Secure chips with serial numbers
An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.
1. An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip:
wherein the semiconductor chip is a member of a set of semiconductor chips, wherein the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets;
wherein the plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset are different from the non-common structures of the semiconductor chips in every other subset;
wherein at least a first portion of the non-common structures and a first portion of the common structures are interconnected to form a first non-common circuit, and wherein the first non-common circuit of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset; and
wherein at least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit.
2. The electronic device according to claim 1 , wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means, such as by automated electromagnetic, optical, or electronic reading means.
3. The electronic device according to claim 1 , wherein the first predetermined value is readable from the structure of the second portion of the non-common structures and/or wherein the shape of the second portion of the non-common structures stores the first predetermined value.
4. The electronic device according to claim 1 , wherein a second non-common circuit is formed from the second portion of the non-common structures of the semiconductor chip and a second portion of the common structures of the semiconductor chip, and wherein the second non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset.
5. The electronic device according to claim 4 , wherein the second non-common circuit comprises at least one of:
a read-only memory circuit which is fabricated with the first predetermined value pre-stored in the read-only memory circuit;
a logic circuit, wherein the logic circuit is adapted to generate the first predetermined value.
6. The electronic device according to claim 1 , wherein the set of non-common structures of the semiconductor chip is different from the set of non-common structures of every other semiconductor chip of the set of the semiconductor chips.
7. The electronic device according to claim 1 , wherein the first non-common circuit comprises at least one of:
a logic circuit which is adapted to generate a second predetermined value in response to an input;
a read-only memory circuit which is fabricated with a second predetermined value pre-stored in the first non-common circuit.
8. The electronic device according to claim 4 , wherein the electronic device comprises at least one input terminal and at least one output terminal, and the second non-common circuit is connected to the input and output terminals, and wherein first predetermined value is electronically readable from the output terminal.
9. The electronic device according to claim 1 , wherein the electronic device comprises at least one input terminal for receiving a challenge and at least one output terminal for outputting a response, and the first non-common circuit forms a challenge-response circuit connected to the at least one input terminal and the at least one output terminal,
wherein the challenge-response circuit is adapted for generating a response at the at least one output terminal based on a challenge applied to the at least one input terminal, the challenge and the response having a predetermined relationship.
10. The electronic device according to claim 9 , wherein the response generated by the challenge-response circuit depends on both the challenge applied to the at least one input terminal and the first predetermined value.
11. The electronic device according to claim 1 , wherein the plurality of structures are formed on three or more layers of the semiconductor chip, including one or more non-common layers containing the non-common structures, and at least one common layer above the one or more non-common layers, the at least one common layer containing common structures but no non-common structures.
12. The electronic device according to claim 11 , wherein all of the non-common structures are formed in only one layer of the semiconductor chip.
13. The electronic device according to claim 11 , wherein the semiconductor chip comprises at least a second common layer below the one or more common layers, the second common layer containing common structures but no non-common structures.
14. The electronic device according to claim 1 , wherein the plurality of structures are formed in a plurality of layers of the semiconductor chip, and the non-common structures include at least one of: connections between metal layers of the plurality of layers; connections between a metal layer and a gate in a contact layer of the plurality of layers; connections in a local interconnect layer of the plurality of layers; and a P- or N-doped diffusion region of a transistor or diode of one of the plurality of layers.
15. The electronic device according to claim 11 , wherein the non-common structures of the one or more common layers are formed using a charged particle multi-beamlet lithography system, and the common layers are formed using a mask-based lithography process.
16. The electronic device according to claim 15 , wherein the set of non-common structures are formed based on chip design data originating from a unique data generator.
17. The electronic device according to claim 1 , wherein the set of semiconductor chips are all formed from a single wafer.
18. A system for authentication between a plurality of remote terminals and a host system based on a challenge-response procedure, wherein each of the remote terminals comprises an electronic device according to claim 1 .
19. A remote terminal adapted for use in a system according to claim 18 .
20. A method for authentication in a system according to claim 18 , the method comprising distributing the remote terminals to a plurality of users, sending a challenge from the host system to one of the remote terminals, receiving a response from the remote terminal, and authenticating the remote terminal if the response has to predetermined relationship with the challenge.