Flexible circuit substrate with temporary supports and equalized lateral expansion
An item may have a flexible support structure and may include a flexible component. The flexible component may have electrical components mounted on component mounting regions in a flexible circuit substrate. The component mounting regions may be interconnected by serpentine interconnect paths or other flexible interconnect paths. The flexible circuit substrate and component mounting regions may extend along a longitudinal axis of the flexible component or may form a two-dimensional array. Two-dimensional mesh-shaped flexible circuit substrates may be used in forming displays. The mesh-shaped flexible circuit substrates may be auxetic substrates that widen when stretched (e.g., structures with a negative Poisson's ratio that become thicker perpendicular to applied force when stretched) and that therefore reduce image distortion. Temporary tethers may help hold flexible circuit substrates together until intentionally broken following assembly of a flexible component into the flexible support structure.
1. A flexible component, comprising:
a flexible circuit substrate having a plurality of component mounting regions interconnected by flexible interconnect paths;
temporary tethers that are configured to temporarily couple the component mounting regions together and strengthen the flexible circuit substrate when the temporary tethers are in an unbroken state, wherein the temporary tethers are broken during assembly of the flexible component into an item, wherein the temporary tethers are configured to remain in a broken state within the item, and wherein the temporary tethers are interspersed between the flexible interconnect paths;
metal lines in the flexible circuit substrate; and
electrical components that are mounted to the component mounting regions and that are interconnected by the metal lines.
2. The flexible component defined in claim 1 wherein each of the temporary tethers has a narrowed region that facilitates breaking of the temporary tethers.
3. The flexible component defined in claim 2 wherein the electrical components each include at least one light-emitting diode.
4. The flexible component defined in claim 3 wherein the flexible circuit substrate comprises a polyimide layer, wherein the flexible interconnect paths comprise serpentine portions of the polyimide layer that extend from the component mounting regions, and wherein the temporary tethers are formed from integral portions of the polyimide layer.
5. The flexible component defined in claim 1 wherein the flexible circuit substrate is an elongated flexible circuit substrate having a longitudinal axis, wherein the component mounting regions extend along the longitudinal axis, wherein the component mounting regions include adjacent pairs of component mounting regions, wherein each pair of adjacent component mounting regions is coupled by a respective set of the temporary tethers, and wherein each set of temporary tethers includes at least first and second tethers of different strengths.
6. An item, comprising:
a flexible support structure;
an auxetic mesh-shaped flexible circuit substrate having a two-dimensional array of component mounting regions coupled by interconnect paths, wherein the flexible circuit substrate comprises a polymer, wherein portions of the flexible circuit substrate form temporary tethers, wherein the temporary tethers are configured to temporarily couple the component mounting regions together and strengthen the flexible circuit substrate when the temporary tethers are in an unbroken state, wherein the temporary tethers are broken during assembly of the item, and wherein the temporary tethers are configured to remain in a broken state within the item; and
an array of electrical components, wherein each electrical component is mounted to a respective one of the component mounting regions and is interconnected to at least one other of the electrical components with metal traces in the auxetic mesh-shaped flexible circuit substrate and wherein each electrical component comprises at least one light-emitting diode.
7. The item defined in claim 6 wherein the auxetic mesh-shaped flexible circuit substrate comprises polyimide and wherein each electrical component includes at least one crystalline semiconductor die.
8. The item defined in claim 7 wherein each crystalline semiconductor die comprises the at least one light-emitting diode.
9. The item defined in claim 6 wherein the flexible support structure comprises fabric.
10. The item defined in claim 6 wherein each temporary tether has a portion coupled to one of the interconnect paths.
11. The item defined in claim 6 wherein each electrical component comprises a communications circuit and at least three light-emitting diodes.
12. The item defined in claim 11 wherein each of the light-emitting diodes has a different color and is formed from a respective crystalline semiconductor die.
13. The item defined in claim 12 wherein the support structure comprises strands of material and is configured to stretch.
14. The item defined in claim 6 wherein the electrical components include sensors.
15. The item defined in claim 6 further comprising a non-auxetic flexible circuit substrate structure coupled to the auxetic flexible circuit substrate.