Integrated optoelectronic chip and lens array
View Patent ↗An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.
1. An optoelectronic coupling system, comprising:
an optoelectronic chip mounted on a substrate, the optoelectronic chip comprising one or more optoelectronic components;
a lower lens array positioned over the optoelectronic chip having a lower surface that comprises a first cut-away portion to accommodate the optoelectronic chip and having an upper surface that comprises one or more lower lenses positioned over respective optoelectronic components of the one or more optoelectronic components; and
an upper lens array positioned over the lower lens array comprising one or more upper lenses positioned over respective lower lenses, wherein a light path between the one or more optoelectronic components and the waveguide passes through a free-space cavity between the upper and lower lenses.
2. The optoelectronic coupling system of claim 1 , further comprising an integrated circuit chip mounted on substrate in electronic communication with the optoelectronic chip.
3. The optoelectronic coupling system of claim 2 , further comprising one or more wires connecting the integrated circuit chip to the optoelectronic chip.
4. The optoelectronic coupling system of claim 3 , wherein the lower lens array comprises a second cut-away portion at a height to accommodate a height of the one or more wires.
5. The optoelectronic coupling system of claim 1 , wherein the lower lens array comprises first alignment features and the upper lens array comprises second alignment features configured to mate with the first alignment features.
6. The optoelectronic coupling system of claim 1 , wherein the lower lenses are formed in a lower lens cavity of the lower lens array and wherein the upper lenses are formed in an upper lens cavity of the upper lens array.
7. The optoelectronic coupling system of claim 6 , wherein the upper lens cavity and the lower lens cavities have sloped walls.
8. An optoelectronic coupling system, comprising:
an optoelectronic chip mounted on a substrate, the optoelectronic chip comprising one or more optoelectronic components;
a lower lens array positioned over the optoelectronic chip having a lower surface that comprises a portion at a first height to mount on the substrate and a portion at a second height to accommodate a height of the optoelectronic chip and having an upper surface that comprises one or more lower lenses formed in a lower lens cavity of the lower lens array and positioned over respective optoelectronic components of the one or more optoelectronic components; and
an upper lens array positioned over the lower lens array comprising one or more upper lenses formed in an upper lens cavity of the upper lens array and positioned over respective lower lenses.
9. The optoelectronic coupling system of claim 8 , wherein a light path between the one or more optoelectronic components and a waveguide passes through a free-space cavity between the upper and lower lenses.
10. The optoelectronic coupling system of claim 8 , wherein the upper lens cavity and the lower lens cavities have sloped walls.