheral end of the substrate and is rotated about the rotation axis as the rotator is rotated,

during cleaning of a center region except for a peripheral portion on the back surface of the substrate, the holder switcher brings the plurality of holders into the substrate holding state, and the mover moves the cleaning tool in the center region on the back surface of the substrate, and

during cleaning of the peripheral portion on the back surface of the substrate, the holder switcher brings a holder positioned in the first region among the plurality of holders during the rotation of the rotator into the substrate holding state and brings a holder positioned in the second region among the plurality of holders during the rotation of the rotator into the substrate releasing state, and the mover moves the cleaning tool to a position at the peripheral portion on the back surface of the substrate and in the second region.

5. The substrate cleaning device according to claim 4 , wherein

each abutment is arranged between each set of two adjacent holders while abutting against the outer peripheral end of the substrate.

6. The substrate cleaning device according to claim 1 , wherein

the reaction force generator includes a suction configured to be capable of sucking the back surface of the substrate, and

the suction, when a load is applied to the back surface of the substrate by the cleaning tool, generates a reaction force against the load by sucking the back surface of the substrate.

7. The substrate cleaning device according to claim 6 , wherein

the cleaning tool has a polishing surface facing the back surface of the substrate and an opening in the polishing surface, and

the suction sucks the back surface of the substrate through the opening of the cleaning tool.

8. The substrate cleaning device according to claim 6 , wherein

the suction is configured to be capable of discharging foreign matter by sucking the foreign matter removed by the cleaning tool.

9. The substrate cleaning device according to claim 1 , wherein

the cleaner further includes a cleaning brush that further cleans the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool.

10. The substrate processing device according to claim 1 , wherein

the cleaner further includes a cleaning liquid supplier that supplies a cleaning liquid to the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool.

11. A substrate processing apparatus comprising:

a film former that forms a coating film on the surface to be processed by supplying a coating liquid to the surface to be processed of a substrate;

a remover that supplies a removal liquid for removing the coating film formed on a peripheral portion of the surface to be processed of the substrate by the film former to the peripheral portion of the substrate; and

the substrate cleaning device according to claim 1 that cleans a back surface of the substrate from which the coating film on the peripheral portion of the surface to be processed is removed by the remover.