Interposer frame with polymer matrix and methods of fabrication
View Patent ↗An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.
1. A method of fabricating an array of chip sockets surrounded by an organic matrix framework comprising:
obtaining a sacrificial carrier;
laying down a layer of photoresist and patterning with a grid of copper via posts and a chip socket array;
plating copper into the grid and the chip socket array;
removing the photoresist;
laminating with polymer dielectric;
thinning and planarizing to expose ends of the copper via posts and the copper filled chip socket array;
shielding the ends of the copper via posts;
dissolving away the copper from the copper filled chip socket array leaving the chip socket array, and
removing the carrier.
2. The method of claim 1 , wherein the via posts are elongated via posts and at least one chip socket is surrounded by an organic matrix frame with an embedded metallic structure comprise at least one elongated via post and at least one feature layer.
3. The method of claim 1 wherein the elongated via post and feature layer comprises a continuous coil.
4. The method of claim 1 wherein at least one socket is surrounded by an organic frame and a multilayer metal structure embedded in the organic frame and comprising a plurality of extended via post layers, such that each pair of adjacent via post layers are separated by a feature layer and the multilayer metal structure comprises a continuous coil.