IP Library › Granted Patent US 10,171,059
Granted Patent B2
US 10,171,059 · App. 15/417,652 · Granted Jan 1, 2019

Composite component and front-end module

Inventor: Seigo Hino (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H7/0115H01L25/00H03F3/19H03F3/245H03H7/0161H03H7/175H03H7/1766H03H9/46H04B1/40H05K1/0243H05K1/141H05K1/144H05K1/181H01L2924/0002H03F2200/451H03H9/0566H05K1/0218H05K2201/042H05K2201/0723H05K2201/1006H05K2201/2036
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Quick Facts
Patent No.
US 10,171,059
App. No.
15/417,652
Granted
Jan 1, 2019
Kind
B2
Abstract

An object is to provide a technique that can reduce the degradation in the characteristics of a transmitting filter by improving heat dissipation characteristics of a composite component having a stack structure. Since a transmitting filter is disposed in or on a first substrate 14 , the heat generated in the transmitting filter is efficiently dissipated, for example, to an external module substrate 2 electrically connected to the first substrate 14 . It is thus possible to reduce changes in the characteristics of the transmitting filter caused by a temperature rise. Thus, by improving heat dissipation characteristics of a composite component 10 having a stack structure, the degradation in the characteristics of the transmitting filter can be reduced.

Claims (47)

1. A composite component adapted for being disposed on a mounting substrate, the composite component comprising:

a transmitting filter;

a first substrate adapted for being disposed adjacent to the mounting substrate and electrically connected to the mounting substrate;

a second substrate disposed opposite to the first substrate;

a spacer member interposed between the first substrate and the second substrate to support the first substrate and the second substrate, the spacer member being configured to electrically connect the first substrate to the second substrate,

wherein the second substrate is adapted for being electrically connected to the mounting substrate through a second spacer member; and

the transmitting filter is disposed in an internal space and on a principal surface of the first substrate, the internal space being surrounded by the first substrate and the second substrate.

2. The composite component according to claim 1 , wherein the transmitting filter includes a resonant circuit; and

the resonant circuit is disposed in the internal space and on the principal surface of the first substrate.

3. The composite component according to claim 1 , further comprising a receiving filter,

wherein the receiving filter is disposed in the internal space and on the principal surface of the second substrate.

4. The composite component according to claim 1 , wherein the spacer member is a metal conductor.

5. The composite component according to claim 1 , further comprising:

a plurality of first substrate-side filters arranged on an upper surface of the first substrate; and

a plurality of second substrate-side filters arranged on a lower surface of the second substrate,

wherein, of the plurality of first and second substrate-side filters, the corresponding first and second substrate-side filters arranged to coincide with each other in a plan view have respective pass bands set in different frequency bands.

6. The composite component according to claim 1 , further comprising:

a plurality of first substrate-side filters arranged on an upper surface of the first substrate;

a plurality of second substrate-side filters arranged on a lower surface of the second substrate; and

a filter controller configured to control an operation of each of the plurality of first substrate-side filters and an operation of each of the plurality of second substrate-side filters,

wherein the filter controller performs the control such that of the plurality of first and second substrate-side filters, the corresponding first and second substrate-side filters arranged to coincide with each other in a plan view do not operate simultaneously.

7. The composite component according to claim 5 , wherein the plurality of first substrate-side filters each are the transmitting filter, and the plurality of second substrate-side filters each are a receiving filter.

8. The composite component according to claim 1 , wherein the first substrate includes a first ground electrode formed in a planar shape to overlap with all components on the first substrate in a plan view.

9. The composite component according to claim 1 , wherein the second substrate includes, at a position adjacent to an upper surface thereof, a second ground electrode formed in a planar shape to overlap with all components on the second substrate in a plan view.

10. The composite component according to claim 2 , wherein the resonant circuit includes a variable reactance circuit; and

the variable reactance circuit is disposed in the internal space and on the principal surface of the first substrate.

11. A front-end module comprising:

the composite component according to claim 1 ; and

a power amplifier,

wherein the power amplifier is disposed outside the composite component.

12. The composite component according to claim 1 , wherein the transmitting filter includes a resonant circuit; and

the resonant circuit is disposed in the internal space and on the principal surface of the first substrate.

13. The composite component according to claim 1 , further comprising a receiving filter,

wherein the receiving filter is disposed in the internal space and on the principal surface of the second substrate.

14. The composite component according to claim 2 , further comprising a receiving filter,

wherein the receiving filter is disposed in the internal space and on the principal surface of the second substrate.

15. The composite component according to claim 2 , wherein the spacer member is a metal conductor.

16. The composite component according to claim 3 , wherein the spacer member is a metal conductor.

17. The composite component according to claim 1 , further comprising:

a plurality of first substrate-side filters arranged on an upper surface of the first substrate; and

a plurality of second substrate-side filters arranged on a lower surface of the second substrate,

wherein, of the plurality of first and second substrate-side filters, the corresponding first and second substrate-side filters arranged to coincide with each other in a plan view have respective pass bands set in different frequency bands.

18. The composite component according to claim 2 , further comprising:

a plurality of first substrate-side filters arranged on an upper surface of the first substrate; and

a plurality of second substrate-side filters arranged on a lower surface of the second substrate,

wherein, of the plurality of first and second substrate-side filters, the corresponding first and second substrate-side filters arranged to coincide with each other in a plan view have respective pass bands set in different frequency bands.

19. The composite component according to claim 1 , wherein the spacer member is disposed on the principal surface of the first substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2017
From: HINO, SEIGO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 041107/0460 →
Priority Claims (1)
JP 2014-182648 · Sep 8, 2014 · national
Continuity (2)
Continuation PCTJP2015074905 · Sep 2, 2015
Related Publication 20170133998A1 · May 11, 2017