Solid-state imaging apparatus
A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.
1. An imaging device comprising;
a lens;
an image sensor that converts light incident through the lens;
a substrate;
a connection portion sealed by a sealing member;
an optical filter disposed over the image sensor; and
a light shielding member that shields part of the light incident from the lens;
wherein,
the connection portion is configured to electrically connect the image sensor to the substrate,
a portion of the light shielding member is disposed at a surface of the optical filter facing the lens,
the light shielding member defines an opening,
a first end of the opening facing the image sensor has a first size that is greater than a second size of a second end of the opening facing the lens, and
a side surface of the light shielding member that defines the opening forms an angle with respect to an optical axis direction of the lens.
2. The imaging device according to claim 1 , wherein a virtual extension surface of the side surface of the light shielding member does not intersect the substrate.
3. The imaging device according to claim 1 , wherein a virtual extension surface of the side surface of the light shielding member does not intersect the sealing member.
4. The imaging device according to claim 1 , wherein the sealing member comprises a resin.
5. The imaging device according to claim 1 , wherein a light receiving surface of the image sensor is exposed in a cavity.
6. The imaging device according to claim 1 , further comprising a cavity disposed between the image sensor and the optical filter.
7. The imaging device according to claim 1 , wherein the connection portion is electrically connected to a peripheral portion of the image sensor.
8. The imaging device according to claim 7 , wherein the connection portion is electrically connected to a peripheral portion of the substrate.
9. The imaging device according to claim 1 , wherein the connection portion is electrically connected to a portion of a light receiving surface of the image sensor.
10. The imaging device according to claim 1 , wherein the connection portion is electrically connected to a peripheral portion of a light receiving surface of the image sensor.
11. The imaging device according to claim 1 , wherein the optical filter is an infrared ray cut filter.
12. An imaging apparatus comprising;
an imaging device, including:
a lens;
an image sensor that converts light incident through the lens;
a substrate;
a connection portion sealed by a sealing member;
an optical filter disposed over the image sensor; and
a light shielding member that shields part of the light incident from the lens;
wherein,
the connection portion is configured to electrically connect the image sensor to the substrate,
a portion of the light shielding member is attached to the optical filter facing the image sensor,
the light shielding member has an opening,
a first end of the opening facing the image sensor has a first size that is greater than a second size of a second end of the opening facing the lens, and
a portion of a side surface of the light shielding member that defines an opening forms an angle with respect to an optical axis direction of the lens.
13. The imaging apparatus according to claim 12 , wherein the portion of the side surface is disposed below the optical filter.
14. The imaging apparatus according to claim 12 , wherein a virtual extension surface of the portion of the side surface of the light shielding member does not intersect the substrate.
15. The imaging apparatus according to claim 12 , wherein a virtual extension surface of the portion of the side surface of the light shielding member does not intersect the sealing member.
16. The imaging apparatus according to claim 12 , wherein the sealing member comprises a resin.
17. The imaging apparatus according to claim 12 , wherein a light receiving surface of the image sensor is exposed in a cavity.
18. The imaging apparatus according to claim 12 , further comprising a cavity disposed between the image sensor and the optical filter.
19. The imaging apparatus according to claim 12 , wherein the connection portion is electrically connected to a peripheral portion of the image sensor.
20. The imaging apparatus according to claim 19 , wherein the connection portion is electrically connected to a peripheral portion of the substrate.
21. The imaging apparatus according to claim 12 , wherein the connection portion is electrically connected to a portion of a light receiving surface of the image sensor.
22. The imaging apparatus according to claim 12 , wherein the connection portion is electrically connected to a peripheral portion of a light receiving surface of the image sensor.
23. The imaging apparatus according to claim 12 , wherein the optical filter is an infrared ray cut filter.