RRAM cell with PMOS access transistor
In some embodiments, the present disclosure relates to a method of operating an RRAM cell having a PMOS access transistor. The method may be performed by forming an initial conductive filament within a dielectric data storage layer of an RRAM cell having a bottom electrode connected to a drain terminal of a PMOS transistor and a top electrode separated from the bottom electrode by the dielectric data storage layer. The initial conductive filament is formed by turning on the PMOS transistor by providing a substantially zero first forming voltage to a gate terminal of the PMOS transistor, by providing a substantially zero second forming voltage to a source terminal of the PMOS transistor, by providing a first non-zero forming voltage to a bulk terminal of the PMOS transistor, and by providing a second non-zero forming voltage to the top electrode.
1. A method of operating a resistive random access memory (RRAM) cell, comprising:
forming an initial conductive filament within a dielectric data storage layer of an RRAM cell having a bottom electrode connected to a drain terminal of a PMOS transistor and a top electrode separated from the bottom electrode by the dielectric data storage layer;
wherein forming the initial conductive filament, comprises
turning on the PMOS transistor by providing a substantially zero first forming voltage to a gate terminal of the PMOS transistor;
providing a substantially zero second forming voltage to a source terminal of the PMOS transistor;
providing a first non-zero forming voltage to a bulk terminal of the PMOS transistor; and
providing a second non-zero forming voltage to the top electrode.
2. The method of claim 1 , wherein the second non-zero forming voltage is larger than the first non-zero forming voltage.
3. The method of claim 1 , further comprising:
performing a reset operation by turning on the PMOS transistor while providing a non-zero reset voltage to the bulk terminal.
4. The method of claim 1 , further comprising:
performing a reset operation to change the dielectric data storage layer from a low resistive state to a high resistive state, wherein performing the reset operation comprises:
turning on the PMOS transistor by providing a substantially zero first reset voltage to the gate terminal;
providing a first non-zero reset voltage to the source terminal;
providing a second non-zero reset voltage to the bulk terminal; and
providing a substantially zero second reset voltage to the top electrode.
5. The method of claim 4 , wherein the first non-zero reset voltage is substantially equal to the second non-zero reset voltage.
6. The method of claim 1 , further comprising:
performing a set operation to change the dielectric data storage layer from a high resistive state to a low resistive state, wherein performing the set operation comprises:
turning on the PMOS transistor by providing a substantially zero first set voltage to the gate terminal;
providing a first non-zero set voltage to the top electrode;
providing a substantially zero second set voltage to the source terminal; and
providing a second non-zero set voltage to the bulk terminal.
7. The method of claim 6 , wherein the first non-zero set voltage is greater than the second non-zero set voltage.
8. The method of claim 1 , wherein the RRAM cell is coupled to a bitline by way of a conductive contact.
9. The method of claim 1 , wherein the bottom electrode has tapered sidewalls.
10. A method of operating a resistive random access memory (RRAM) cell, comprising:
performing a reset operation on a RRAM cell having a bottom electrode connected to a drain terminal of a PMOS transistor and a top electrode separated from the bottom electrode by a dielectric data storage layer;
wherein performing the reset operation comprises:
turning on the PMOS transistor by providing a substantially zero first reset voltage to a gate terminal of the PMOS transistor;
providing a first non-zero reset voltage to a source terminal of the PMOS transistor;
providing a second non-zero reset voltage to a bulk terminal of the PMOS transistor; and
providing a substantially zero second reset voltage to the top electrode.
11. The method of claim 10 , wherein the first non-zero reset voltage is substantially equal to the second non-zero reset voltage.
12. The method of claim 10 , further comprising:
performing a set operation to change the dielectric data storage layer from a high resistive state to a low resistive state, wherein performing the set operation comprises:
turning on the PMOS transistor by providing a substantially zero first set voltage to the gate terminal;
providing a first non-zero set voltage to the top electrode;
providing a substantially zero second set voltage to the source terminal; and
providing a second non-zero set voltage to the bulk terminal.
13. The method of claim 12 , wherein the first non-zero set voltage is greater than the second non-zero set voltage.
14. The method of claim 10 , further comprising:
forming an initial conductive filament within the dielectric data storage layer of the RRAM cell, wherein forming the initial conductive filament comprises:
turning on the PMOS transistor by providing a substantially zero first forming voltage to the gate terminal;
providing a substantially zero second forming voltage to the source terminal;
providing a first non-zero forming voltage to the bulk terminal; and
providing a second non-zero forming voltage to the top electrode.
15. The method of claim 14 , wherein the second non-zero forming voltage is larger than the first non-zero forming voltage.
16. A method of operating a resistive random access memory (RRAM) cell, comprising:
performing a set operation on the RRAM cell having a bottom electrode connected to a drain terminal of a PMOS transistor and a top electrode separated from the bottom electrode by a dielectric data storage layer;
wherein performing the set operation comprises:
turning on the PMOS transistor by providing a substantially zero first set voltage to a gate terminal of the PMOS transistor;
providing a first non-zero set voltage to the top electrode;
providing a substantially zero second set voltage to a source terminal of the PMOS transistor; and
providing a second non-zero set voltage to a bulk terminal of the PMOS transistor.
17. The method of claim 16 , wherein the first non-zero set voltage is greater than the second non-zero set voltage.
18. The method of claim 16 , further comprising:
performing a reset operation to change the dielectric data storage layer from a low resistive state to a high resistive state, wherein performing the reset operation comprises:
turning on the PMOS transistor by providing a substantially zero first reset voltage to the gate terminal;
providing a first non-zero reset voltage to the source terminal;
providing a second non-zero reset voltage to the bulk terminal of the PMOS transistor; and
providing a substantially zero second reset voltage to the top electrode.
19. The method of claim 18 , wherein the first non-zero reset voltage is substantially equal to the second non-zero reset voltage.
20. The method of claim 16 , further comprising:
forming an initial conductive filament within the dielectric data storage layer of the RRAM cell by:
turning on the PMOS transistor by providing a substantially zero first forming voltage to the gate terminal;
providing a substantially zero second forming voltage to the source terminal;
providing a first non-zero forming voltage to the bulk terminal; and
providing a second non-zero forming voltage to the top electrode.