Microelectronic system including printed circuit board having improved power/ground ball pad array
A microelectronic system includes a printed circuit board and a semiconductor package mounted on the printed circuit board. The printed circuit board includes a laminated core having an internal conductive layer and a build-up layer. The build-up layer includes a top conductive layer. Microvias are disposed in the build-up layer to connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.
1. A microelectronic system, comprising:
a printed circuit board, comprising:
a laminated core comprising at least an internal conductive layer;
a build-up layer on the laminated core, said build-up layer comprising a top conductive layer;
a plurality of microvias in the build-up layer to electrically connect the top conductive layer with the internal conductive layer; and
a power/ground ball pad array in the top conductive layer, said power/ground ball pad array comprising power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P, and said power/ground ball pad array comprising a 4-ball pad unit area comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads; and
a semiconductor package mounted on the printed circuit board.
2. The microelectronic system according to claim 1 , wherein said 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.
3. The microelectronic system according to claim 1 further comprising a solder mask on said build-up layer.
4. The microelectronic system according to claim 3 , wherein said solder mask comprises a plurality of solder mask openings for exposing said power ball pads and said ground ball pads, respectively.
5. The microelectronic system according to claim 1 , wherein said laminated core comprises 2 to 8 internal conductive layers.
6. The microelectronic system according to claim 1 , wherein said microvias are laser-drilled microvias and has a via diameter size ranging between 0.05-0.2 mm.
7. The microelectronic system according to claim 1 , wherein said only one ground ball pad is a distal ground ball pad of a ground net.
8. The microelectronic system according to claim 1 , wherein said only one power ball pad is a distal power ball pad of a power net.
9. A microelectronic system, comprising:
a printed circuit board, comprising:
a laminated core comprising at least an internal conductive layer;
a build-up layer on the laminated core, said build-up layer comprising a top conductive layer;
a plurality of microvias in the build-up layer to electrically connect the top conductive layer with the internal conductive layer;
a power net in the top conductive layer, said power net comprising a plurality of power ball pads arranged and interconnected in a comb-shaped pattern; and
a ground net disposed being in close proximity to said power net and coupled to said power net in an interdigitated fashion, wherein said ground net comprises a plurality of ground ball pads arranged and interconnected in an inverted comb-shaped pattern so that said ground net is interdigitated with said power net; and
a semiconductor package mounted on the printed circuit board.
10. The microelectronic system according to claim 9 , wherein said plurality of power ball pads and said plurality of ground ball pads are arranged in an array with a fixed ball pad pitch.
11. The microelectronic system according to claim 9 , wherein said power ball pads are interconnected together by a first power trace and a second power trace.
12. The microelectronic system according to claim 11 , wherein said first power trace extends along a first direction and said second power trace extends along a second direction, wherein said first direction is perpendicular to said second direction.
13. The microelectronic system according to claim 12 , wherein four to six of said power ball pads are interconnected together along said first direction by said first power trace, and three of said power ball pads are interconnected together along said second direction by said second power trace.
14. The microelectronic system according to claim 12 , wherein said ground ball pads are interconnected together by a first ground trace and a second ground trace.
15. The microelectronic system according to claim 14 , wherein said first ground trace extends along said first direction and said second ground trace extends along said second direction.
16. The microelectronic system according to claim 15 , wherein four to six of said ground ball pads are interconnected together along said first direction by said first ground trace, and three of said ground ball pads are interconnected together along said second direction by said second ground trace.
17. The microelectronic system according to claim 9 , wherein said microvias are laser-drilled microvias and has a via diameter size ranging between 0.05-0.2 mm.
18. The microelectronic system according to claim 17 , wherein said plurality of power ball pads and said plurality of ground ball pads are arranged in an array with a fixed ball pad pitch, and wherein said array comprises a 4-ball pad unit area that is comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads.
19. The microelectronic system according to claim 18 , wherein in said 4-ball pad unit area, only two of the three power ball pads are interconnected to an underlying power plane in said internal conductive layer through respective two of said microvias.
20. The microelectronic system according to claim 18 , wherein in said 4-ball pad unit area, only two of the three ground ball pads are interconnected to an underlying ground plane in said internal conductive layer through respective two of said microvias.
21. A microelectronic system, comprising:
a printed circuit board, comprising
a laminated core comprising at least an internal conductive layer;
a build-up layer on the laminated core, said build-up layer comprising a top conductive layer;
a plurality of microvias in the build-up layer to electrically connect the top conductive layer with the internal conductive layer;
a power net in the top conductive layer, said power net comprising a plurality of power ball pads arranged in cascade; and
a ground net disposed being in close proximity to said power net and coupled to said power net in an interdigitated fashion, wherein said ground net comprises a plurality of ground ball pads arranged in cascade; and
a semiconductor package mounted on the printed circuit board.
22. The microelectronic system according to claim 21 , wherein said plurality of power ball pads and said plurality of ground ball pads are arranged in an array with a fixed ball pad pitch.