Electronic component including a resistive layer
An electronic component includes a laminate including dielectric layers and internal electrode layers stacked in a lamination direction. A first external electrode is on a first end surface of the laminate, and connected with a first of the internal electrode layers. A second external electrode is on a second end surface of the laminate, and connected with a second of the internal electrode layers. The first external electrode includes a first metallic layer connected to the first internal electrode layer, and a second metallic layer disposed on the first metallic layer. The first metallic layer has a higher specific resistance than the second metallic layer, and a difference between a thickness of an outermost portion of the first metallic layer in the lamination direction and a thickness of a center portion of the first metallic layer in a center in the lamination direction is about 5 μm or less.
1. An electronic component comprising:
a laminate including a plurality of dielectric layers and a plurality of internal electrode layers disposed in a lamination direction, the laminate including a first principal surface and a second principal surface opposite to each other in the lamination direction, a first lateral surface and a second lateral surface opposite to each other in a width direction perpendicular or substantially perpendicular to the lamination direction, and a first end surface and a second end surface opposite to each other in a length direction perpendicular or substantially perpendicular to the lamination direction and the width direction;
a first external electrode disposed on the first end surface of the laminate, and connected with a first of the internal electrode layers; and
a second external electrode disposed on the second end surface of the laminate, and connected with a second of the internal electrode layers; wherein
the first external electrode includes a first metallic layer that includes glass and is connected with the first of the internal electrode layers, and a second metallic layer that is a baked layer and is disposed on the first metallic layer;
the first metallic layer has a higher specific resistance than the second metallic layer;
a difference between a thickness of an outermost portion of the first metallic layer which is a thickness of the first metallic layer on an outermost internal electrode layer disposed on an outermost side in the lamination direction among the internal electrode layers, and a thickness of a center portion of the first metallic layer which is a thickness of the first metallic layer in a center in the lamination direction being about 5 μm or less; and
a difference between a thickness of an outermost portion of the second metallic layer which is a thickness of the second metallic layer on the outermost internal electrode layer disposed on the outermost side in the lamination direction among the internal electrode layers, and a thickness of a center portion of the second metallic layer which is a thickness of the second metallic layer in the center in the lamination direction is larger than the difference between the thickness of the outermost portion of the first metallic layer on the outermost internal electrode layer and the thickness of the center portion of the first metallic layer.
2. The electronic component according to claim 1 , wherein the first metallic layer includes at least one compound selected from a group consisting of metal, a metal oxide, and glass.
3. The electronic component according to claim 2 , wherein the metal comprises at least one metal selected from a group consisting of Ag, Ni, Cu, Au and Pd.
4. The electronic component according to claim 2 , wherein the metal oxide includes at least one compound selected from a group consisting of indium tin oxide, alumina and zirconia.
5. The electronic component according to claim 1 , wherein the metal defining the second metallic layer is Cu.
6. The electronic component according to claim 1 , further comprising a plating layer provided in direct contact with the second metallic layer.
7. The electronic component according to claim 6 , wherein the plating layer encapsulates both of the first metallic layer and second metallic layer while contacting each of the first principal surface, the second principal surface, the first lateral surface, and the second lateral surface.
8. The electronic component according to claim 6 , wherein
the first metallic layer contacts only one of the first end surface and the second end surface; and
the second metallic layer contacts one of the first end surface and the second end surface while also contacting each of the first principal surface, the second principal surface, the first lateral surface, and the second lateral surface.
9. The electronic component according to claim 1 , further comprising:
a third external electrode disposed on one of the first lateral surface and the second lateral surface; and
a fourth external electrode disposed on another one of the first lateral surface and the second lateral surface.
10. The electronic component according to claim 9 , wherein
some of the internal electrode layers are electrically connected between the first external electrode and the second external electrode; and
other ones of the internal electrode layers are electrically connected between the third external electrode and the fourth external electrode.
11. The electronic component according to claim 10 , wherein
the some of the internal electrode layers extend in the length direction; and
the other ones of the internal electrode layers include projection portions extending in both the length direction and the width direction.