System for tunable workpiece biasing in a plasma reactor
Systems and methods for tunable workpiece biasing in a plasma reactor are provided herein. In some embodiments, a system includes: a plasma chamber that performs plasma processing on a workpiece, a first pulsed voltage source, coupled directly to a workpiece, a second pulsed voltage source, coupled capacitively to the workpiece, and a biasing controller comprising one or more processors, and memory, wherein the memory comprises a set of computer instructions that when executed by the one or more processors, independently controls the first pulsed voltage source and the second pulsed voltage source based on one or more parameters of the first pulsed voltage source and the second pulsed voltage source in order to tailor ion energy distribution of the flux of ions directed to the workpiece.
1. A system for tunable workpiece biasing, comprising:
a plasma chamber that performs plasma processing on a workpiece;
a first pulsed voltage source using DC voltages, coupled directly to the workpiece in the plasma chamber via at least one direct connection, the at least one direct connection enabling ion energy control in the workpiece near the at least one direct connection;
a second pulsed voltage source, coupled capacitively to the workpiece; and
a biasing controller comprising one or more processors, and memory, wherein the memory comprises a set of computer instructions that when executed by the one or more processors, the biasing controller is configured to independently control the first pulsed voltage source and the second pulsed voltage source based on one or more voltage parameters of the first pulsed voltage source and the second pulsed voltage source in order to tailor ion energy distribution of the flux of ions directed to the workpiece, the biasing controller is configured to adjust the first and second pulsed voltage sources in combination to achieve a configurable ion energy distribution in the workpiece.
2. The system of claim 1 , wherein the second pulsed voltage source outputs a shaped bias waveform.
3. The system of claim 1 , wherein the biasing controller alternatively pulses the first pulsed voltage source and the second pulsed voltage source.
4. The system of claim 1 , wherein the first pulsed voltage source supplies a first pulse at high voltage, wherein the maximum of the high voltage during a first pulse is approximately in the range of 1 to 10 kV.
5. A system for tunable workpiece biasing, comprising:
a plasma chamber that performs plasma processing on a workpiece:
a first pulsed voltage source using DC voltages, coupled directly to the workpiece in the plasma chamber via at least one direct connection, the at least one direct connection enabling ion energy control in the workpiece near the at least one direct connection;
a second pulsed voltage source, coupled capacitively to the workpiece; and
a biasing controller comprising one or more processors, and memory, wherein the memory comprises a set of computer instructions that when executed by the one or more processors, the biasing controller is configured to independently control the first pulsed voltage source and the second pulsed voltage source based on one or more voltage parameters of the first pulsed voltage source and the second pulsed voltage source in order to tailor ion energy distribution of the flux of ions directed to the workpiece, wherein the first pulsed voltage source supplies a first pulse at high voltage, wherein the maximum of the high voltage during a first pulse is approximately in the range of 1 to 10 kV and wherein the second pulsed voltage source supplies a second pulse comprising one or more voltages in a continuous range of low to medium voltages, wherein the range is greater than 0 to approximately 1.5 kV.
6. The system of claim 1 , wherein the plasma chamber further comprises:
an electrostatic chuck supporting the workpiece;
a base supporting the electrostatic chuck;
a plurality of pins, each directly coupled to the base at one end, and configured to be directly coupled to the workpiece at the other end; and
a chucking mesh embedded within the electrostatic chuck.
7. The system of claim 6 , wherein the first pulsed voltage source is coupled to the base, and voltage supplied from the first pulsed voltage source is directly coupled to the workpiece via the plurality of pins.
8. The system of claim 7 , wherein the second pulsed voltage source is coupled directly to the chucking mesh, and the chucking mesh is configured to be capacitively coupled to the workpiece.
9. The system of claim 8 , wherein the biasing controller is configured to adjust the one or more voltage parameters to modify a waveform emitted by the second pulsed voltage source, based on voltages sensed at the workpiece.
10. The system of claim 1 , wherein the first pulsed voltage source emits high voltage pulses at a pulse frequency of approximately 100 to 100,000 Hz.
11. The system of claim 10 , wherein the second pulsed voltage source emits pulses at a pulse frequency of approximately 400 kHz.
12. A method for tunable workpiece biasing in a plasma chamber comprising:
generating a high voltage by a first pulsed voltage source using DC voltages and coupling the high voltage to a workpiece in a plasma chamber via at least one direct connection, the at least one direct connection enabling ion energy control in the workpiece near the at least one direct connection;
generating one or more of low and medium voltages by a second pulsed voltage source;
coupling, capacitively, the one or more of low and medium voltages to the workpiece; and
pulsing the high voltage and the one or more of low and medium voltages by a biasing controller according to, one or more voltage parameters of the first pulsed voltage source and the second pulsed voltage source to tailor ion distribution in the workpiece, the biasing controller adjusting the first and second pulsed voltage sources in combination to achieve a configurable ion energy distribution in the workpiece.
13. The method of claim 12 , wherein the biasing controller accepts a bias waveform as input for the second pulsed voltage source.
14. A method for tunable workpiece biasing in a plasma chamber comprising:
generating a high voltage by a first pulsed voltage source and coupling the high voltage to a workpiece in a plasma chamber;
generating one or more of low and medium voltages by a second pulsed voltage source;
coupling, capacitively, the one or more of low and medium voltages to the workpiece; and
pulsing the high voltage and the one or more of low and medium voltages by a biasing controller according to, one or more voltage parameters of the first pulsed voltage source and the second pulsed voltage source to tailor ion distribution in the workpiece; wherein the first pulsed voltage source supplies a high voltage, the maximum of the high voltage during a pulse being approximately 1 to 10 kV, and wherein the second pulsed voltage source supplies one or more voltages in a continuous range of low to medium voltages, wherein the range is greater than 0 to approximately 1.5 kV.
15. The method of claim 14 , wherein the first pulsed voltage source emits high voltage pulses at a pulse frequency of approximately 100 to 100,000 Hz, and the second pulsed voltage source emits pulses at a pulse frequency of approximately 400 kHz.
16. The method of claim 12 , wherein the plasma chamber further comprises:
an electrostatic chuck supporting the workpiece;
a base supporting the electrostatic chuck;
a plurality of pins, each directly coupled to the base at one end, and directly coupled to the workpiece at the other end; and
a chucking mesh embedded within the electrostatic chuck.
17. The method of claim 16 , wherein the first pulsed voltage source is coupled to the base, and voltage supplied from the first pulsed voltage source is directly coupled to the workpiece via the plurality of pins, and wherein the second pulsed voltage source is coupled directly to the chucking mesh, and the chucking mesh is capacitively coupled to the workpiece.
18. The method of claim 17 wherein the biasing controller adjusts the one or more voltage parameters to modify a waveform emitted by the second pulsed voltage source, based on voltages sensed at the workpiece.