IP Library Granted Patent US 10,595,797
Granted Patent B2
US 10,595,797 · App. 15/420,907 · Granted Mar 24, 2020

Dental intraoral radiological image sensor

Inventors: Nathalie Pascal (Le Sappey-en-Chartreuse, FR); David Perennez (Grenoble, FR)
Assignee: TELEDYNE E2V SEMICONDUCTORS SAS
A61B6/145A61B5/4547A61B6/14G01T1/244G03B42/042H01L27/14601H01L27/14806A61B2560/0412A61B2562/17A61B2562/18A61B2562/227
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Quick Facts
Patent No.
US 10,595,797
App. No.
15/420,907
Granted
Mar 24, 2020
Kind
B2
Abstract

An intra-oral dental radiological image sensor is mechanically reinforced by two front R A and rear R B mechanical reinforcing plates each inserted between a respective face of an image capture module and a respective front 20 A and rear 20 B shell bottom of a casing. The front reinforcing plate is a solid plate, made of material transparent to X rays, covering the photosensitive front face (scintillator) of the module, and harder than the front shell. The rear plate, less thick than the front plate, is harder than the rear shell and comprises an opening O provided to surround, without covering them, components present on the rear face of the module, under a rear shell dome.

Claims (33)

1. An intra oral dental radiological image sensor comprising,

an electronic imaging module, comprising,

on a photosensitive front face, an electronic imaging chip covered with a scintillator, and,

on a rear face, components including a connector for linking the electronic imaging module to a link cable,

the electronic imaging module being contained in a protective casing formed by

a front shell having a flat bottom, and

a rear shell having a bottom that has a partly flat portion and a protruding dome which covers at least the connector, and

the sensor further comprising

a front mechanical reinforcing plate, which is a solid plate, between the flat bottom of the front shell and the photosensitive front face of the electronic imaging module, the front reinforcing plate having a hardness greater than that of the front shell and being transparent to X rays or gamma rays; and

a rear mechanical reinforcing plate, less thick than the front mechanical reinforcing plate, between the partially flat portion of the bottom of the rear shell and the rear face of the electronic imaging module, wherein the rear mechanical reinforcing plate is in the form of a frame having an opening into which the components including the connector protrude, the rear reinforcing plate having a hardness greater than that of the rear shell.

2. The sensor of claim 1 , wherein the rear mechanical reinforcing plate is in the form of a U-shaped open frame, which is partially open around the opening of the frame.

3. The sensor of claim 1 , wherein the protective casing has an inner wall, and the sensor further comprises at least one elastic separator element between the electronic imaging module and the inner wall of the protective casing.

4. The sensor of claim 3 :

wherein a height axis (z) of the protective casing is perpendicular to a x-y plane defined by the flat bottom of the rear shell, and positively oriented from the flat bottom of the rear shell to the flat bottom of the front shell, and

wherein the elastic separator element is at a height level on the height axis (z) wholly below that of the scintillator, avoiding any contact between the elastic element and the scintillator.

5. The sensor of claim 3 , wherein the rear mechanical reinforcing plate overhangs, relative to a line perpendicular to the x-y plane, the rear face of the electronic imaging module.

6. The sensor of claim 1 , wherein the front mechanical reinforcing plate has a multilayer structure.

7. The sensor of claim 6 , wherein the front mechanical reinforcing plate is a composite of epoxy resin and cotton fabrics.

8. The sensor of claim 1 , wherein the rear mechanical reinforcing plate is a carbon fibre reinforced polymer composite.

9. The sensor of claim 2 , wherein the protective casing has an inner wall, and the sensor further comprises at least one elastic separator element between the electronic imaging module and the inner wall of the protective casing.

10. The sensor of claim 9 :

wherein a height (z) of the protective casing is perpendicular to a x-y plane defined by the flat bottom of the rear shell, and positively oriented from the flat bottom of the rear shell to the flat bottom of the front shell, and

wherein the elastic separator element is at a height level on the height axis (z) wholly below that of the scintillator, avoiding any contact between the elastic element and the scintillator.

11. The sensor of claim 9 , wherein the rear mechanical reinforcing plate overhangs, relative to a line perpendicular to the x-y plane, the rear face of the electronic imaging module.

12. The sensor of claim 1 , wherein the electronic imaging module has a rectangular form.

13. The sensor of claim 12 , wherein the rectangular form has cut corners.

14. The sensor of claim 13 , wherein the protective casing has an inner wall and corners, and the sensor further comprises an elastic separator element between each corner of the electronic imaging module and the protective casing.

15. The sensor of claim 12 , wherein the protective casing has an inner wall and corners, and the sensor further comprises an elastic separator element between each corner of the electronic imaging module and the protective casing.

16. The sensor of claim 1 , wherein the protruding dome further covers a component other than the connector.

17. The sensor of claim 1 , wherein the frame is closed around the opening of the frame.

18. The sensor of claim 2 , wherein the protruding dome has an opening to receive the link cable.

19. The sensor of claim 12 , wherein the protruding dome has an opening to receive the link cable.

20. The sensor of claim 19 , wherein the opening of the protruding dome is configured such that the link cable exits from the protruding dome a direction along a larger side of the rectangular electronic imaging module.

Assignments (2)
CHANGE OF NAME Recorded Aug 10, 2018
From: E2V SEMICONDUCTORS
To: TELEDYNE E2V SEMICONDUCTORS SAS
Reel/Frame 046761/0705 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2017
From: PASCAL, NATHALIE; PERENNEZ, DAVID
To: E2V SEMICONDUCTORS
Reel/Frame 041136/0694 →
Continuity (1)
Related Publication 20180214096A1 · Aug 2, 2018