Radio frequency die package with inverted ground plane and method of making same
View Patent ↗A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
1. A radio frequency (RF) die package comprising:
a switch assembly comprising:
an RF transmission line and a plurality of conductive mounting pads formed on a first substrate; and
a switching mechanism that selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line; and
an inverted ground plane assembly coupled to the plurality of conductive mounting pads;
wherein an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
2. The RF die package of claim 1 further comprising at least one conductive contact mechanically coupling the inverted ground plane assembly to the switch assembly.
3. The RF die package of claim 2 wherein a height of the at least one conductive contact defines an impedance of the RF transmission line.
4. The RF die package of claim 1 wherein the at least one conductive contact comprises a conductive joint that hermetically seals a cavity formed between the switch assembly and the inverted ground plane assembly.
5. The RF die package of claim 1 wherein the at least one conductive contact comprises a plurality of stud bumps.
6. The RF die package of claim 1 wherein the switching mechanism comprises one of an ohmic contact micro-electromechanical systems (MEMS) device and a capacitive contact micro-electromechanical systems (MEMS) device.
7. The RF die package of claim 1 wherein the inverted ground plane assembly is spaced apart from the switch assembly such that the electromagnetic field travels through a cavity formed therebetween.
8. The RF die package of claim 1 wherein the inverted ground plane assembly comprises a second substrate and a ground plane coupled thereto.
9. A method of manufacturing a radio frequency (RF) die package comprising:
providing a die assembly comprising a plurality of conductive mounting pads and an RF transmission line and disposed on a first mounting substrate, the RF transmission line having a switching device positioned thereon; and
coupling a ground plane assembly to the die assembly with at least one conductive contact such that an electromagnetic field generated between the RF transmission line and the ground plane assembly extends through a cavity formed between the ground assembly and the die assembly and does not permeate the first mounting substrate in a region proximate the switching device.
10. The method of claim 9 wherein coupling the ground plane assembly to the die assembly comprises electrically coupling a ground plane of the ground plane assembly to the at least one conductive contact, the ground plane positioned on a surface of a second mounting substrate that faces the die assembly.
11. The method of claim 9 further comprising coupling the die assembly to the ground assembly with a plurality of electrical contacts.
12. The method of claim 11 further comprising coupling the plurality of electrical contacts to respective conductive mounting pads of the plurality of conductive mounting pads.
13. The method of claim 9 further comprising forming a hermetic seal around the switching device.
14. The method of claim 9 further comprising coupling the die assembly to the ground assembly with a conductive joint that forms a hermetic seal between the die assembly and the ground assembly.
15. The method of claim 9 further comprising selecting a height of the at least one conductive contact to define an impedance of the RF transmission line.
16. A radio frequency (RF) die package comprising:
a die assembly comprising:
a first substrate;
a signal line disposed on the first substrate;
a switching mechanism configured to electrically couple a first portion of the signal line to a second portion of the signal line when in a closed position and electrically isolate the first portion from the second portion when in an open position; and
a plurality of conductive pads disposed on the first substrate;
an inverted ground plane assembly comprising:
a second substrate; and
a ground plane coupled to a surface of the second substrate facing the signal line; and
at least one contact electrically and mechanically coupling the ground plane to the plurality of conductive pads.
17. The RF die package of claim 16 wherein the switching mechanism comprises an ohmic contact micro-electromechanical systems (MEMS) device.
18. The RF die package of claim 16 wherein the switching mechanism comprises a capacitive contact micro-electromechanical systems (MEMS) device.
19. The RF die package of claim 16 wherein the at least one contact comprises a plurality of conductive bumps.
20. The RF die package of claim 16 wherein the at least one contact comprises a conductive joint that surrounds the signal line and forms a hermetic seal between the die assembly and the inverted ground plane assembly.