Circuit substrate and method of manufacturing same

1. A circuit substrate, comprising:

a first substrate body made of a flexible wiring substrate and having a first edge and a second edge opposite to the first edge, the first substrate body having a bottomed or bottomless recess adjacent to the first edge;

a plate-shaped or frame-shaped reinforcement member disposed in said recess of the first substrate body adjacent to the first edge;

a pair of resin layers sandwiching the reinforcement member in said recess and a portion of the first substrate body adjacent to the reinforcement member including the first edge, each of the resin layers having a circuit portion formed thereon electrically connected to the flexible wiring substrate.

2. The circuit substrate according to claim 1 ,

wherein a planar shape of the first substrate body surrounds said recess and is generally rectangular, and

wherein the reinforcement member is made of a rectangular plate that has a vertical trench or cavity therein.

3. The circuit substrate according to claim 2 , wherein said recess of the first substrate body includes an electronic component embedded therein sandwiched by said pair of resin layers.

4. The circuit substrate according to claim 3 , further comprising a first insulating material filled into the vertical trench or cavity of the reinforcement member,

wherein the first insulating material has a lower thermal expansion coefficient and higher elasticity than a resin material forming the resin layers.

5. The circuit substrate according to claim 4 , further comprising a second insulating material inside said recess between the reinforcement member and a sidewall of said recess at least on a side opposite to the first edge, and

wherein the second insulating material is made of a material having a lower elasticity than the resin material forming the resin layers.

6. The circuit substrate according to claim 5 , wherein the first insulating material and the second insulating material are both disposed relatively on said side opposite to the first edge in said recess of the first substrate body.

7. The circuit substrate according to claim 3 , further comprising an insulating layer on at least one surface of the reinforcement member, and a wiring layer on the insulating layer, the wiring layer being electrically connected to the electronic component and the circuit portion.

8. The circuit substrate according to claim 1 , further comprising a control substrate physically and electrically connected to the second edge of the flexible wiring substrate.

9. The circuit substrate according to claim 1 , further comprising an insulating layer on at least one surface of the reinforcement member, and a wiring layer on the insulating layer, the wiring layer being electrically connected to the circuit portion,

wherein said recess of the first substrate body does not include an electronic component therein.

10. The circuit substrate according to claim 1 , wherein the plate-shaped or frame-shaped reinforcement member is made of metal.

11. A method of manufacturing a circuit substrate, comprising:

preparing a first substrate body made of a flexible wiring substrate and having a first edge and a second edge opposite to the first edge;

forming a bottomed or bottomless recess in the first substrate body adjacent to the first edge;

placing a plate-shaped or frame-shaped reinforcement member in the recess of the first substrate body adjacent to the first edge;

forming a pair of resin layers sandwiching the reinforcement member in said recess and a portion of the first substrate body adjacent to the reinforcement member including the first edge; and

forming a circuit portion on each of the resin layers that electrically connects to the flexible wiring substrate.

12. The method according to claim 11 , wherein the plate-shaped or frame-shaped reinforcement member is made of metal.