IP Library Patent Application 15405089
Patent Application
App. No. 15/405,089

GAS SENSOR

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Quick Facts
Patent No.
US None
App. No.
15/405,089
Abstract

In accordance with some embodiments of the present invention, a gas sensor system is disclosed. In accordance with some embodiments, a system includes a glass substrate; a heater formed on the glass substrate; and a sensor formed adjacent the heater formed on the glass substrate. A method of forming a gas sensor system according to some embodiments includes providing a glass substrate; forming a heater on the glass substrate; and forming a sensor adjacent the heater on the glass substrate.

Claims (18)

1 . A system, comprising:

a glass substrate;

a heater formed on the glass substrate; and

a sensor formed adjacent the heater formed on the glass substrate.

2 . The system of claim 1 , wherein the glass substrate includes a cavity under the heater and the sensor.

3 . The system of claim 1 , wherein the glass substrate is thin.

4 . A method of forming a gas sensor system, comprising:

providing a glass substrate;

forming a heater on the glass substrate; and

forming a sensor adjacent the heater on the glass substrate.

5 . The method of claim 4 , further including forming a cavity in the glass substrate.

6 . The method of claim 4 , further including thinning the glass substrate.

7 . A system, comprising:

a sensor system having a heater and a sensor formed adjacent to the heater on a glass substrate;

a system substrate on which the sensor system is mounted.

8 . The system of claim 7 , wherein the system substrate is a printed circuit board.

9 . The system of claim 7 , wherein the system substrate is a silicon substrate.

10 . The system of claim 9 , wherein the silicon substrate includes a cavity that receives the sensor system.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2017
From: KULKARNI, SRIKANTH; PATEL, VIRESH; SHAH, JITESH; DELTORO, GEORGE
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 043054/0721 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →