Process flow for manufacturing semiconductor on insulator structures in parallel

1. A method of preparing a plurality of multilayer structures, the method comprising:

(a) providing an initial bonded structure, the initial bonded structure comprising an initial single crystal semiconductor handle substrate, an initial dielectric layer in contact with a front surface of the initial single crystal semiconductor handle substrate, and an initial single crystal semiconductor donor substrate in contact with the initial dielectric layer, wherein the initial single crystal semiconductor donor substrate has a minimum bulk region resistivity of at least about 500 ohm-cm and further wherein the initial single crystal semiconductor donor substrate comprises an initial cleave plane;

(b) mechanically cleaving the initial bonded structure at the initial cleave plane to thereby prepare an initial cleaved structure and a second single crystal semiconductor handle substrate, wherein the initial cleaved structure comprises the initial single crystal semiconductor handle substrate, the initial dielectric layer in contact with the front surface of the initial single crystal semiconductor handle substrate, and a first single crystal semiconductor device layer in contact with the initial dielectric layer, wherein the first single crystal semiconductor device layer has a minimum bulk region resistivity of at least about 500 ohm-cm and has a roughened front surface having a surface roughness of at least about 0.1 micrometers as measured according to the root mean square method over a surface area of at least 30 micrometers by 30 micrometers, and further wherein the second single crystal semiconductor handle substrate has a minimum bulk region resistivity of at least about 500 ohm-cm and has a roughened front surface having a surface roughness of at least about 0.1 micrometers as measured according to the root mean square method over a surface area of at least 30 micrometers by 30 micrometers;

(c) depositing a first charge trapping layer on the roughened front surface of the first single crystal semiconductor device layer of the initial cleaved structure, the first charge trapping layer comprising polycrystalline silicon, the polycrystalline silicon comprising grains having a plurality of crystal orientations;

(d) bonding a first dielectric layer on a front surface of a first single crystal semiconductor donor substrate to the first charge trapping layer on the roughened front surface of the first single crystal semiconductor device layer of the initial cleaved structure to thereby prepare a first multilayer structure, the first multilayer structure comprising the initial single crystal semiconductor handle substrate, the initial dielectric layer in contact with the front surface of the initial single crystal semiconductor handle substrate, the first single crystal semiconductor device layer in contact with the initial dielectric layer, the first charge trapping layer in contact with the roughened front surface of the first single crystal semiconductor device layer, the first dielectric layer in contact with the first charge trapping layer, and the first single crystal semiconductor donor substrate in contact with the first dielectric layer;

(e) depositing a second charge trapping layer on the roughened front surface of the second single crystal semiconductor handle substrate, the second charge trapping layer comprising polycrystalline silicon, the polycrystalline silicon comprising grains having a plurality of crystal orientations; and

(f) bonding a second dielectric layer on a front surface of a second single crystal semiconductor donor substrate to the second charge trapping layer on the roughened front surface of the second single crystal semiconductor handle substrate to thereby prepare a second multilayer structure, the second multilayer structure comprising the second single crystal semiconductor handle substrate, the second charge trapping layer in contact with the roughened front surface of the second single crystal semiconductor handle substrate, the second dielectric layer in contact with the second charge trapping layer, and the second single crystal semiconductor donor substrate in contact with the second dielectric layer.

2. The method of claim 1 wherein the surface roughness of the roughened front surface of the first single crystal semiconductor device layer is between about 0.1 micrometer and about 1 micrometer as measured according to the root mean square method over a surface area of at least 30 micrometers by 30 micrometers.

3. The method of claim 1 wherein the surface roughness of the roughened front surface of the second single crystal semiconductor handle substrate is between about 0.1 micrometer and about 1 micrometer as measured according to the root mean square method over a surface area of at least 30 micrometers by 30 micrometers.

4. The method of claim 1 wherein the plurality of crystal orientations of the polycrystalline silicon of the first charge trapping layer and the second charge trapping layer comprise at least two orientations selected from the group consisting of (111), (100), and (110).

5. The method of claim 1 further comprising heating the first multilayer structure at a temperature and for a duration sufficient to strengthen the bond between the first charge trapping layer in contact with the roughened front surface of the first single crystal semiconductor device layer and the first dielectric layer in contact with the first single crystal semiconductor donor substrate.

6. The method of claim 5 wherein the first single crystal semiconductor donor substrate comprises an ion implanted damage layer.

