Light emitting apparatus
A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.
1. A light emitting apparatus, comprising:
a light-transmissive substrate comprising a top surface and a bottom surface;
at least one semiconductor light emitting device adhered with an adhesive material to the top surface of the light-transmissive substrate;
a reflector disposed over the semiconductor light emitting device and comprising a concave curved surface;
a first wavelength converter disposed on the concave curved surface between the light-transmissive substrate and the reflector; and
a second wavelength converter disposed directly on the bottom surface of the light-transmissive substrate,
wherein the first wavelength converter converts a wavelength of light emitted in a first direction from the semiconductor light emitting device to the first wavelength converter and the second wavelength converter converts a wavelength of light emitted in a second direction from the semiconductor light emitting device to the second wavelength converter through the adhesive material and the light-transmissive substrate.
2. The light emitting apparatus according to claim 1 , wherein the first wavelength converter is disposed between the light-transmissive substrate and the reflector, such that the reflector reflects light, which passes through the first wavelength converter, toward the light-transmissive substrate.
3. The light emitting apparatus according to claim 2 , wherein the second wavelength converter is disposed at a position corresponding to the semiconductor light emitting device on the bottom surface of the light-transmissive substrate.
4. The light emitting apparatus according to claim 1 , further comprising an encapsulation part disposed between the reflector and the light-transmissive substrate and configured to encapsulate the semiconductor light emitting device.
5. The light emitting apparatus according to claim 1 , further comprising a light spreading part positioned on the bottom surface of the light-transmissive substrate.
6. The light emitting apparatus according to claim 1 , further comprising an electrode provided on the top surface of the light-transmissive substrate and connected to the semiconductor light emitting device by using a bonding wire.
7. The light emitting apparatus according to claim 6 , wherein the electrode is light-transmissive.
8. The light emitting apparatus according to claim 1 , wherein the adhesive material has light transmissivity.
9. The light emitting apparatus according to claim 8 , wherein the adhesive material covers the top surface of the light-transmissive substrate at a position corresponding to the semiconductor light emitting device.
10. The light emitting apparatus according to claim 1 , further comprising a light spreading part disposed to cover the second wavelength converter on the bottom surface of the light-transmissive substrate.
11. The light emitting apparatus according to claim 1 , wherein a concavo-convex pattern for improving light extraction is formed on the bottom surface of the light-transmissive substrate.
12. An illumination device, comprising:
a light emitting apparatus according to claim 6 ; and
a socket for detachably mounting the illumination device to a structure disposed indoors or outdoors,
wherein the socket is configured to electrically connect electrodes of the light emitting apparatus to a power supply terminal of the structure.