Inverter power module packaging with cold plate
A heat sink is provided. The heat sink includes a single-piece housing having a floor and two walls, the walls perpendicular to the floor and the walls are parallel to each other. The heat sink includes the housing having an inlet and an outlet. The housing is configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls. The housing is configured to cool the power modules in response to fluid flow into the inlet.
1. A method of cooling a three-sided power module, the method comprising:
providing a heat sink attached to a three-sided power module;
flowing a coolant into an inlet of the heat sink;
directing a primary flow of the coolant to cool a middle section of the three-sided power module;
splitting the primary flow into a first secondary flow and a second secondary flow;
directing the first secondary flow to cool a first side-section of the three-sided power module, wherein the first side-section is adjacent to the middle section and oriented at a first nonzero angle thereto, and the first secondary flow exits the first side-section via a first outlet;
directing the second secondary flow to cool a second side-section of the three-sided power module, wherein the second side-section is adjacent to the middle section and oriented at a second nonzero angle thereto, and the second secondary flow exits the second side-section via a second outlet, and
cooling a driver module via the primary flow, the first secondary flow and the second secondary flow, the driver module coupled to the three-sided power module, the driver module nested in a hollow of the heat sink, the driver module partially surrounded by the three-sided power module.
2. The method of claim 1 , wherein the power module is included within a vehicle.
3. The method of claim 1 , further comprising:
contacting pin fins extending into interior sections with the fluid flow.
4. The method of claim 1 , further comprising:
guiding flow through separators extending into interior sections of the heat sink.
5. The method of claim 1 , wherein the heat sink is a monolithic structure.
6. The method of claim 1 , wherein the first nonzero angle and the second nonzero angle are 90 degrees.
7. The method of claim 1 , further comprising: mounting further components within the hollow of the heat sink.
8. The method of claim 1 , further comprising: providing brackets extending into the hollow of the heat sink.
9. The method of claim 1 , wherein a surface of power devices mounted on a printed circuit board of the power module are closer to a surface of the heat sink than surfaces of the printed circuit board.