Thermoelectric conversion element and thermoelectric conversion module
The present invention has a first substrate having a high thermal conduction portion which has a thermal conductivity higher than that of other regions in a plane direction, a thermoelectric conversion layer which is formed on the first substrate, consists of an organic material, and has a thermoelectric conversion material having a positive Seebeck coefficient, a second substrate which is formed on the thermoelectric conversion layer and has a high thermal conduction portion having a thermal conductivity higher than that of other regions in the plane direction and in which the high thermal conduction portion does not completely overlap the high thermal conduction portion of the first substrate in the plane direction, and a pair of electrodes which are connected to the thermoelectric conversion layer and consist of a metal material having a negative Seebeck coefficient. As a result, there are provided a thermoelectric conversion element and a thermoelectric conversion module which can generate heat with excellent efficiency by using a thermoelectric conversion material consisting of an organic material.
1. A thermoelectric conversion element comprising:
a first substrate having a high thermal conduction portion, which has a thermal conductivity higher than that of other regions, in at least a portion in a plane direction;
a thermoelectric conversion layer which is formed on the first substrate, consists of an organic material, and has a positive Seebeck coefficient;
a second substrate which is formed on the thermoelectric conversion layer and has a high thermal conduction portion having a thermal conductivity higher than that of other regions of the second substrate in at least a portion in the plane direction and in which the high thermal conduction portion does not completely overlap the high thermal conduction portion of the first substrate in the plane direction; and
a pair of electrodes which are connected to the thermoelectric conversion layer such that the thermoelectric conversion layer is interposed between the electrodes in the plane direction;
wherein both electrodes of the pair of electrodes comprise a metal material having a negative Seebeck coefficient.
2. The thermoelectric conversion element according to claim 1 ,
wherein each of the pair of electrodes covers a portion of an upper surface of the thermoelectric conversion layer in the plane direction.
3. The thermoelectric conversion element according to claim 1 ,
wherein each of the pair of electrodes has a connection portion, which connects to the thermoelectric conversion layer and consists of a material having an electric conductivity higher than that of the metal material constituting the electrode.
4. The thermoelectric conversion element according to claim 3 ,
wherein the electrodes and the thermoelectric conversion layer are directly connected to each other and connected to the connection portion as well.
5. The thermoelectric conversion element according to claim 1 , further comprising:
an adhesive layer between the first substrate and the pair of electrodes.
6. The thermoelectric conversion element according to claim 1 , further comprising:
an insulating inorganic oxide film or silicon nitride film that covers the thermoelectric conversion layer and the pair of electrodes.
7. The thermoelectric conversion element according to claim 1 ,
wherein an end face of the thermoelectric conversion layer in the plane direction has a tapered shape.
8. The thermoelectric conversion element according to claim 1 ,
wherein the thermoelectric conversion layer contains carbon nanotubes.
9. The thermoelectric conversion element according to claim 1 ,
wherein the metal material having a negative Seebeck coefficient is Ni or a Ni alloy.
10. A thermoelectric conversion module comprising:
a plurality of the thermoelectric conversion elements according to claim 1 that is connected to each other in series.
11. The thermoelectric conversion module according to claim 10 , further comprising:
a heat dissipating fin contacting the high thermal conduction portion of any one of the first and second substrates.
12. The thermoelectric conversion module according to claim 11 ,
wherein the heat dissipating fin and the high thermal conduction portion are bonded to each other by a thermally conductive adhesive sheet or a thermally conductive adhesive.