IP Library Granted Patent US 10,014,447
Granted Patent B2
US 10,014,447 · App. 15/400,524 · Granted Jul 3, 2018

Semiconductor nanoparticle-based materials

Inventors: Nigel Pickett (Manchester, GB); Imad Naasani (Manchester, GB); James Harris (Manchester, GB)
Assignee: Nanoco Technologies, Ltd.
H01L33/502C09K11/025C09K11/565C09K11/70C09K11/883H01L33/005H01L33/56H01L33/504H01L2224/48091H01L2933/0041
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Quick Facts
Patent No.
US 10,014,447
App. No.
15/400,524
Granted
Jul 3, 2018
Kind
B2
Abstract

The present invention relates to a primary particle comprised of a primary matrix material containing a population of semiconductor nanoparticles, wherein each primary particle further comprises an additive to enhance the physical, chemical and/or photo-stability of the semiconductor nanoparticles. A method of preparing such particles is described. Composite materials and light emitting devices incorporating such primary particles are also described.

Claims (25)

1. A method of making a quantum dot (QD)-containing bead-in-bead composition, the method comprising:

encapsulating a plurality of QDs within a first bead material to provide a plurality of primary beads, each primary bead containing a plurality of QDs encapsulated therein;

encapsulating a plurality of the primary beads within a second bead material to provide a plurality of secondary beads, each secondary bead containing a plurality of primary beads encapsulated therein;

incorporating a stability-enhancing additive into either the primary beads or into the secondary beads; and,

coating the secondary beads with an inorganic protective surface.

2. The method of claim 1 , wherein the QDs comprise ions selected from group 13 and group 15 of the periodic table.

3. The method of claim 1 , wherein the first bead material comprises resin, polymer, glass, sol gel, epoxy, silicone, acrylate, or silica.

4. The method of claim 1 , wherein the first bead material is a (meth)acrylate polymer.

5. The method of claim 1 , wherein the first bead material is silica.

6. The method of claim 1 , wherein encapsulating a plurality of QDs within a first bead material comprises suspending the plurality of QDs in a solution of monomer and polymerizing the monomer to provide the first bead material.

7. The method of claim 1 , wherein encapsulating a plurality of QDs within a first bead material comprises suspending the plurality of QDs and a plurality of primary beads in a liquid and allowing the QDs to absorb into the primary beads.

8. The method of claim 1 , wherein the primary beads are about 20 nm to about 0.5 mm in diameter.

9. The method of claim 1 , wherein the inorganic protective surface comprises Al 2 O 3 .

10. The method of claim 1 , wherein the second bead material comprises polymer, resin, glass, sol gel, epoxy, silicone, or (meth)acrylate.

11. The method of claim 1 , wherein the second bead material is a silicone polymer.

12. The method of claim 1 , wherein the stability-enhancing additive is a free-radical scavenger or a reducing agent.

13. A bead-in-bead composition comprising:

a plurality of primary beads encapsulated within a secondary bead, wherein each primary bead comprises a first bead material and a plurality of quantum dots (QDs) encapsulated within the primary bead, the secondary bead comprises a secondary bead material, the primary beads or the secondary bead comprise a stability-enhancing additive, and the secondary bead comprises an inorganic protective surface.

14. The bead-in-bead composition of claim 13 , wherein the QDs comprise ions selected from group 13 and group 15 of the periodic table.

15. The bead-in-bead composition of claim 13 , wherein the first bead material comprises resin, polymer, glass, sol gel, epoxy, silicone, acrylate, or silica.

16. The bead-in-bead composition of claim 13 , wherein the primary beads are about 20 nm to about 0.5 mm in diameter.

17. The bead-in-bead composition of claim 13 , wherein the inorganic protective surface comprises Al 2 O 3 .

18. The bead-in-bead composition of claim 13 , wherein the second bead material comprises polymer, resin, glass, sol gel, epoxy, silicone, or (meth)acrylate.

19. The bead-in-bead composition of claim 13 , wherein the second bead material is a silicone polymer.

20. The bead-in-bead composition of claim 13 , wherein the stability-enhancing additive is a free-radical scavenger or a reducing agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2023
From: NANOCO TECHNOLOGIES LTD
To: SAMSUNG ELECTRONICS CO. LTD
Reel/Frame 062977/0157 →
Priority Claims (1)
GB 0916699.2 · Sep 23, 2009 · national
Continuity (4)
Continuation 14496020 · Sep 25, 2014
Continuation 12888881 · Sep 23, 2010
Provisional Application 61246287 · Sep 28, 2009
Related Publication 20170373230A1 · Dec 28, 2017