Vapor deposition of thin films comprising gold
Vapor deposition processes for forming thin films comprising gold on a substrate in a reaction space are provided. The processes can be cyclical vapor deposition processes, such as atomic layer deposition (ALD) processes. The processes can include contacting the substrate with a gold precursor comprising at least one sulfur donor ligand and at least one alkyl ligand, and contacting the substrate with a second reactant comprising ozone. The deposited thin films comprising gold can be uniform, continuous, and conductive at very low thicknesses.
1. A process for forming a thin film comprising gold on a substrate in a reaction space, the process comprising:
alternately and sequentially contacting the substrate with a vapor phase gold precursor and a vapor phase second reactant;
wherein the vapor phase gold precursor comprises at least one ligand comprising sulfur or selenium, and at least one alkyl ligand; and
wherein the gold precursor and the second reactant react to form the thin film comprising gold.
2. The process of claim 1 , wherein alternately and sequentially contacting the substrate with a vapor phase gold precursor and a vapor phase second reactant comprises a deposition cycle that is repeated two or more times.
3. The process of claim 2 , the deposition cycle further comprising removing excess vapor phase gold precursor and reaction byproducts, if any, from the reaction space after contacting the substrate with the vapor phase gold precursor.
4. The process of claim 2 , the deposition cycle further comprising removing excess second reactant and reaction byproducts, if any, from the reaction space after contacting the substrate with the second reactant.
5. The process of claim 1 , wherein the gold of the gold precursor has an oxidation state of +III.
6. The process of claim 1 , wherein the ligand comprising sulfur or selenium comprises sulfur.
7. The process of claim 1 , wherein the ligand comprising sulfur or selenium comprises selenium.
8. The process of claim 1 , wherein the gold precursor comprises one or more additional neutral adducts.
9. The process of claim 1 , wherein the gold precursor comprises a diethyldithiocarbamato ligand.
10. The process of claim 9 , wherein the gold precursor comprises Me 2 Au(S 2 CNEt 2 ).
11. The process of claim 1 , wherein the second reactant comprises oxygen.
12. The process of claim 11 , wherein the second reactant comprises a reactive species of oxygen.
13. The process of claim 12 , wherein the second reactant comprises ozone.
14. The process of claim 1 , wherein the process has a deposition temperature of from about 120° C. to about 220° C.
15. The process of claim 2 , wherein the thin film comprising gold is continuous when it reaches a thickness of about 20 nm.
16. The process of claim 15 , wherein the thin film comprising gold has a thickness of from about 20 nm to about 50 nm.
17. The process of claim 15 , wherein the thin film comprising gold has a resistivity of less than about 20 μΩcm.
18. The process of claim 2 , wherein the thin film comprising gold has a growth rate of more than about 0.8 Å per deposition cycle.
19. The process of claim 2 , wherein the process is an atomic layer deposition (ALD) process.
20. The process of claim 2 , wherein the process is a cyclical chemical vapor deposition (CVD) process.
21. An atomic layer deposition (ALD) process for forming a thin film comprising gold on a substrate in a reaction space comprising a plurality of deposition cycles, wherein at least one deposition cycle comprises:
alternately and sequentially contacting the substrate with a vapor phase gold precursor and a vapor phase second reactant;
wherein the deposition cycle is repeated two or more times to form the thin film comprising gold, and
wherein the gold of the vapor phase gold precursor has an oxidation state of +III and the vapor phase gold precursor comprises at least one sulfur donor ligand and at least one alkyl ligand.
22. The process of claim 21 , wherein the gold precursor comprises Me 2 Au(S 2 CNEt 2 ).
23. The process of claim 21 , wherein the second reactant comprises ozone.
24. The process of claim 21 , wherein the thin film comprising gold is continuous when it reaches a thickness of about 20 nm.
25. The process of claim 21 , wherein the thin film comprising gold is continuous after 100 deposition cycles.