7. The method of claim 6 further comprising mechanically cleaving the first multilayer structure at the ion implanted damage layer of the first single crystal semiconductor donor substrate to thereby prepare a first cleaved structure comprising the initial single crystal semiconductor handle substrate, the initial dielectric layer in contact with the front surface of the initial single crystal semiconductor handle substrate, the first single crystal semiconductor device layer in contact with the initial dielectric layer, the first charge trapping layer in contact with the roughened front surface of the first single crystal semiconductor device layer, the first dielectric layer in contact with the first charge trapping layer, and a first single crystal semiconductor device layer.

8. The method of claim 1 further comprising heating the second multilayer structure at a temperature and for a duration sufficient to strengthen the bond between the second charge trapping layer in contact with the roughened front surface of the second single crystal semiconductor handle substrate and the second dielectric layer in contact with the second single crystal semiconductor donor substrate.

9. The method of claim 8 wherein the second single crystal semiconductor donor substrate comprises an ion implanted damage layer.

10. The method of claim 9 further comprising mechanically cleaving the second multilayer structure at the ion implanted damage layer of the second single crystal semiconductor donor substrate to thereby prepare a second cleaved structure comprising the second single crystal semiconductor handle substrate, the second charge trapping layer in contact with the roughened front surface of the second single crystal semiconductor handle substrate, the second dielectric layer in contact with the second charge trapping layer, and a second single crystal semiconductor device layer.

11. A multilayer structure comprising:

a single crystal semiconductor handle substrate comprising two major, generally parallel surfaces, one of which is a front surface of the single crystal semiconductor handle substrate and the other of which is a back surface of the single crystal semiconductor handle substrate, a circumferential edge joining the front and back surfaces of the single crystal semiconductor handle substrate, a central plane between the front surface and the back surface of the single crystal semiconductor handle substrate, and a bulk region between the front and back surfaces of the single crystal semiconductor handle substrate;

a handle dielectric layer in interfacial contact with the front surface of the single crystal semiconductor handle substrate;

a high resistivity single crystal semiconductor layer in interfacial contact with the dielectric layer, wherein the high resistivity single crystal semiconductor layer has a minimum bulk resistivity of at least about 500 ohm-cm and further comprises a roughened front surface having a surface roughness of at least about 0.1 micrometers as measured according to the root mean square method over a surface area of at least 30 micrometers by 30 micrometers;

a charge trapping layer in interfacial contact with the roughened front surface of the high resistivity single crystal semiconductor layer, the charge trapping layer comprising polycrystalline silicon, the polycrystalline silicon comprising grains having a plurality of crystal orientations;

a donor dielectric layer in interfacial contact with the charge trapping layer, and a single crystal semiconductor donor layer in interfacial contact with the donor dielectric layer.

12. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer comprises silicon.

13. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer comprises a silicon wafer sliced from a single crystal silicon ingot grown by the Czochralski method or the float zone method.

14. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer has a bulk resistivity between about 500 Ohm-cm and about 100,000 Ohm-cm.

15. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer has a bulk resistivity between about 1000 Ohm-cm and about 100,000 Ohm-cm.

16. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer has a bulk resistivity between about 1000 ohm cm and about 10,000 Ohm-cm.

17. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer has a bulk resistivity between about 2000 Ohm cm and about 10,000 Ohm-cm.

18. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer has a bulk resistivity between about 3000 Ohm-cm and about 10,000 Ohm-cm.

19. The multilayer structure of claim 11 wherein the high resistivity single crystal semiconductor layer has a bulk resistivity between about 3000 Ohm cm and about 5,000 Ohm-cm.

20. The multilayer structure of claim 11 wherein the surface roughness of the roughened front surface of the high resistivity single crystal semiconductor layer substrate is between about 0.1 micrometer and about 1 micrometer as measured according to the root mean square method over a surface area of at least 30 micrometers by 30 micrometers.

21. The multilayer structure of claim 11 wherein the plurality of crystal orientations of the polycrystalline silicon comprising grains comprise at least two orientations selected from the group consisting of (111), (100), and (110).

22. The multilayer structure of claim 11 wherein each of the handle dielectric layer and the donor dielectric layer independently comprises a material selected from the group consisting of silicon dioxide, silicon nitride, hafnium oxide, titanium oxide, zirconium oxide, lanthanum oxide, barium oxide, and a combination thereof.

23. The multilayer structure of claim 11 wherein both of the handle dielectric layer and the donor dielectric layer comprise a buried oxide layer having a thickness of at least about 10 nanometer thick, such as between about 10 nanometers and about 10,000 nanometers, between about 10 nanometers and about 5,000 nanometers, or between about 100 nanometers and about 400 nanometers.